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    Production of a semiconductor wafer useful in e.g. chip cards, comprises applying a semiconductor layer epitaxially on a surface of a semiconductor substrate, and partially removing the substrate from the semiconductor layer
    3.
    发明专利
    Production of a semiconductor wafer useful in e.g. chip cards, comprises applying a semiconductor layer epitaxially on a surface of a semiconductor substrate, and partially removing the substrate from the semiconductor layer 未知

    公开(公告)号：DE102006030869A1

    公开(公告)日：2008-01-10

    申请号：DE102006030869

    申请日：2006-07-04

    Applicant: INFINEON TECHNOLOGIES AG

    Inventor： FATHULLA AHMAD ,  LACKNER GERALD ,  RUPP THOMAS ,  SANTOS RODRIGUEZ FRANCISCO JAV ,  SCHOENHERR HELMUT ,  SCHULZE HANS-JOACHIM

    IPC: H01L21/306 ,  C30B25/02

    Abstract: The production of a semiconductor wafer useful in e.g. chip cards, comprises providing a semiconductor substrate (1) from a first semiconductor material with a first surface and a second surface, which faces the first surface, applying a first semiconductor layer (2) from a second semiconductor material epitaxially on the second surface, and partially removing the substrate from the first semiconductor layer. The epitaxial application of a second semiconductor layer (3) from a third semiconductor material on the first semiconductor layer takes place to the desired target thickness. The production of a semiconductor wafer useful in e.g. chip cards, comprises providing a semiconductor substrate (1) from a first semiconductor material with a first surface and a second surface, which faces the first surface, applying a first semiconductor layer (2) from a second semiconductor material epitaxially on the second surface, and partially removing the substrate from the first semiconductor layer. The epitaxial application of a second semiconductor layer (3) from a third semiconductor material on the first semiconductor layer takes place to the desired target thickness. After the partial removing, the first semiconductor layer is partly removed via corroding. Before corroding a prefabricated device is attached as an etching mask at the first surface of the substrate. The device covers an external area of the first surface and limits an opening that releases an internal area of the first surface of the substrate, and is again removed after corroding. A semiconductor component (4) is formed in the first- and second semiconductor layer before the partial removing of the substrate.

    A METHOD OF FORMING WIRES ON AN INTEGRATED CIRCUIT CHIP
    7.
    发明申请
    A METHOD OF FORMING WIRES ON AN INTEGRATED CIRCUIT CHIP 审中-公开
    在集成电路芯片上形成线的方法

    公开(公告)号：WO0137325A2

    公开(公告)日：2001-05-25

    申请号：PCT/US0031227

    申请日：2000-11-13

    Applicant: INFINEON TECHNOLOGIES CORP ,  IBM

    Inventor： CLEVENGER LAWRENCE ,  COSTRINI GREG ,  DOBUZINSKY DAVE ,  OTANI YOICHI ,  RUPP THOMAS ,  SARDESAI VIRAJ

    IPC: H01L21/311 ,  H01L21/768 ,  H01L21/00

    CPC classification number: H01L21/31116 ,  H01L21/76802

    Abstract: A damascene method of forming conductive lines in an integrated circuit chip. Trenches are etched by a plasma formed by capacitively coupling a gas mixture at 500 to 3000watts under a pressure of 50 - 400mTorr. The gas mixture includes 2 - 30sccm of C4F8 2

    Abstract translation: 在集成电路芯片中形成导线的镶嵌方法。 通过在压力为50-400mTorr的500-3000瓦电容耦合气体混合物形成的等离子体蚀刻沟槽。 气体混合物包括2-30sccm的C 4 F 8，20-80sccm的CO，2-30sccm的O> 2和50-400sccm的Ar。 可以将气体流量调节到最佳水平，从而实现高度的均匀性。 低于所选均匀度的晶片可能会重新加工。 在具有可接受流动的沟槽中形成的镶嵌布线层表现出高度的薄层电阻均匀性和改善的线对线短路产量。

    A METHOD OF FORMING WIRES ON AN INTEGRATED CIRCUIT CHIP
    8.
    发明申请
    A METHOD OF FORMING WIRES ON AN INTEGRATED CIRCUIT CHIP 审中-公开
    在集成电路芯片上形成线的方法

    公开(公告)号：WO0137325A9

    公开(公告)日：2002-07-04

    申请号：PCT/US0031227

    申请日：2000-11-13

    Applicant: INFINEON TECHNOLOGIES CORP ,  IBM

    Inventor： CLEVENGER LAWRENCE ,  COSTRINI GREG ,  DOBUZINSKY DAVE ,  OTANI YOICHI ,  RUPP THOMAS ,  SARDESAI VIRAJ

    IPC: H01L21/311 ,  H01L21/768

    CPC classification number: H01L21/31116 ,  H01L21/76802

    Abstract: A damascene method of forming conductive lines in an integrated circuit chip. Trenches are etched by a plasma formed by capacitively coupling a gas mixture at 500 to 3000watts under a pressure of 50 - 400mTorr. The gas mixture includes 2 - 30sccm of C4F8, 20 - 80sccm of CO, 2 - 30sccm of O2 and 50 - 400sccm of Ar. Gas flow can be adjusted to an optimum level, thereby achieving a high degree of uniformity. Wafers falling below a selected uniformity may be reworked. A damascene wiring layer formed in the trenches with an acceptable flow exhibit a high degree of sheet resistance uniformity and improved line to line shorts yield.

    Abstract translation: 在集成电路芯片中形成导线的镶嵌方法。 通过在压力为50-400mTorr的500-3000瓦电容耦合气体混合物形成的等离子体蚀刻沟槽。 气体混合物包括2 - 30sccm的C4F8，20 - 80sccm的CO，2 - 30sccm的O2和50 - 400sccm的Ar。 可以将气体流量调节到最佳水平，从而实现高度的均匀性。 低于所选均匀度的晶片可能会重新加工。 在具有可接受流动的沟槽中形成的镶嵌布线层表现出高度的薄层电阻均匀性和改善的线对线短路产量。

    EMBEDDED VERTICAL DRAM CELLS AND DUAL WORKFUNCTION LOGIC GATES
    9.
    发明申请
    EMBEDDED VERTICAL DRAM CELLS AND DUAL WORKFUNCTION LOGIC GATES 审中-公开
    嵌入式垂直DRAM电池和双功能逻辑门

    公开(公告)号：WO0245130A3

    公开(公告)日：2004-01-08

    申请号：PCT/US0144625

    申请日：2001-11-28

    Applicant: INFINEON TECHNOLOGIES CORP ,  IBM

    Inventor： GRUENING ULRIKE ,  DIVAKARUNI RAMACHANDRA ,  MANDELMAN JACK ,  RUPP THOMAS

    IPC: H01L27/10 ,  H01L21/8242

    CPC classification number: H01L27/10894 ,  H01L27/10864 ,  H01L27/10885 ,  H01L27/10891

    Abstract: A process for producing very high-density embedded DRAM/very high-performance logic structures comprising fabricating vertical MOSFET DRAM cells with salicided source/drain and gate conductor dual workfunction MOSFETs in the supports, comprising: Forming a french capacitor in a silicon substrate having a gate oxide layer, a polysilicon layer, and a top dialectric nitride layer deposited thereon; Applying a patterned mask over the array and support areas and forming recesses in the nitride layer, the polysilicon layer, and shallow trench isolation region; Forming a silicide and oxide cap in the recesses in the nitride layer, the polysilicon layer, and shallow trench isolation region; Applying a block mask to protect the supports while stripping the nitride layer from the array and etching the exposed polysilicon layer to the top of the gate oxide layer; Striping the nitride layer from the support region and depositing a polysilicon layer over the array and support areas; Applying a mask to pattern and form a bitline diffusion stud landing pad in the array and gate conductors for the support transistors; Saliciding the tops of the landing pad and the gate conductors; Applying an interlevel oxide layer and then opening vias in the interlevel oxide layer for establishing conductive wiring channels.

    Abstract translation: 一种用于生产非常高密度的嵌入式DRAM /非常高性能的逻辑结构的方法，包括在支撑体中制造具有水银源/漏极和栅极导体双功函数MOSFET的垂直MOSFET DRAM单元，包括：在硅衬底中形成法兰电容器， 栅极氧化物层，多晶硅层和沉积在其上的顶部侧面氮化物层; 在阵列和支撑区域上施加图案化掩模并在氮化物层，多晶硅层和浅沟槽隔离区域中形成凹陷; 在氮化物层，多晶硅层和浅沟槽隔离区域的凹槽中形成硅化物和氧化物盖; 施加阻挡掩模以保护支撑物，同时从阵列剥离氮化物层并将暴露的多晶硅层蚀刻到栅极氧化物层的顶部; 从支撑区域剥离氮化物层并在阵列和支撑区域上沉积多晶硅层; 应用掩模来图案化并在阵列中形成位线扩散螺柱着陆焊盘，并在支撑晶体管上形成栅极导体; 打击着陆板和门导体的顶部; 施加层间氧化层，然后在层间氧化层中开通通孔，以建立导电布线通道。

    METHOD FOR MANUFACTURING FUSIBLE LINKS IN A SEMICONDUCTOR DEVICE
    10.
    发明申请
    METHOD FOR MANUFACTURING FUSIBLE LINKS IN A SEMICONDUCTOR DEVICE 审中-公开
    用于在半导体器件中制造可熔连接的方法

    公开(公告)号：WO0118863A9

    公开(公告)日：2002-11-07

    申请号：PCT/US0024402

    申请日：2000-09-06

    Applicant: INFINEON TECHNOLOGIES CORP ,  IBM

    Inventor： BRINTZINGER AXEL ,  GAMBINO JEFFREY ,  RUPP THOMAS ,  HALLE SCOTT

    IPC: H01L23/525

    CPC classification number: H01L23/5256 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: In order to form a cavity for a fusible link in a semiconductor device, an etchable material is applied over and around a portion of the fusible link and the etchable material is coated with a protection layer. The access abutting the etchable material is formed through the protection layer. After the removal of the etchable material, the access is partially filled with a refilling material to thereby form the cavity.

    Abstract translation: 为了在半导体器件中形成用于可熔连接件的空腔，可蚀刻材料施加在可熔连接件的一部分上和周围，并且可蚀刻材料被涂覆有保护层。 通过保护层形成邻接可蚀刻材料的通路。 在去除可蚀刻材料之后，进入部分地填充有填充材料，从而形成空腔。

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