Abstract:
PROBLEM TO BE SOLVED: To obtain technical advantages as a device, system, and method of programming an electric fuse by using a transistor to which an active well bias is imparted. SOLUTION: In contrast to being grounded, a transistor (i.e. MOSFET) 33 operates through a well bias to program an electric fuse 31. With respect to the programming transistor operated by the active well bias, the fuse 31 can be programmed by the larger energy than that in the case of utilizing in the well with the transistor of the same size grounded. Thus, the smaller transistor can be used for programming the fuse 31. In the enforcement of a plurality of fuses, the programming transistor can be arranged in the same "well" in such a state that the common independent V bias is imparted to the entire well through a body controlling circuit 37, while programming the selected fuse 31. COPYRIGHT: (C)2004,JPO
Abstract:
PROBLEM TO BE SOLVED: To provide a method and system, in which operation of and/or access to a particular function of an electronic device can be controlled after the device leaves the control of the manufacturer. SOLUTION: Techniques and systems whereby the operation and/or the access to the particular function of the electronic device cany be controlled after the device leaves the control of the manufacturer are provided. The operation and/or access can be provided based on values stored in non-volatile storage elements, such as electrically programmable fuses (eFUSES). COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide an electrically programmable fuse including anisometric contacts having improved thermal characteristics, and to provide a fabrication method thereof.SOLUTION: The electrically programmable fuse includes: an anode contact region 110 and a cathode contact region 118 formed of a polysilicon layer having a silicide layer formed thereon; a fuse link 116 which conductively connects the cathode contact region with the anode contact region and is programmable by applying a programming current; and a plurality of anisometric contacts 120 formed on the silicide layer of the cathode contact region or on both silicide layers of the cathode contact region and the anode contact region in a predetermined configuration, respectively.
Abstract:
Described herein is a fuse incorporating a covering layer disposed on a conductive layer, which is disposed on a polysilicon layer. The covering layer preferably comprises a relatively inert material, such as a nitride etchant barrier. The covering layer preferably has a region of relatively less-inert filler material. Upon programming of the fuse, the conductive layer, which can be a silicide, preferentially degrades in the region underlying the filler material of the covering layer. This preferential degradation results in a predictable "blowing" of the fuse in the fuse region underlying the filler material. Since the "blow" area is predictable, damage to adjacent structures can be minimized or eliminated.
Abstract:
A semiconductor structure and a method for fabricating the semiconductor structure provide a field effect device located and formed upon an active region of a semiconductor substrate and at least one of a fuse structure, an anti-fuse structure and a resistor structure located and formed at least in part simultaneously upon an isolation region laterally separated from the active region within the semiconductor substrate. The field effect device includes a gate dielectric comprising a high dielectric constant dielectric material and a gate electrode comprising a metal material. The at least one of the fuse structure, anti-fuse structure and resistor structure includes a pad dielectric comprising the same material as the gate dielectric, and optionally, also a fuse, anti-fuse or resistor that may comprise the same metal material as the gate electrode.
Abstract:
Struktur einer Antisicherung, die Folgendes umfasst: ein Substrat (100); eine Vielzahl paralleler leitender Rippen (104), die auf dem Substrat angeordnet sind, wobei jede der Rippen ein erstes Ende (108) und ein zweites Ende (106) aufweist; einen Isolator (120), der das erste Ende der Rippen bedeckt; einen ersten elektrischen Leiter (140), der auf dem Isolator angeordnet ist, wobei der erste elektrische Leiter durch den Isolator vom ersten Ende der Rippen elektrisch isoliert ist; und einen zweiten elektrischen Leiter (180), der mit dem zweiten Ende der Rippen elektrisch verbunden ist, wobei der Isolator eine Dicke aufweist, die ausreicht, um beim Anlegen einer vorgegebenen Spannung zwischen dem zweiten elektrischen Leiter und dem ersten elektrischen Leiter durchzubrechen und dadurch über die Rippen eine ständige elektrische Verbindung zwischen dem zweiten elektrischen Leiter und dem ersten elektrischen Leiter zu bilden.
Abstract:
A method forms an anti-fuse structure comprises a plurality of parallel conductive fins positioned on a substrate, each of the fins has a first end and a second end. A second electrical conductor is electrically connected to the second end of the fins. An insulator covers the first end of the fins and a first electrical conductor is positioned on the insulator. The first electrical conductor is electrically insulated from the first end of the fins by the insulator. The insulator is formed to a thickness sufficient to break down on the application of a predetermined voltage between the second electrical conductor and the first electrical conductor and thereby form an uninterrupted electrical connection between the second electrical conductor and the first electrical conductor through the fins.
Abstract:
A fuse structure and method of forming the same is described, wherein the conductive body (50) of the fuse is formed from a crystalline semiconductor body (52) on an insulator (53), preferably of a silicon-on-insulator wafer, surrounded by a fill-in dielectric (54). The fill-in dielectric (54) is preferably a material that minimizes stresses on the crystalline body (52), such as an oxide. The crystalline semiconductor body (52) may be doped. The conductive body (50) may also include a conductive layer (51), such as a silicide layer, on the upper surface of the crystalline semiconductor body (52). This fuse structure may be successfully programmed over a wide range of programming voltages and time.