Abstract:
PURPOSE: A thin film type solar battery and a manufacturing method thereof are provided to improve the efficiency of a thin film type solar battery by applying a material with a high band gap to a p-type semiconductor layer. CONSTITUTION: A front side anti-reflective layer(20) is formed on a glass substrate(10). A p-type semiconductor layer(30) is formed on the front side anti-reflective layer. An i-type semiconductor layer(40) is formed on the p-type semiconductor layer. An n-type semiconductor layer(50) is formed on the i-type semiconductor layer. A backside reflection layer(60) is formed on the n-type semiconductor layer.
Abstract:
PURPOSE: A thin film transistor, a method for forming the same, and a flat panel display device with the same are provided to prevent loss of a drain area, thereby improving lifetime and performance. CONSTITUTION: A buffer layer(13), a preliminary channel area, an insulating layer, and a gate electrode layer are successively formed on a substrate(11). The gate electrode layer and the insulating layer are patterned successively so that a gate pattern(22) is formed. Impurity is doped in the exposed preliminary channel area to define a channel area(15). A protection layer(27) is formed on the front side of the substrate with source and drain areas. The first contact hole(29) and the second contact hole(31) exposing the buffer layer are formed.
Abstract:
A method for forming a nano-pyramid type structure on a wafer using a silicon dry etching process and a gate memory using the structure are provided to increase data storage capacity of a flash memory by increasing a contact area with quantum dots of a floating gate memory. A silicon wafer(11) is transferred to an internal electrode(19) of an RF plasma reaction chamber of a vacuum state. SF6 gas and O2 gas are implanted into the inside of the RF plasma reaction chamber. RF power is applied to the RF plasma reaction chamber to generate plasma. The silicon wafer is dry-etched in a nano-pyramid type structure by controlling a flow rate of SF6 to O2 corresponding to partial gas pressure of 20~25 sccm to 10~15 sccm and controlling the RF power of 90 to 110 W.
Abstract:
PURPOSE: A method for forming a selective emitter layer using an etchant protecting layer is provided to prevent the selective emitter layer from being damaged by performing a wet-etching process. CONSTITUTION: A first conductive substrate is prepared (S10). A second conductive emitter layer is formed on the upper surface of the first conductive substrate (S20). An etchant protecting layer is patterned and deposited on the second conductive emitter layer (S30). The second conductive emitter layer is selectively wet-etched (S40). The etchant protecting layer is removed from the surface of the first conductive substrate (S50). [Reference numerals] (S10) Step where a first conductive substrate is prepared; (S20) Step where a second conductive emitter layer is formed on the upper surface of the first conductive substrate using an impurity with an opposite type of the first conductive substrate through an ion injection & diffusion process; (S30) Step where an etchant protecting layer is patterned and deposited on the second conductive emitter layer; (S40) Step where the second conductive emitter layer is selectively wet-etched with a wet etchant; (S50) Step where the etchant protecting layer is removed; (S60) Step where an anti-reflection layer is formed on the surface of the substrate; (S70) Step where electrodes are formed on the highly-doped emitter layer and the back of the substrate
Abstract:
PURPOSE: A thin film type solar battery and a manufacturing method thereof are provided to improve short-circuit current density by including a rear side transparent conductivity oxide layer and a rear side electrode having different reflective index. CONSTITUTION: Texture is formed on the surface of a glass substrate. A front side transparent conductivity oxide layer(110) is formed at the upper side of the glass substrate. A thin film laminated body of a p-i-n structure is formed at one side of the front side transparent conductivity oxide layer. A rear side transparent conductivity oxide layer(160) is formed at the upper side of the thin film laminated body of the p-i-n structure. A rear side electrode layer(170) is formed at the upper side of the rear side transparent conductivity oxide layer and the upper side of the front side transparent conductivity oxide layer.
Abstract:
PURPOSE: A method for manufacturing a silicon thin film transistor using a low temperature process is provided to reduce manufacturing costs by simplifying a crystallization process using a laser and a doping process. CONSTITUTION: A buffer layer(110) is formed on a substrate. An n type or p type micro crystal silicon thin film is deposited on the buffer layer. A source electrode or drain electrode is formed by patterning the n type or p type micro crystal silicon thin film. An active layer is formed on the source electrode or drain electrode. An insulation layer and a metal electrode(150) are formed on the active layer. A gate electrode(160) is formed by patterning the active layer, the insulation layer, and the metal electrode on the substrate. The n type or p type micro crystal silicon thin film is formed by a low temperature chemical vapor deposition process.
Abstract:
본 발명은 비정질/결정질 실리콘 이종접합 태양전지와 그 제조방법에 관한 것이다. 본 발명에 의한 이종접합 태양전지는, 결정질 실리콘 웨이퍼의 전면에 비정질 실리콘을 형성하는 이종접합 실리콘 태양전지에 있어서, 상기 결정질 실리콘 웨이퍼의 전, 후면에 증착된 SiO x 막; 및 전면에 증착된 SiO x 막 위에 증착된 비정질 실리콘층을 포함하는 것을 특징으로 한다. 본 발명에 따르면, SiO x 막 또는 SiO x N y 막을 패시베이션막으로 사용함으로써, 이종접합태양전지의 효율을 크게 향상시키는 효과가 있다. 또한, 패시베이션막을 열처리 또는 화학적 기상 증착법을 이용한 간단한 증착방법을 이용함으로써, 대량 생산에 적합한 제조방법을 제공하는 효과가 있다. 이종접합 태양전지, 비정질/결정질 이종접합 태양전지, 패시베이션층, 비정질/결정질 태양전지
Abstract:
PURPOSE: A silicon substrate containing a nano-porous structure for a solar cell and a method for manufacturing the same are provided to form the nano-porous structure on the surface of the silicon substrate without the shape transformation of the silicon substrate by immersing the silicon substrate into a diluted acidic mixture solution. CONSTITUTION: An acidic mixture solution is prepared by mixing nitric acid and hydrofluoric acid. A diluted acidic mixture solution is prepared by mixing the acidic mixture solution and water. A silicon substrate is immersed into the diluted acidic mixture solution to form a nano-porous structure on the surface of the silicon substrate. The silicon substrate is mono-crystalline silicon substrate, polycrystalline silicon substrate, or non-processed crystalline silicon substrate.