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127 records (took 0.029 seconds)

    51.
    发明专利
    未知

    公开(公告)号：DE502005008455D1

    公开(公告)日：2009-12-17

    申请号：DE502005008455

    申请日：2005-08-08

    Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

    Inventor： ARNDT KARLHEINZ ,  LIM HUEY LING RENA ,  BOGNER GEORG ,  GRUBER STEFAN ,  SCHNEIDER MARKUS

    IPC: H01L21/48 ,  H01L23/495

    Abstract: Disclosed is a leadframe for at least one electronic component, comprising at least two electrical lead elements, each of which comprises at least one electrical lead tab and at least one retention tab. Provided between the at least one retention tab and the lead element is a score defining a parallel offset between the retention tab and the adjacent region of the lead element. An additional parallel offset is defined between the lead element and the electrical lead tab, such that the retention tab and the electrical lead tab are located in a common plane. The score enables the retention tab to be removed easily without the need for a disadvantageous punched gap between the lead element and the retention tab.

    52.
    发明专利
    未知

    公开(公告)号：DE102007061479A1

    公开(公告)日：2009-06-25

    申请号：DE102007061479

    申请日：2007-12-20

    Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

    Inventor： SORG JOERG ,  GRUBER STEFAN ,  BOGNER GEORG

    IPC: H01L23/60 ,  H01L33/00

    Abstract: A light emitting diode chip includes a device for protection against overvoltages, e.g., an ESD protection device. The ESD protection device is integrated into a carrier, on which the semiconductor layer sequence of the light emitting diode chip is situated, and is based on a specific doping of specific regions of said carrier. By way of example, the ESD protection device is embodied as a Zener diode that is connected to the semiconductor layer sequence by means of an electrical conductor structure.

    54.
    发明专利
    未知

    公开(公告)号：DE102007010244A1

    公开(公告)日：2008-08-07

    申请号：DE102007010244

    申请日：2007-03-02

    Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

    Inventor： GROETSCH STEFAN ,  BOGNER GEORG ,  HAHN BERTHOLD ,  HAERLE VOLKER ,  PETERSEN KIRSTIN

    IPC: H01L33/50

    Abstract: At least two semiconductor components emit electromagnetic radiation in different wavelength ranges. The superimposition of these electromagnetic radiations of all semiconductor components has at least one fraction in the visible wavelength range. At least one of the semiconductor components has a luminescence conversion element in the beam path.

    57.
    发明专利
    未知

    公开(公告)号：DE50210938D1

    公开(公告)日：2007-10-31

    申请号：DE50210938

    申请日：2002-10-28

    Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

    Inventor： BOGNER GEORG ,  BRUNNER HERBERT ,  KRAEUTER GERTRUD ,  WAITL GUENTER

    IPC: H01L31/0203 ,  H01L33/48 ,  H01L33/60

    Abstract: Optoelectronic component, having a housing body (2), an optoelectronic semiconductor chip (3) arranged in a recess (6) of the housing body, and having electrical terminals (1A, 1B), the semiconductor chip being electrically conductively connected to the electrical terminals of the leadframe. The housing body (2) is formed from an encapsulation material, with a filler which has a high degree of reflection in a wavelength range from the UV range.

    59.
    发明专利
    未知

    公开(公告)号：DE10117890B4

    公开(公告)日：2007-06-28

    申请号：DE10117890

    申请日：2001-04-10

    Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

    Inventor： BOGNER GEORG ,  BRUNNER HERBERT ,  WAITL GUENTER

    IPC: H01L21/68 ,  H01L31/0203 ,  H01L31/0224 ,  H01L33/48 ,  H01L33/62 ,  H01S5/022 ,  H01S5/024

    Abstract: Production of a semiconductor component which emits and receives radiation comprises forming and preparing an electrical leadframe (2); mounting a chip (5) ; placing an injection mold on the lead frame so that the semiconductor chip lies in a chip cavity of a molding stamp of the mold for a radiation window (8); extruding the leadframe with a housing base body (1); and encapsulating the chip. Production of a semiconductor component which emits and receives radiation comprises forming and preparing an electrical leadframe (2) having a chip assembly region, a wire connecting region (10) and external electrical connecting strips (3a, 3b); mounting a chip (5) which emits and receives radiation on the chip assembly region using a thermally conducting connecting material having a melting temperature above the solder temperature of the subsequent component steps; placing an injection mold on the lead frame so that the semiconductor chip lies in a chip cavity of a molding stamp of the mold for a radiation window (8); extruding the leadframe with a housing base body (1) so that the semiconductor chip is arranged in the window; and encapsulating the chip. An Independent claim is also included for a semiconductor component produced. Preferred Features: The connecting material is a hard solder. The melting point of the connecting material is 260 deg C or more. The chip is surrounded by a plastic composition.

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