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    EDDY CURRENT BASED MEASUREMENT CAPABILITIES
    13.
    发明专利
    EDDY CURRENT BASED MEASUREMENT CAPABILITIES 未知

    公开(公告)号：AU2003267272A1

    公开(公告)日：2004-04-19

    申请号：AU2003267272

    申请日：2003-09-15

    Applicant: LAM RES CORP

    Inventor： GOTKIS YEHIEL ,  KISTLER RODNEY ,  OWCZARZ ALEKSANDER ,  HEMKER DAVID ,  BRIGHT NICOLAS J

    IPC: G01N27/02 ,  H01L21/302 ,  H01L21/461 ,  G01N27/90

    Abstract: A method and an apparatus for enhancement of the for measuring resistance-based features of a substrate is provided. The apparatus includes a sensor configured to detect a signal produced by a eddy current generated electromagnetic field. The magnetic field enhancing source is positioned to the alternative side of the object under measurement relative to the sensor to enable the sensitivity enhancing action. The sensitivity enhancing source increases the intensity of the eddy current generated in the object under measurement, and as a result the sensitivity of the sensor. A system enabled to determine a thickness of a layer and a method for determining a resistance-based feature characteristic are also provided.

    PROCESS INTEGRATION SCHEME TO LOWER OVERALL DIELECTRIC CONSTANT IN BEOL INTERCONNECT STRUCTURES
    15.
    发明专利
    PROCESS INTEGRATION SCHEME TO LOWER OVERALL DIELECTRIC CONSTANT IN BEOL INTERCONNECT STRUCTURES 未知

    公开(公告)号：SG177912A1

    公开(公告)日：2012-02-28

    申请号：SG2011094984

    申请日：2007-12-12

    Applicant: LAM RES CORP

    Inventor： BRIGHT NICOLAS ,  HEMKER DAVID ,  REDEKER FRITZ ,  DORDI YEZDI

    Abstract: PROCESS INTEGRATION SCHEME TO LOWER OVERALL DIELECTRIC CONSTANT IN BEOL INTERCONNECT STRUCTURESAbstractBack-End of Line (BEoL) interconnect structures, and methods for their manufacture, are provided. The structures are characterized by narrower conductive lines and reduced overall dielectric constant values. Conformal diffusion barrier layers, and selectively formed capping layers, are used to isolate the conductive lines and vias from surrounding dielectric layers in the interconnect structures. The methods of the invention employ techniques to narrow the openings in photoresist masks in order to define narrower vias. More narrow vias increase the amount of misalignment that can be tolerated between the vias and the conductive linesFigure: 9B

    17.
    发明专利
    未知

    公开(公告)号：AT425547T

    公开(公告)日：2009-03-15

    申请号：AT02746618

    申请日：2002-06-21

    Applicant: LAM RES CORP

    Inventor： YEN BI-MING ,  NI TUQIANG ,  LI LUMIN ,  HEMKER DAVID

    IPC: H01J37/32 ,  H05H1/46 ,  H01L21/3065

    Abstract: A plasma processing chamber is provided. The plasma processing chamber includes a bottom electrode configured to support a substrate and a top electrode located over the bottom electrode. The plasma processing chamber further includes a plasma confinement assembly designed to transition between a closed orientation and an open orientation. In the closed orientation, the plasma confinement assembly defines a first volume for plasma during processing, and in the open orientation, the plasma confinement assembly defines a second volume for plasma during processing which is larger than the first volume.

    CONTROLLED AMBIENT SYSTEM FOR INTERFACE ENGINEERING
    18.
    发明专利
    CONTROLLED AMBIENT SYSTEM FOR INTERFACE ENGINEERING 未知

    公开(公告)号：SG174750A1

    公开(公告)日：2011-10-28

    申请号：SG2011062171

    申请日：2007-08-28

    Applicant: LAM RES CORP

    Inventor： BOYD JOHN ,  DORDI YEZDI ,  ARUNAGIRI TIRUCHIRAPALLI ,  MOORING BENJAMIN W ,  PARKS JOHN ,  THIE WILLIAM ,  REDEKER FRITZ C ,  HOWALD ARTHUR M ,  SCHOEPP ALAN ,  HEMKER DAVID

    Abstract: OF THE DISCLOSUREA cluster architecture and methods for processing a substrate are disclosed. The cluster architecture includes a lab-ambient controlled transfer module that is coupled to one or more wet substrate processing modules. The lab-ambient controlled transfer module and the one or more wet substrate processing modules are configured to manage a first ambient environment. A vacuum transfer module that is coupled to the lab-ambient controlled transfer module and one or more plasma processing modules is also provided. The vacuum transfer module and the one or more plasma processing modules are configured to manage a second ambient environment And, a controlled ambient transfer module that is coupled to the vacuum transfer module and one or more ambient processing modules is also included. The controlled ambient transfer module and the one or more ambient processing modules are configured to manage a third ambient environment. The cluster architecture therefore enables controlled processing of the substrate in either the first, second or third ambient environments, as well as during associated transitions. The embodiments also provide for efficient methods for filling a trench of a substrate.Figure 1

    20.
    发明专利
    未知

    公开(公告)号：AT394789T

    公开(公告)日：2008-05-15

    申请号：AT00978613

    申请日：2000-11-14

    Applicant: LAM RES CORP

    Inventor： BAILEY ANDREW ,  SCHOEPP ALAN ,  HEMKER DAVID ,  WILCOXSON MARK

    IPC: C23C16/507 ,  H01J37/32 ,  B05D7/24 ,  H01L21/3065

    Abstract: A plasma processing system for processing a substrate, is disclosed. The plasma processing system includes a single chamber, substantially azimuthally symmetric plasma processing chamber within which a plasma is both ignited and sustained for the processing. The plasma processing chamber has no separate plasma generation chamber. The plasma processing chamber has an upper end and a lower end. The plasma processing chamber includes a material that does not substantially react with the reactive gas chemistries that are delivered into the plasma processing chamber. In addition, the reactant gases that are flown into the plasma processing chamber are disclosed.

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