Positioning method and lithographic apparatus
    21.
    发明专利
    Positioning method and lithographic apparatus 有权
    定位方法和平面设备

    公开(公告)号:JP2006108669A

    公开(公告)日:2006-04-20

    申请号:JP2005285748

    申请日:2005-09-30

    CPC classification number: G03B27/42 G03F9/7084 G03F9/7088

    Abstract: PROBLEM TO BE SOLVED: To provide a positioning method and a lithographic apparatus for aligning rapidly. SOLUTION: One embodiment can be applied to the measurement of the position of a feature in an alignment region on a mask using a sensor. The position of the feature in the alignment region is known from design. The feature whose position has been measured is identified by comparing relative positions between the measured features and the known relative position from design. The position of the mask is obtained by subtracting the known position of the identified feature from the measurement position of the identified feature. COPYRIGHT: (C)2006,JPO&NCIPI

    Abstract translation: 要解决的问题:提供一种用于快速对准的定位方法和光刻设备。 解决方案:一个实施例可以应用于使用传感器测量掩模上的对准区域中的特征的位置。 设计中已知该对准区域中的特征的位置。 测量位置的特征是通过比较测量的特征与已知的设计相对位置之间的相对位置来识别的。 通过从识别的特征的测量位置减去所识别的特征的已知位置来获得掩模的位置。 版权所有(C)2006,JPO&NCIPI

    Lithography apparatus for obtaining imaging on surface side or rear surface side of substrate, substrate identification method, device manufacturing method, substrate, and computer program
    22.
    发明专利
    Lithography apparatus for obtaining imaging on surface side or rear surface side of substrate, substrate identification method, device manufacturing method, substrate, and computer program 有权
    用于在基板的表面侧或后表面上形成图像的基板设备,基板识别方法,设备制造方法,基板和计算机程序

    公开(公告)号:JP2005252281A

    公开(公告)日:2005-09-15

    申请号:JP2005099664

    申请日:2005-03-02

    Abstract: PROBLEM TO BE SOLVED: To provide a method and an apparatus that do not take much time in substrate scanning for substrate lineup and substrate identification to be performed for application treatment selection, and that do not require extra space on a substrate to attach an identification code in the case where a multiple lithography apparatus is used for multilayer IC production. SOLUTION: The positions of a lineup mark P1 and a reference mark P2 on a substrate W, or those of two markers of a circuit form are measured by a sensor MS, and the distance between the two is calculated by an identification unit IU. Then, comparison is made between the calculated values and the predetermined values stored in MEM1 and MEM2 to identify the substrate. Otherwise, a treatment process applied to this substrate is decided, or the lineup values of this system is automatically adjusted, and so on. As the sensor MS can read both sides of the substrate W, these markers can be arranged either on the frontal side or rear side of the substrate W, and the markers can be arranged on a scribe lane as well. In this way, the effective area of the substrate for IC production is not reduced. COPYRIGHT: (C)2005,JPO&NCIPI

    Abstract translation: 要解决的问题:提供一种方法和装置,其不需要花费太多时间在基片扫描中进行基片阵列和基片识别,以进行应用处理选择,并且不需要在基片上附加额外的空间 在将多光刻设备用于多层IC制造的情况下的识别码。 解决方案:通过传感器MS测量衬底W上的阵列标记P1和参考标记P2的位置或电路形式的两个标记的位置,并且通过识别单元计算两者之间的距离 IU。 然后,将所计算的值和存储在MEM1和MEM2中的预定值进行比较,以识别衬底。 否则,决定应用于该基板的处理过程,或者自动调整该系统的阵容值等。 由于传感器MS可以读取基板W的两侧,所以这些标记可以布置在基板W的正面侧或背面上,标记也可以布置在划线上。 以这种方式,IC生产用基板的有效面积不降低。 版权所有(C)2005,JPO&NCIPI

    Method for manufacturing device, device manufactured by the same and mask used in the method
    26.
    发明专利
    Method for manufacturing device, device manufactured by the same and mask used in the method 审中-公开
    制造装置的方法,由其制造的装置和方法中使用的掩模

    公开(公告)号:JP2003059827A

    公开(公告)日:2003-02-28

    申请号:JP2002177248

    申请日:2002-06-18

    Abstract: PROBLEM TO BE SOLVED: To prevent or to alleviate overlay errors or the like caused by a strain, such as deformation or the like of a mark in a lithography apparatus, having a non-telecentric projection system at the article side used in a method for manufacturing a device.
    SOLUTION: The method for manufacturing the device comprises a step of providing a substrate covered with a layer of a radiation-sensitive material, a step of providing a radiation projection beam by using a radiation system, a step of imparting a pattern to a section of the projection beam by using a reflective pattern forming means, and a step of forming an image on the target part of the layer of the radiation sensitive material by projecting the pattern-formed radiation beam, by using the non-telecentric projection system at the article side. The method further comprises the steps of shifting and/or inclining a nominal reflection surface of the pattern forming means, so as to separate from a flat surface of a nominal article of the projection system, and alleviating the strain and/or the overlay error of the projection image.
    COPYRIGHT: (C)2003,JPO

    Abstract translation: 要解决的问题:为了防止或减轻由在光刻设备中的标记的变形等的应变引起的重叠误差等,其在用于方法中的物品侧具有非远心投影系统 制造设备。 解决方案:用于制造该器件的方法包括提供覆盖有辐射敏感材料层的衬底的步骤,通过使用辐射系统提供辐射投影束的步骤,将图案赋予 通过使用反射图案形成装置的投影束,以及通过使用非远心投影系统在物品上投射图案形成的辐射束在辐射敏感材料的层的目标部分上形成图像的步骤 侧。 该方法还包括以下步骤:移动和/或倾斜图案形成装置的标称反射表面,从而与投影系统的标称物品的平坦表面分离,并减轻应变和/或重叠误差 投影图像。

    LITHOGRAPHIC APPARATUS, DEVICE MANUFACTURING METHOD, AND DEVICE MANUFACTURED THEREBY

    公开(公告)号:SG135934A1

    公开(公告)日:2007-10-29

    申请号:SG2003075587

    申请日:2003-12-18

    Abstract: Various novel cleaning processes are disclosed. Previous cleaning processes are global in that they involve infusing oxygen into the whole system and switching on a single radiation source which supplies a cleaning beam of radiation to every optical element in the lithographic apparatus. This can lead to overexposure of some optical elements whilst leaving other optical elements not cleaned to a sufficient amount. This is overcome by providing a system which allows selective ones or groups of the optical elements to be cleaned and which allows a spatially varied cleaning to occur across the surface of an optical element. This can be achieved by only supplying the cleaning beam of radiation to one or some of the optical elements and/or by increasing the local oxygen density in the vicinity of certain optical elements. Spatially resolved cleaning can be achieved using gray filters, which may be dynamically adapted, or by using a steerable electron mean beam.

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