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公开(公告)号:DE102004057759A1
公开(公告)日:2006-06-08
申请号:DE102004057759
申请日:2004-11-30
Applicant: INFINEON TECHNOLOGIES AG
Inventor: NOELSCHER CHRISTOPH , PFORR RAINER , KAMM FRANK-MICHAEL , ZIEBOLD RALF , HENNIG MARIO
Abstract: Reducing critical dimension (CD) variations caused by scattered light in functional structures formed in a photoresist by photolithographic imaging through a mask comprises separating a target layout into two partial layouts, providing two masks (M1, M2) according to the partial layouts, where M1 has a reduced bright-field content; imaging the structures of M1 in the photoresist; and imaging the structures of M2 in the photoresist. Reducing critical dimension (CD) variations caused by scattered light in functional structures formed in a photoresist by photolithographic imaging through a mask, where the structures are arranged according to a target layout in sections of the mask adjacent to bright-field sections, comprises separating the target layout into two partial layouts, providing two masks (M1, M2) according to the partial layouts, where M1 has a reduced bright-field content and M2 has an arrangement of structures that will result in the target layout at the end of the process; imaging the structures of M1 in the photoresist, whereby CD variations in the structures are reduced because of the reduced bright-field content; and imaging the structures of M2 in the photoresist. Independent claims are also included for: (1) mask M1 for carrying out the above process, where the bright-field sections (21) adjacent to the sections (2) with the functional structures (3) are provided with opaque or semitransparent auxiliary sections (31); (2) mask M2 for carrying out the above process, where the structures in M2 are formed by opaque sections in or on a transparent support.
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公开(公告)号:DE102004025203A1
公开(公告)日:2005-12-15
申请号:DE102004025203
申请日:2004-05-22
Applicant: INFINEON TECHNOLOGIES AG
Inventor: VOELKEL LARS , PFORR RAINER , LAESSIG ANTJE , ELIAN KLAUS , HENNIG MARIO , NOELSCHER CHRISTOPH , KOESTLER WOLFRAM
Abstract: Photolithographic production of a photomask by the standard steps of coating the substrate with a photolacquer, heating for solvent removal, illumination, heating and finally developing with a basic medium is such that the photolacquer is coated with an acid at a stage between the solvent removal and the final development step.
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公开(公告)号:DE10310136A1
公开(公告)日:2004-09-16
申请号:DE10310136
申请日:2003-03-07
Applicant: INFINEON TECHNOLOGIES AG
Inventor: DETTMANN WOLFGANG , HENNIG MARIO , PFORR RAINER , KOEHLE RODERICK , HOFSAES MARKUS , THIELE JOERG
Abstract: Structure patterns mutually correlated on masks are projected onto the same photosensitive layer (R) on semiconductor wafer (W) in projection system. The first mask (P) contains opaque structure element (25) on first position so that its position projection onto wafer forms not-exposed region of lacquer in photo-sensitive layer. There is at least one second mask (T), allocated to first mask, with semi-transparent region (23') on second position of second mask, coinciding with first position on first mask, whose image on wafer illuminates at least part of lacquer region in photo-sensitive layer. Independent claims are included for method of producing set of several masks.
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公开(公告)号:DE10160616A1
公开(公告)日:2003-06-05
申请号:DE10160616
申请日:2001-12-11
Applicant: INFINEON TECHNOLOGIES AG
Inventor: PFORR RAINER , KUNKEL GERHARD , HENNIG MARIO , KOEHLE RODERICK , VOIGT INA
Abstract: Phase shift mask (8) comprises a first structure (1) and a second structure (2) arranged as a pair on a quartz support material with a light-impermeable chromium layer surrounding the two structures. The first structure has a phase shift for a light entering the structures which is different by 180 deg from the second structure. An Independent claim is also included for a process for the production of the phase shift mask. Preferred Features: The phase shift mask has a number of regularly arranged pairs of first and second structures. The structure pairs form pairs of trench capacitors on a semiconductor wafer in a storage cell field.
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公开(公告)号:DE10021096A1
公开(公告)日:2001-10-31
申请号:DE10021096
申请日:2000-04-20
Applicant: INFINEON TECHNOLOGIES AG
Inventor: THIELE JOERG , GANS FRITZ , FISCHER WERNER , PFORR RAINER
IPC: G03F1/00
Abstract: The mask consists of an image structure (2) and a dummy structure (3) formed on a transparent carrier material (1). The dummy structure is spaced apart from all image structures (2) and has different transparency and phase rotation from the image structure. The dummy structure is preferably semitransparent. The smallest lateral dimension of the dummy structure is at least half as large as the smallest lateral dimension of the image structure. The semitransparent dummy structure may be optically homogenous.
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公开(公告)号:DE10001119A1
公开(公告)日:2001-07-26
申请号:DE10001119
申请日:2000-01-13
Applicant: INFINEON TECHNOLOGIES AG
Inventor: PFORR RAINER , GANS FRITZ , GRIESINGER UWE
IPC: G03F1/00 , G03F1/14 , H01L21/768
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公开(公告)号:DE19957542A1
公开(公告)日:2001-07-05
申请号:DE19957542
申请日:1999-11-30
Applicant: INFINEON TECHNOLOGIES AG
Inventor: PFORR RAINER , FRIEDRICH CHRISTOPH , HEISSMEIER MICHAEL , MOUKARA MOLELA , GRIESINGER UWE , LUDWIG BURKHARD
IPC: G03F1/30 , G03F1/00 , H01L21/027 , G03F1/14
Abstract: An alternating phase mask having a branched structure containing two opaque segments is described. Two transparent surface segments are disposed on both sides of the segments or the components thereof, respectively. The surface segments are provided with phases that are displaced by 180°±Delta alpha, whereby Delta alpha a is not more than 25°. The surface segments are separated by at least one transparent surface boundary segment whose phase is situated between the phases of the adjacent surface segments.
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公开(公告)号:DE10301475B4
公开(公告)日:2007-10-11
申请号:DE10301475
申请日:2003-01-16
Applicant: INFINEON TECHNOLOGIES AG
Inventor: NOELSCHER CHRISTOPH , ZIEBOLD RALF , PFORR RAINER
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公开(公告)号:DE102006004230A1
公开(公告)日:2007-08-09
申请号:DE102006004230
申请日:2006-01-30
Applicant: INFINEON TECHNOLOGIES AG
Inventor: HENNIG MARIO , PFORR RAINER , UNGER GERD
Abstract: A layout is decomposed into partial patterns. An intermediate mask is drawn for each of the partial patterns. The intermediate masks are used in a mask stepper or scanner progressively for projection again into a common pattern on a test mask. A line width distribution LB(x,y) is determined from the test mask or from a test wafer exposed using the mask, and is converted into a distribution of dose corrections. The transmission T(x,y) of the respective intermediate masks is adapted based upon the calculated dose correction. This can be achieved using additional optical elements which are assigned to the intermediate masks and have shading structure elements, or by laser-induced rear-side introduction of shading elements in the quartz substrate of the intermediate masks themselves.
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公开(公告)号:DE102005003905A1
公开(公告)日:2006-10-12
申请号:DE102005003905
申请日:2005-01-27
Applicant: INFINEON TECHNOLOGIES AG
Inventor: PFORR RAINER , MOUKARA MOLELA , MUELDERS THOMAS , HENNIG MARIO , ZEILER KARSTEN
Abstract: An improvement of the imaging quality with simultaneous transfer of line-space gratings and peripheral structures including a MUX space is achieved using a quadrupole illumination whose poles are formed in elongate fashion and whose longitudinal axes are arranged perpendicular to the orientation of the lines of the line-space grating arranged on a mask. The structure imaging of the line-space grating is improved with regard to contrast, MEEF, and process window, while the geometrical fidelity of the peripheral structure, in particular of the MUX space, is stabilized over a wide depth of field range.
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