公开(公告)号：DE10304775B3

公开(公告)日：2004-10-07

申请号：DE10304775

申请日：2003-02-05

Applicant: INFINEON TECHNOLOGIES AG

Inventor： GOLLER BERND ,  HAGEN ROBERT-CHRISTIAN ,  OFNER GERALD ,  STUEMPFL CHRISTIAN ,  BAUER MICHAEL ,  WOERNER HOLGER

IPC: B01L3/00 ,  B01L9/00 ,  G01N33/487 ,  G01N33/50

Abstract: A biosensor that has a smart card configuration includes a semiconductor chip including a bioactive structure and contact areas disposed on a first side of the semiconductor chip, and a rewiring substrate including contact pads, external contact areas and rewiring lines that electrically connect the contact pads to the external contact areas. The rewiring substrate covers a portion of the first side of the semiconductor chip without covering the bioactive structure, such that the rewiring substrate overlaps the contact areas of the semiconductor chip and the contact pads and the contact areas are aligned with and electrically connect to each other. In addition, a measuring apparatus is configured to receive the biosensor and conduct measurements of a fluid medium that is delivered into the measuring apparatus.

公开(公告)号：DE10308855A1

公开(公告)日：2004-09-16

申请号：DE10308855

申请日：2003-02-27

Applicant: INFINEON TECHNOLOGIES AG

Inventor： BAUER MICHAEL ,  STROBEL PETER ,  OFNER GERALD ,  FUERGUT EDWARD ,  JEREBIC SIMON ,  BEMMERL THOMAS ,  FINK MARKUS ,  VILSMEIER HERMANN

IPC: H01L21/60 ,  H01L21/78 ,  H01L23/31 ,  H01L23/48 ,  H01L23/485 ,  H01L25/065 ,  H01L23/50

Abstract: Semiconductor wafer for electronic components (2) has on its top surface integrated circuits for semiconductor chips (6) in lines and columns. Between integrated circuits are located strip-shaped dividing regions for chips, which contain through contacts with perforations, extending to rear side of wafer. Walls (11) of perforation contain metal film (12), or insulating layer (30) coated with metal film. Preferably through contacts contain meltable solder material. Integrated circuits are located on top side (14), while rims (15-18), at least one including rim contacts (19). Independent claims are included for semiconductor chip, electronic component and method for producing semiconductor wafer.

公开(公告)号：DE10245451A1

公开(公告)日：2004-04-15

申请号：DE10245451

申请日：2002-09-27

Applicant: INFINEON TECHNOLOGIES AG

Inventor： OFNER GERALD ,  BIRZER CHRISTIAN ,  STOECKL STEPHAN ,  BAUER MICHAEL

IPC: H01L23/485 ,  H01L23/48 ,  H01L21/50

Abstract: The top metallization layer (4) of the semiconductor chip has fixed contact surfaces (5) carrying a layer (6) of elastomeric embedding mass (7) with electroconducting components (8). A dimensionally-stable contact plate (9) is embedded in the mass by its underside (10) and edges (11, 12). The underside of the contact plate is electrically connected by the electroconducting components of the embedding mass with the contact surfaces of the semiconductor chip. An Independent claim is included for the corresponding method of manufacture.

公开(公告)号：DE10155139A1

公开(公告)日：2003-02-27

申请号：DE10155139

申请日：2001-11-12

Applicant: INFINEON TECHNOLOGIES AG

Inventor： GOLLER BERND ,  HAGEN ROBERT-CHRISTIAN ,  OFNER GERALD ,  STUEMPFL CHRISTIAN ,  THUMBS JOSEF ,  WEIN STEFAN ,  WOERNER HOLGER ,  HEINDL WERNER

IPC: H01L21/48 ,  H01L23/31 ,  H01L23/495 ,  H01L23/50

Abstract: Electronic component comprises a semiconductor element (4) mounted in a plastic housing (8) having horizontally running flat conductor connections (10); and electrical connections arranged between the contact surfaces (43) on one active surface (41) of the element and contact connecting surfaces (105) of the conductor connections using bonding wires (12). The conductor connections are each structured and are vertically and/or horizontally flexible. An Independent claim is also included for a process for the production of the electronic component. Preferably the conductor connections each have a recess (101). The semiconductor element is mounted with its passive rear side (42) on a support substrate (6).

公开(公告)号：DE10137184A1

公开(公告)日：2003-02-27

申请号：DE10137184

申请日：2001-07-31

Applicant: INFINEON TECHNOLOGIES AG

Inventor： GOLLER BERND ,  HAGEN ROBERT CHRISTIAN ,  OFNER GERALD ,  STUEMPFL CHRISTIAN ,  THUMBS JOSEF ,  WEIN STEFAN ,  WOERNER HOLGER

IPC: H01L23/12 ,  H01L21/56 ,  H01L21/68 ,  H01L23/31 ,  H01L23/50 ,  H01L21/60 ,  H01L21/58

Abstract: An electronic component with a plastic package and to a method for its production, includes a semiconductor chip. An underside of the plastic package has external contacts. The external contacts are connected to contact areas on an active upper side of the semiconductor chip by contact pillars of the semiconductor chip and wiring lines arranged on the plastic package molding compound. In this case, the contact pillars represent an electrically conducting elevation of the contact areas.

公开(公告)号：DE10146306A1

公开(公告)日：2003-01-02

申请号：DE10146306

申请日：2001-09-19

Applicant: INFINEON TECHNOLOGIES AG

Inventor： GOLLER BERND ,  HAGEN ROBERT-CHRISTIAN ,  OFNER GERALD ,  STUEMPFL CHRISTIAN

IPC: H01L23/498 ,  H01L23/50 ,  H01L21/60 ,  H01L21/56

Abstract: The device has at least one semiconducting chip (4) and a bearer substrate (6) for accepting and electrically contacting the chip(s), whereby the bearer substrate has at least sectionally parallel conducting tracks (64) on its surface facing the chip(s) and in contact with chip contact surfaces (43). Each track is available for connection over approximately its entire length. AN Independent claim is also included for the following: a method of manufacturing an inventive device.

公开(公告)号：DE10065896A1

公开(公告)日：2002-05-29

申请号：DE10065896

申请日：2000-11-17

Applicant: INFINEON TECHNOLOGIES AG

Inventor： OFNER GERALD ,  HAGEN ROBERT-CHRISTIAN

IPC: H01L21/56 ,  H01L23/48 ,  H01L23/552 ,  H05K1/02 ,  H05K9/00 ,  H01L23/66 ,  H01L21/60 ,  H01L23/50 ,  H01L23/522 ,  H05K3/34

Abstract: Electronic component comprises a screen (2) against electromagnetic scattering fields; and a semiconductor chip (3) made from a semiconductor substrate (4) having an active upper side (5) and a passive rear side (6). The rear side has a metal layer (7) and the upper side has a contact surface (8) connected to a potential (9). At least one through-hole (10) with a metal coating (11) extends from the contact surface of the upper side to the metal layer on the rear side. An Independent claim is also included for a process for the production of the electronic component. Preferred Features: The metal layer and the metal coating are made from copper or copper alloy containing additions of silicon and/or aluminum. The contact surface of the upper side lying on the potential is arranged in an annular manner along one edge region of the upper side.

公开(公告)号：DE102017217595B4

公开(公告)日：2022-04-14

申请号：DE102017217595

申请日：2017-10-04

Applicant: INFINEON TECHNOLOGIES AG

Inventor： MEYER THORSTEN ,  OFNER GERALD ,  SCHERL PETER ,  BRADL STEPHAN ,  MIETHANER STEFAN ,  HEINRICH ALEXANDER ,  THEUSS HORST

IPC: H01L21/58 ,  H01L21/50 ,  H01L21/677

Abstract: Verfahren zum Produzieren von Halbleitervorrichtungen im Gehäuse, wobei das Verfahren Folgendes umfasst:Bereitstellen einer ersten Gehäusesubstratplatte;Bereitstellen einer zweiten Gehäusesubstratplatte; undBewegen der ersten und der zweiten Gehäusesubstratplatte durch eine Fertigungsstraße, die mehrere Gehäusefertigungswerkzeuge umfasst, unter Verwendung eines Steuermechanismus,wobei Halbleitervorrichtungen im Gehäuse vom ersten Typ auf der ersten Gehäusesubstratplatte gebildet werden und Halbleitervorrichtungen im Gehäuse vom zweiten Typ auf der zweiten Gehäusesubstratplatte gebildet werden, wobei die Halbleitervorrichtungen im Gehäuse vom zweiten Typ ein anderer Gehäusetyp sind als die Halbleitervorrichtungen im Gehäuse vom ersten Typ, undwobei der Steuermechanismus sowohl die erste als auch die zweite Gehäusesubstratplatte durch die Fertigungsstraße auf nichtlineare Weise bewegt.

公开(公告)号：DE102011001405A1

公开(公告)日：2011-10-06

申请号：DE102011001405

申请日：2011-03-18

Applicant: INFINEON TECHNOLOGIES AG

Inventor： MEYER THORSTEN ,  LEUSCHNER RAINER ,  OFNER GERALD ,  HESS REINHARD ,  SEZI RECAI

IPC: H01L23/50 ,  H01L21/56 ,  H01L21/60 ,  H01L23/31 ,  H01L25/10

Abstract: Eine Halbleiter-Kapselung (100) umfasst einen Halbleiterchip (10), ein den Halbleiterchip (10) einbettendes Einkapselungsmittel, erste Kontaktstellen auf einer ersten Hauptseite der Halbleiter-Kapselung (100) und zweite Kontaktstellen (50) auf einer der ersten. Hauptseite gegenüberliegenden zweiten Hauptseite der Halbleiter-Kapselung (100). Der Durchmesser d in Mikrometern eines freigelegten Kontaktstellenbereichs (32.1, 32.2) der zweiten Kontaktstellen (50) erfüllt die Bedingung d ≥ (8/25)x + 142 μm, wobei x der Rasterabstand der zweiten Kontaktstellen (50) in Mikrometern ist.

公开(公告)号：DE10142118B4

公开(公告)日：2007-07-12

申请号：DE10142118

申请日：2001-08-30

Applicant: INFINEON TECHNOLOGIES AG

Inventor： GOLLER BERND ,  HAGEN ROBERT-CHRISTIAN ,  OFNER GERALD ,  STUEMPFL CHRISTIAN ,  THUMBS JOSEF ,  WEIN STEFAN ,  WOERNER HOLGER

IPC: H01L25/065 ,  H01L23/50

Abstract: An electronic component has a carrier substrate to accommodate two semiconductor chips that are connected to each other. The second semiconductor chip rests with two opposite marginal supporting regions on an upper side of the carrier substrate. The first semiconductor chip is disposed at a distance from a frame of the carrier substrate, in a central recess in the latter. A process for the production of the electronic component is further described.