公开(公告)号：US20180168045A1

公开(公告)日：2018-06-14

申请号：US15836860

申请日：2017-12-09

Applicant: CYNTEC CO., LTD.

Inventor： BAU-RU LU ,  CHUN HSIEN LU ,  DA-JUNG CHEN

IPC: H05K1/18 ,  H05K1/14 ,  H05K1/11

CPC classification number: H01F27/022 ,  H01F17/04 ,  H01F27/24 ,  H01F27/28 ,  H01F27/2823 ,  H01F27/32 ,  H01F27/36 ,  H01F41/00 ,  H05K1/111 ,  H05K1/115 ,  H05K1/144 ,  H05K1/181 ,  H05K2201/041 ,  H05K2201/09063 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/10522 ,  H05K2201/10545

Abstract: An electronic module is disclosed, wherein the electronic module comprises: a module board and a connection board, wherein a plurality of first electronic devices are disposed over a top surface of the module board, and a plurality of second electronic devices are disposed on a bottom surface of the module board, wherein a plurality of first contact points are disposed on the bottom surface of the module board and electrically connected to a plurality of second contact points on a top surface of the connection board, wherein a plurality of third contact points are on a bottom surface of the connection board for connecting with an external circuit.

公开(公告)号：US20180145385A1

公开(公告)日：2018-05-24

申请号：US15819587

申请日：2017-11-21

Applicant: M-Tron Industries, Inc

Inventor： Michael D. Howard ,  Roger Paulsen

IPC: H01P1/207 ,  H01P3/08 ,  H05K1/18 ,  H05K1/02 ,  H01P1/30

CPC classification number: H01P1/207 ,  H01P1/2088 ,  H01P1/30 ,  H01P3/08 ,  H05K1/0201 ,  H05K1/0237 ,  H05K1/0239 ,  H05K1/0262 ,  H05K1/16 ,  H05K1/181 ,  H05K2201/09063 ,  H05K2201/10015 ,  H05K2201/10151 ,  H05K2203/165

Abstract: A filter of the present invention creates a cavity filter that can be embedded within the inner layers of a printed circuit board. The embodiment can provide for a tunable microwave filter with lower loss, lower manufacturing cost and higher production yields. In addition, the tunable microwave includes a temperature compensation means to accommodate an electrical characteristic of filter with regard to the temperature variation. Such temperature compensation embodiment can be embedded into the upper layer communicably associated with the processor. For performing intelligent temperature compensation, the processor can include a look-up table of tuning values for controlling can store a set of temperature offset value that can modify the tuning table.

公开(公告)号：US09980372B2

公开(公告)日：2018-05-22

申请号：US15503747

申请日：2015-06-02

Applicant: Sharp Kabushiki Kaisha

Inventor： Yoshikazu Ohara ,  Yoshihiro Sekimoto ,  Tetsuya Fujimoto ,  Yoshinori Tanida

IPC: H05K1/02 ,  H04N5/225 ,  G03B17/55

CPC classification number: H05K1/0274 ,  G02B7/02 ,  G03B17/02 ,  G03B17/55 ,  H01L27/14618 ,  H01L27/14625 ,  H04N5/2253 ,  H04N5/2254 ,  H04N5/2257 ,  H04N5/335 ,  H05K2201/09063

Abstract: A camera module (1) has an internal space (28) that abuts a wiring substrate (21) and is occluded, at least a part of a base material of the wiring substrate (21) is a porous portion (41) that is configured of porous ceramic, porous metal, organic fabric, or inorganic fabric and has interconnected air holes, and the internal space (28) is connected to the outside of the camera module (1) through the interconnected air holes.

公开(公告)号：US09980370B2

公开(公告)日：2018-05-22

申请号：US14912677

申请日：2014-09-11

Applicant: NEC Corporation

Inventor： Kazuhiro Kashiwakura

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/00 ,  H05K3/40 ,  H01P1/04 ,  H01P5/08

CPC classification number: H05K1/0222 ,  H01P1/045 ,  H01P5/085 ,  H05K1/0213 ,  H05K1/0251 ,  H05K1/113 ,  H05K1/116 ,  H05K3/0047 ,  H05K3/40 ,  H05K2201/09063 ,  H05K2201/09609 ,  H05K2201/09809

Abstract: To provide a printed board that solves the problem of transmission characteristics deterioration, the disclosed printed board includes a substrate, a circular signal pad that is provided on the substrate, a doughnut-shaped ground pad, which sandwiches the substrate that surrounds, in a doughnut shape, the signal pad, and which surrounds the outer circumference of the substrate, and one or more recessed sections that are disposed on the substrate that surrounds, in the doughnut shape, the signal pad.

公开(公告)号：US09980364B2

公开(公告)日：2018-05-22

申请号：US15077211

申请日：2016-03-22

Applicant: YAZAKI CORPORATION

Inventor： Akira Harao ,  Mototatsu Matsunaga ,  Yasuhiro Sugiura ,  Minoru Kubota

IPC: H05K1/00 ,  H05K1/02 ,  H01R12/72 ,  H05K3/36 ,  H05K1/11 ,  H05K3/10 ,  H01L23/498 ,  H05K7/10 ,  H05K1/05 ,  H05K3/20 ,  H05K3/34 ,  H05K1/14

CPC classification number: H05K1/0204 ,  H01L23/49861 ,  H01L2224/05571 ,  H01L2224/48091 ,  H01L2225/1094 ,  H01R12/728 ,  H05K1/0203 ,  H05K1/05 ,  H05K1/056 ,  H05K1/11 ,  H05K1/14 ,  H05K3/10 ,  H05K3/202 ,  H05K3/3447 ,  H05K3/368 ,  H05K7/1046 ,  H05K2201/09009 ,  H05K2201/09063 ,  H05K2201/10757 ,  H05K2201/10787 ,  H05K2203/025 ,  Y10T29/49147 ,  Y10T29/49155

Abstract: Disclosed is wiring substrate, the wiring substrate including a substrate having a high thermal conductive layer, in which at least one of a front surface and a rear surface of the substrate is a mounting surface for a variety of components; a window section formed in the substrate; and a connection terminal extended from an inside surface portion of the window section and bending in a direction perpendicular to a surface of the substrate.

公开(公告)号：US20180139845A1

公开(公告)日：2018-05-17

申请号：US15813246

申请日：2017-11-15

Applicant: ASUSTeK COMPUTER INC.

Inventor： Bing-Min LIN ,  Teng-Liang NG ,  Ji-Kuang TAN ,  Ming-Fang TSAI ,  Chih-Kuang LIN

IPC: H05K1/18 ,  H05K1/02 ,  H05K7/20 ,  G08B5/38

CPC classification number: H05K1/181 ,  G06F1/183 ,  G06F1/20 ,  G06F11/3058 ,  G06F11/325 ,  G08B5/38 ,  H05K1/0274 ,  H05K1/18 ,  H05K7/20172 ,  H05K2201/09063 ,  H05K2201/09145 ,  H05K2201/09172 ,  H05K2201/10106 ,  H05K2201/10151 ,  H05K2201/10393 ,  H05K2201/10409 ,  H05K2201/10446 ,  H05K2201/10522

Abstract: A motherboard is provided. The motherboard includes a main body, a notch formed at a side edge of the main body, and a fixing device formed adjacent to the notch to fix an auxiliary device. The function of the motherboard is expanded significantly while artistic of the appearance of the motherboard is improved.

公开(公告)号：US09949376B2

公开(公告)日：2018-04-17

申请号：US14563778

申请日：2014-12-08

Applicant: Second Sight Medical Products, Inc.

Inventor： Robert J Greenberg ,  Neil H Talbot ,  James S Little

IPC: A61N1/375 ,  A61N1/05 ,  A61N1/36 ,  A61N1/372 ,  H05K3/28 ,  H05K1/11 ,  H05K1/14 ,  A61B5/00 ,  A61B5/0478 ,  H05K1/18 ,  H01L23/055 ,  H05K1/02 ,  H05K1/03 ,  H05K1/09 ,  H05K3/00 ,  H05K3/32 ,  H05K3/36 ,  H05K3/40

CPC classification number: H05K3/282 ,  A61B5/0006 ,  A61B5/0478 ,  A61B5/4836 ,  A61B5/6868 ,  A61B2562/0209 ,  A61B2562/046 ,  A61B2562/125 ,  A61N1/0529 ,  A61N1/0531 ,  A61N1/0534 ,  A61N1/3606 ,  A61N1/36071 ,  A61N1/36082 ,  A61N1/36139 ,  A61N1/375 ,  A61N1/3752 ,  A61N1/3754 ,  H01L23/055 ,  H01L2224/16225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48465 ,  H05K1/02 ,  H05K1/0271 ,  H05K1/028 ,  H05K1/0281 ,  H05K1/0306 ,  H05K1/092 ,  H05K1/11 ,  H05K1/111 ,  H05K1/145 ,  H05K1/147 ,  H05K1/189 ,  H05K3/0044 ,  H05K3/005 ,  H05K3/0058 ,  H05K3/28 ,  H05K3/321 ,  H05K3/363 ,  H05K3/4015 ,  H05K3/4061 ,  H05K2201/0245 ,  H05K2201/053 ,  H05K2201/055 ,  H05K2201/09063 ,  H05K2201/09145 ,  H05K2201/09163 ,  H05K2201/097 ,  H05K2201/09981 ,  H05K2201/10303 ,  H05K2201/10318 ,  H05K2201/10674 ,  H05K2201/10795 ,  H05K2201/10931 ,  H05K2201/2009 ,  H05K2203/0195 ,  H05K2203/025 ,  H05K2203/0278 ,  H05K2203/0307 ,  H05K2203/068 ,  H05K2203/082 ,  H05K2203/1322 ,  H05K2203/1327 ,  H05K2203/1394 ,  H05K2203/1461 ,  H05K2203/1476 ,  H05K2203/162 ,  H05K2203/304 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The present invention consists of an implantable device with at least one package that houses electronics that sends and receives data or signals, and optionally power, from an external system through at least one coil attached to at least one package and processes the data, including recordings of neural activity, and delivers electrical pulses to neural tissue through at least one array of multiple electrodes that are attached to the at least one package. The device is adapted to electrocorticographic (ECoG) and local field potential (LFP) signals. A brain stimulator, preferably a deep brain stimulator, stimulates the brain in response to neural recordings in a closed feedback loop. The device is advantageous in providing neuromodulation therapies for neurological disorders such as chronic pain, post traumatic stress disorder (PTSD), major depression, or similar disorders. The invention and components thereof are intended to be installed in the head, or on or in the cranium or on the dura, or on or in the brain.

公开(公告)号：US09949358B2

公开(公告)日：2018-04-17

申请号：US15224903

申请日：2016-08-01

Applicant: Samsung Display Co., Ltd.

Inventor： Siyoung Choi ,  Moonshik Kang ,  Jeonghun Go ,  Yongsoon Lee

IPC: H05K1/02 ,  H05K1/03 ,  H05K1/18

CPC classification number: H05K1/0203 ,  H05K1/0201 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/0373 ,  H05K1/18 ,  H05K3/46 ,  H05K2201/0116 ,  H05K2201/0187 ,  H05K2201/062 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/10128

Abstract: A circuit board includes a base layer, a circuit layer disposed on the base layer, where an air gap is defined in the circuit layer, a heat blocking part disposed in the air gap, and an electronic element disposed on the circuit layer. The heat blocking part has a thermal conductivity lower than a thermal conductivity of the circuit layer.

公开(公告)号：US09942978B2

公开(公告)日：2018-04-10

申请号：US15085710

申请日：2016-03-30

Applicant: LG DISPLAY CO., LTD.

Inventor： Dal Jae Lee

IPC: H05K1/02 ,  G02F1/1333 ,  G02F1/1345 ,  H05K3/36 ,  H05K1/18 ,  G09G3/20 ,  H05K1/11

CPC classification number: H05K1/028 ,  G02F1/133305 ,  G02F1/13452 ,  G09G3/2096 ,  G09G2300/0408 ,  G09G2380/02 ,  H01L2251/5338 ,  H05K1/111 ,  H05K1/189 ,  H05K3/361 ,  H05K2201/055 ,  H05K2201/09063 ,  H05K2201/10128 ,  H05K2201/10136 ,  Y10T29/49126

Abstract: A flexible display device includes a display panel configured to display images, a first substrate having a plurality of pixels disposed therein, and a second substrate coupled to the first substrate. The first substrate includes a display area, a bent part extending from the display area, and a pad part extending from the bent part. The flexible display device further includes a panel driver coupled to the pad part of the first substrate and configured to supply signals to the plurality of pixels on the display panel for displaying images. The first substrate further includes a first surface and a second surface, and the second substrate includes a third surface and a fourth surface. The first surface of the first substrate faces the fourth surface of the second substrate. The first substrate is curved at the bent part of the first substrate such that the pad part of the first substrate and the panel driver are disposed below the display area.

公开(公告)号：US09930772B2

公开(公告)日：2018-03-27

申请号：US14983829

申请日：2015-12-30

Applicant: TYCO ELECTRONICS CORPORATION ,  TYCO ELECTRONICS JAPAN G.K.

Inventor： Chad William Morgan ,  Masayuki Aizawa ,  Arash Behziz ,  Brian Patrick Costello ,  Nathan Lincoln Tracy ,  Michael David Herring

IPC: H05K1/02

CPC classification number: H05K1/0245 ,  H05K1/0222 ,  H05K1/024 ,  H05K1/0248 ,  H05K1/115 ,  H05K2201/044 ,  H05K2201/09063 ,  H05K2201/09227 ,  H05K2201/09672 ,  H05K2201/10189

Abstract: Printed circuit includes a planar substrate having opposite sides and a thickness extending therebetween. The sides extend parallel to a lateral plane. The printed circuit also includes a plurality of conductive vias extending through the planar substrate in a direction that is perpendicular to the lateral plane. The conductive vias include ground vias and signal vias. The signal vias form a plurality of quad groups in which each quad group includes a two-by-two array of the signal vias. Optionally, the printed circuit also includes signal traces that electrically couple to the signal vias. The signal traces may form a plurality of quad lines in which each quad line includes four of the signal traces. The four signal traces of each quad line may extend parallel to one another and be in a two-by-two formation.