Abstract:
PROBLEM TO BE SOLVED: To provide a method of highly precisely adjusting a measuring optical system of a lithographic apparatus. SOLUTION: In the lithographic apparatus, a substrate table constituted to hold a substrate is movable to transfer the substrate between a substrate measuring position and a substrate processing position. The lithographic apparatus also includes a measuring system constituted to measure at least one aspect or a characteristic of the substrate when the substrate table holds the substrate in the measuring position. The measuring system is constituted to guide at least one measuring beam and/or a field toward the front surface of the substrate. A projection system is constituted to project a patterned radiation beam onto the target of the substrate when the substrate table holds the substrate in the substrate processing position. An adjusting system is constituted to supply adjusting fluid to at least a part of the path of the measuring beam and/or the field of the measuring system to adjust the part of the path. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To vary fluid pressure by accelerating a substrate table and accelerating regulating fluid in a supplying device, in a removing device and/or in the substrate table. SOLUTION: A lithography apparatus comprises the substrate table WT which is formed for holding a substrate W and retains the regulating fluid and a regulation system 100 for regulating the substrate table. The regulation system 100 comprises a pressure damper 104 which is communicated with the regulation system 100 through fluid and controls pressure change of the system 100. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide lithography equipment comprising a gas adjustment structure for providing a gas stream adjusted to a volume extending under a projection system. SOLUTION: This lithography equipment comprises a radiation system, a second support for supporting a first support substrate supporting a patterning device for patterning a radiation beam, a projection system for projecting the patterned beam on the target of the substrate, and an interferometric measurement system for providing an interferometric measurement beam extending along an axis in an elongated volume of gas extending under the projection system. The equipment further comprises a gas adjustment structure for providing the adjusted gas stream in the volume. The gas adjustment structure comprises a plurality of gas guide vanes arranged at the outlet of the structure for guiding the gas stream to the volume. The gas guide vanes are manufactured continuously and arranged to emit the gas stream from the axis of the volume. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To improve or facilitate thermal conditioning of wafers prior to exposure in a lithographic apparatus.SOLUTION: A lithographic apparatus includes a substrate table constructed to hold a substrate; a compartment configured to receive the substrate table; a thermal conditioning unit arranged to receive a substrate to be exposed and thermally condition the substrate; and a transfer system configured for transferring the thermally conditioned substrate to the substrate table. The substrate table and the thermal conditioning unit are arranged inside the compartment of the lithographic apparatus, at least during the transfer of the thermally conditioned substrate from the thermal conditioning unit to the substrate table.
Abstract:
PROBLEM TO BE SOLVED: To provide a lithographic apparatus to which countermeasures are applied for suppressing influence of pressure variation of a conditioning fluid on a substrate table. SOLUTION: This lithographic apparatus is disclosed that projects a pattern from a patterning device onto a substrate. The lithographic apparatus includes a substrate table configured to hold a substrate. The substrate table includes a conditioning system configured to hold a conditioning fluid and to condition the substrate table. The conditioning system includes a pressure damper that is in fluid communication with the conditioning system and suppresses a pressure variation in the conditioning system. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a lithographic apparatus which can perform reliable position measurements. SOLUTION: The lithographic apparatus is comprised of a radiation system for providing a projection beam of radiation, a first support structure for supporting patterning means which serves to pattern the projection beam according to a desired pattern, a second support structure for supporting a substrate, and a projection system for projecting the patterned beam onto a target portion of the substrate. At least one of the first and second support structures is comprised of a planar base, a movable stage for supporting the patterning means or the substrate that can be moved over said planar base, and an actuator for providing said movement of the stage. A lithographic projection apparatus is further comprised of a contactless position measuring device for performing the position measurement of the stage, and a first pump for generating a conditioned gas flow in a volume between the measuring device and said stage for improving the position measurement. The base comprises a plurality of gas channels provided in the base in order to provide a gas flow path of the gas flow through the gas channels in the base. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
A lithographic apparatus includes a radiation system for providing a beam of radiation, and a first support for supporting a patterning device. The patterning device serves to pattern the beam of radiation. The apparatus includes a second support for supporting a substrate, a projection system (5) for projecting the patterned beam onto a target portion of the substrate, and an interferometer measurement system (11) for providing an interferometric measurement beam (10) extending along an axis in an elongated volume (2) of gas extending below the projection system. The apparatus also includes a gas conditioning structure (17) for providing a conditioned gas flow (R) in the volume. The gas conditioning structure includes a plurality of gas guiding vanes (18) disposed at an outlet (19) of the structure for guiding the gas flow to the volume. The gas guiding vanes are shaped continuously and are oriented diverging away from the axis of the volume.