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公开(公告)号:DE102007012115A1
公开(公告)日:2008-06-05
申请号:DE102007012115
申请日:2007-03-13
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor: JAEGER ARNDT , STREUBEL KLAUS , STAUS PETER , KUHLMANN WERNER
Abstract: A radiation detector is disclosed with a detector arrangement, which has a plurality of detector elements, by means of which a detector signal is obtained during operation of the radiation detector, and with a control device, wherein the detector elements each have a spectral sensitivity distribution, and are suited for generating signals, at least one detector element comprises a compound semiconductor material, and this detector element is designed for detecting radiation in the visible spectral region, the radiation detector is designed such that the sensitivity distributions of the detector elements are used to form different spectral sensitivity channels of the radiation detector, a channel signal assigned to the respective sensitivity channel can be generated in these sensitivity channels using the detector elements, and the control device is designed such that the contributions of different channel signals to the detector signal of the radiation detector are differently controlled.
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公开(公告)号:DE102006046038A1
公开(公告)日:2008-04-03
申请号:DE102006046038
申请日:2006-09-28
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor: BOGNER GEORG , GROETSCH STEFAN , KIRCHBERGER GUENTER , STREUBEL KLAUS , WINDISCH REINER , WIRTH RALPH
IPC: H01L33/08
Abstract: The semiconductor body has two radiation-generating active layers, where each layer has a forward voltage (Uled). The active layers are adjusted to an operating voltage (Ub) such that a voltage (Uw) dropping at a series resistor formed in series to the active layers is larger as a voltage (Uh) dropping at the semiconductor body. The voltage (Uw) is smaller than the smallest forward voltage dropping in the semiconductor body.
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公开(公告)号:DE102005061346A1
公开(公告)日:2007-04-05
申请号:DE102005061346
申请日:2005-12-21
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor: STREUBEL KLAUS
Abstract: An optoelectronic chip comprises a thin-film semiconductor body (8) having a semiconductor layer sequence (20) with a radiation-producing active region (3) and a mechanically stable carrier layer (7) on the semiconductor layers. An independent claim is also included for a production process for the above chip.
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公开(公告)号:DE10354936A1
公开(公告)日:2005-04-28
申请号:DE10354936
申请日:2003-11-25
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor: STREUBEL KLAUS , ILLEK STEFAN , PIETZONKA INES , BRUNNER HERBERT
Abstract: A light-emitting semiconductor component comprises a mirror layer (15) on a main surface (4). The semiconductor body (1) is followed by a semiconductor converter (2). This is excited by light of wavelength lambda P produced in an active zone (3). The semiconductor converter emits light of wavelength lambda S1, which exceeds wavelength lambda P.
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公开(公告)号:DE10306311A1
公开(公告)日:2004-03-11
申请号:DE10306311
申请日:2003-02-14
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor: LINDER NORBERT , STREUBEL KLAUS , STAUSS PETER , HAMPEL MARK
Abstract: Radiation-emitting semiconductor component comprises an n-doped casing layer (18), a p-doped casing layer (20), an active layer (14) based on InGaAlP arranged between the casing layers, and a diffusion stop layer (16) having a tensioned superlattice arranged between the active layer and the p-doped casing layer.
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公开(公告)号:DE102008056175A1
公开(公告)日:2010-05-12
申请号:DE102008056175
申请日:2008-11-06
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor: LUGAUER HANS-JUERGEN , STRASBURG MARTIN , STREUBEL KLAUS , WINDISCH REINER , ENGL KARL
Abstract: A method of producing a radiation-emitting thin film component includes providing a substrate, growing nanorods on the substrate, growing a semiconductor layer sequence with at least one active layer epitaxially on the nanorods, applying a carrier to the semiconductor layer sequence, and detaching the semiconductor layer sequence and the carrier from the substrate by at least partial destruction of the nanorods.
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公开(公告)号:DE102008051050A1
公开(公告)日:2010-04-15
申请号:DE102008051050
申请日:2008-10-09
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor: MALM NORWIN VON , STREUBEL KLAUS
IPC: G05D25/02 , H01L25/075
Abstract: The module has a set of opto-electronic semiconductor elements (1, 2, 3) i.e. LED chip, each with semiconductor segments (5, 6, 7) connected in series for radiating electromagnetic radiations. The semiconductor segments are characterized by segment operating voltages that are connected in series define an operating voltage of the opto-electronic semiconductor elements. The operating voltages lie within a voltage range or within one of a group of preset voltage ranges, where one of the voltage ranges includes the weighted sum of the natural numbers with different voltage ranges.
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公开(公告)号:DE102008016095A1
公开(公告)日:2009-10-01
申请号:DE102008016095
申请日:2008-03-28
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor: ROSE MONIKA , STREUBEL KLAUS , REILL JOACHIM , MUSCHAWECK JULIUS , KOEHLER STEFFEN
IPC: H01L31/12
Abstract: The luminescent diode module has a luminescent diode chip (1), which produces light during operation. A light sensor (2) detects light incident on it during operation. A light conductor (3) guides the light produced by the luminescent diode chip to the light sensor. The luminescent diode chip and light sensor are arranged on a module support (8).
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公开(公告)号:DE102007041126A1
公开(公告)日:2009-03-05
申请号:DE102007041126
申请日:2007-08-30
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor: BRUNNER HERBERT , REILL JOACHIM , STREUBEL KLAUS , SCHWARZ RAIMUND , KOEHLER STEFFEN , BAADE TORSTEN
Abstract: The device has a device holder (1) and an opto-electronic component (2) i.e. LED, with a housing body. A semiconductor chip is provided for generating radiation, and a set of electrical connections (5) is used for operating the semiconductor chip. The chip is arranged within the housing body with a housing base (3). The housing base has a set of connecting components (4) for providing detachable mechanical connections. The base includes a heat deriving element, and the detachable connections are in screw connection with a stopper, where the screw connection is a bayonet joint. An independent claim is also included for a method for utilizing an opto-electronic component.
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公开(公告)号:DE102005056950A1
公开(公告)日:2007-04-05
申请号:DE102005056950
申请日:2005-11-29
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor: STREUBEL KLAUS , LINDER NOBERT , GROENNINGER GUENTHER , KUGLER SIEGMAR , HEIDBORN PETER
IPC: H01L31/0304 , H01L31/0352 , H01L31/109 , H01L33/02 , H01L33/04 , H01L33/30 , H01S5/02 , H01S5/30
Abstract: The gallium-arsenic semiconductor substrate (1) for production of electronic/optoelectronic semiconductor component (27), comprises sequence of semiconductor layers (2) that is applied on the substrate. The sequence of semiconductor layers are Al 1 - yGa yAs 1 - xP x with 0 =x=1 and 0 =y=1. The semiconductor layers exhibit a phosphorus content (x) that is larger than the underlying-, adjacent semiconductor layer in the growth direction of the sequence of semiconductor layers. The total thickness of the sequence of semiconductor layers is 10 mu m or less. The gallium-arsenic semiconductor substrate (1) for the production of electronic/optoelectronic semiconductor component (27), comprises sequence of semiconductor layers (2) applied on the substrate. The sequence of semiconductor layers are Al 1-yGa yAs 1-xP x with 0 =x=1 and 0 =y=1. The semiconductor layers exhibit a phosphorus content (x) that is larger than the underlying-, adjacent semiconductor layer in the growth direction of the sequence of semiconductor layers. The total thickness of the sequence of semiconductor layers is 10 mu m or less. The phosphorus content (x) rises gradually in three sequentially superimposed semiconductor layers of the sequence of semiconductor layers. The sequence of semiconductor layers contains a superlattice structure with alternating first semiconductor layers and second semiconductor layers. The first semiconductor layers contain a phosphorus content x 1>=0 and the second semiconductor layers contain a phosphorus content of x 2>=0 with x 1 not equal to x 2. The semiconductor layers exhibit a thickness between 100-1000 nm. The uppermost semiconductor layer (7) of the sequence of semiconductor layers exhibits a smaller lattice constant than its two preceding semiconductor layers and is relaxed. An independent claim is included for a semiconductor element.
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