公开(公告)号：DE102010037292A1

公开(公告)日：2011-04-21

申请号：DE102010037292

申请日：2010-09-02

Applicant: INFINEON TECHNOLOGIES AG

Inventor： MEYER THORSTEN ,  BAHR ANDREAS

IPC: H01L23/50 ,  H01L21/60

公开(公告)号：DE102010015930A1

公开(公告)日：2010-09-23

申请号：DE102010015930

申请日：2010-03-11

Applicant: INFINEON TECHNOLOGIES AG

Inventor： MEYER THORSTEN ,  DECKER STEFAN ,  KRISCHKE NORBERT ,  KADOW CHRISTOPH

IPC: H01L27/07 ,  H01L21/8234 ,  H01L23/62 ,  H01L27/088 ,  H01L29/06

公开(公告)号：DE102009015722A1

公开(公告)日：2009-10-29

申请号：DE102009015722

申请日：2009-03-31

Applicant: INFINEON TECHNOLOGIES AG

Inventor： KROENINGER WERNER ,  SCHWAIGER JOSEF ,  SCHNEIDER LUDWIG ,  GEITNER OTTMAR ,  BRUNNBAUER MARKUS ,  MEYER THORSTEN ,  OTREMBA RALF ,  HOEGLAUER JOSEF ,  STRACK HELMUT ,  SCHLOEGEL XAVER

IPC: H01L21/77 ,  H01L21/56 ,  H01L23/31

Abstract: A semiconductor module. One embodiment provides at least two semiconductor chips placed on a carrier. The at least two semiconductor chips are then covered with a molding material to form a molded body. The molded body is thinned until the at least two semiconductor chips are exposed. Then, the carrier is removed from the at least two semiconductor chips. The at least two semiconductor chips are singulated.

公开(公告)号：DE102008050972A1

公开(公告)日：2009-04-23

申请号：DE102008050972

申请日：2008-10-09

Applicant: INFINEON TECHNOLOGIES AG

Inventor： MEYER THORSTEN ,  BRUNNBAUER MARKUS ,  POHL JENS

IPC: H01L21/50 ,  H01L23/28 ,  H01L25/04 ,  H01L25/16

Abstract: A method for fabricating a device, a semiconductor chip package, and a semiconductor chip assembly is disclosed. One embodiment includes applying at least one semiconductor chip on a first form element. At least one element is applied on a second form element. A material is applied on the at least one semiconductor chip and on the at least one element.

公开(公告)号：DE102008045735A1

公开(公告)日：2009-04-09

申请号：DE102008045735

申请日：2008-09-04

Applicant: INFINEON TECHNOLOGIES AG

Inventor： BRUNNBAUER MARKUS ,  SEZI RECAI ,  MEYER THORSTEN ,  BEER GOTTFRIED

IPC: H01L25/04 ,  H01L21/58 ,  H01L21/98 ,  H01L23/14

Abstract: Stacked semiconductor chips are disclosed. One embodiment provides a method including a first substrate having a first surface and an opposing second surface. The first substrate includes an array of first connection elements on the first surface of the first substrate. A second substrate has a first surface and an opposing second surface. The second substrate includes an array of second connection elements on the first surface of the second substrate. The first connection elements is attached to the second connection elements; and is thinning at least one of the first substrate and the second substrate after the attachment of the first connection elements to the second connection elements.

公开(公告)号：DE102007020656A1

公开(公告)日：2008-11-06

申请号：DE102007020656

申请日：2007-04-30

Applicant: INFINEON TECHNOLOGIES AG

Inventor： BRUNNBAUER MARKUS ,  MEYER THORSTEN ,  BRADL STEPHAN ,  PLIENINGER RALF ,  POHL JENS ,  PRESSEL KLAUS ,  SEZI RECAI

IPC: H01L21/58

公开(公告)号：DE102007012155A1

公开(公告)日：2008-09-25

申请号：DE102007012155

申请日：2007-03-12

Applicant: INFINEON TECHNOLOGIES AG

Inventor： MEYER THORSTEN ,  BRUNNBAUER MARKUS

IPC: H01L23/28 ,  H01L21/50

Abstract: A panel with a reconfigured wafer including semiconductor chips arranged in rows and columns on semiconductor device positions includes: at least one semiconductor chip having a front, a rear and edge sides provided per semiconductor device position. The reconfigured wafer includes: a front side that forms a coplanar area with the front sides of the at least one semiconductor chip and a plastic housing composition embedding the edge sides and the rear side of the at least one semiconductor chip. The reconfigured wafer includes, on a rear side of the wafer, structures configured to stabilize the panel. The structures are composed of the plastic housing composition and are formed as thickenings of the reconfigured wafer.

公开(公告)号：DE102006019244B4

公开(公告)日：2008-07-03

申请号：DE102006019244

申请日：2006-04-21

Applicant: INFINEON TECHNOLOGIES AG

Inventor： MEYER THORSTEN ,  BRUNNBAUER MARKUS ,  FUERGUT EDWARD

IPC: H01L21/50 ,  H01L23/28 ,  H01L23/498 ,  H01L23/50

Abstract: A panel and a semiconductor device, in one embodiment composed of a composite plate with semiconductor chips and plastic housing composition and to a method for producing the same is disclosed. The embodiments include a wiring structure with interconnects and dielectric layers composed of a low-k dielectric is arranged on the top side of the composite plate.

公开(公告)号：DE102004063991A1

公开(公告)日：2008-05-08

申请号：DE102004063991

申请日：2004-10-29

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HIRLER FRANZ ,  WAHL UWE ,  MEYER THORSTEN ,  RUEB MICHAEL ,  WILLMEROTH ARMIN ,  SCHMITT MARKUS ,  TOLKSDORF CAROLIN ,  SCHAEFFER CARSTEN

IPC: H01L21/336 ,  H01L29/78

公开(公告)号：DE102006019244A1

公开(公告)日：2007-10-25

申请号：DE102006019244

申请日：2006-04-21

Applicant: INFINEON TECHNOLOGIES AG

Inventor： MEYER THORSTEN ,  BRUNNBAUER MARKUS ,  FUERGUT EDWARD

IPC: H01L21/50 ,  H01L21/56 ,  H01L23/498 ,  H01L23/50

Abstract: A panel and a semiconductor device, in one embodiment composed of a composite plate with semiconductor chips and plastic housing composition and to a method for producing the same is disclosed. The embodiments include a wiring structure with interconnects and dielectric layers composed of a low-k dielectric is arranged on the top side of the composite plate.