公开(公告)号：DE102004047061A1

公开(公告)日：2006-04-06

申请号：DE102004047061

申请日：2004-09-28

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： HAHN BERTHOLD ,  BRUNNER HERBERT ,  GROETSCH STEFAN

IPC: H01L31/02 ,  H01L33/48 ,  H01L33/62

Abstract: The housing has a base plate with a chip carrier, and a chip frame to define a cavity for arranging a semiconductor chip. Two electrical conductors (6, 7) include chip contact areas (61, 71) on sides of the frame, which are turned away from the carrier. The conductors extend from the areas to sides of the carrier, which are turned away from the frame. The conductors are designed in the form of coatings of parts of the base plate. Independent claims are also included for the following: (A) an optoelectronic component with a housing for mounting a semiconductor chip (B) a method of manufacturing an optoelectronic component.

公开(公告)号：DE102005007601A1

公开(公告)日：2005-09-08

申请号：DE102005007601

申请日：2005-02-18

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： WIRTH RALPH ,  ILLEK STEFAN ,  EISSLER DIETER ,  BRUNNER HERBERT

IPC: H01L31/0224 ,  H01L33/38 ,  H01L33/00 ,  H01L31/102 ,  H01S5/02

Abstract: The component has a functional semiconductor area (2) with an active zone (400) and a lateral principal direction of extension. The area is provided with a breakthrough in the active zone. A connecting conductor material (8) is electrically isolated from the active zone in a subarea of the breakthrough and is arranged in a region of the breakthrough. The breakthrough is partially covered by an insulating material (10). Independent claims are also included for the following: (A) a device with optoelectronic components (B) a method for manufacturing an optoelectronic component.

公开(公告)号：DE50105626D1

公开(公告)日：2005-04-21

申请号：DE50105626

申请日：2001-05-16

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： BOGNER GEORG ,  BRUNNER HERBERT ,  HOEHN KLAUS

IPC: C08L63/00 ,  C08K5/00 ,  C08K5/13 ,  C08K5/17 ,  C08K5/3435 ,  H01L23/29 ,  H01L23/31 ,  H01L33/00 ,  H01L33/56

Abstract: Epoxy-resin systems resistant to aging, molded materials and components generated from them, and their utilization. An epoxy-resin system especially suitable in the application of casting-resin methods comprising an epoxide-containing A component based on a glycidyl ether or glycidyl ester and a B component containing anhydride as a hardener is proposed, where a sterically hindered amine is added to the A component as a stabilizer to prevent aging of molded materials. Light-emitting components potted with it exhibit increased aging stability, especially as with respect to light yield over time. The epoxy-resin system can also be used for encapsulants and molding compositions, and can be blended with acrylates, for all applications, particularly in the exterior.

公开(公告)号：DE10308917A1

公开(公告)日：2004-09-16

申请号：DE10308917

申请日：2003-02-28

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： HOEFER THOMAS ,  BRUNNER HERBERT ,  MOELLMER FRANK ,  WAITL GUENTER ,  SEWALD RAINER ,  ZEILER MARKUS

IPC: H01L33/48 ,  H01L33/62 ,  H01L33/00

Abstract: The opto electronic chip [50], eg a light emitting diode, is set at the centre of a dish shaped recess [12] formed in an insulating material. The surface is coated with a metallic reflective material. An isolating section [2] is used to form two reflective regions [16,18]. Connections are made with bond wires [35,52].

公开(公告)号：DE10257664A1

公开(公告)日：2004-07-08

申请号：DE10257664

申请日：2002-12-10

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： BRAUNE BERT ,  BRUNNER HERBERT

IPC: H01L33/38 ,  H01L33/50 ,  H01L33/00

Abstract: Production of a light source with mixed luminescent diodes comprises preparing a chip having a front side electrical contact in the form of an electrical contact surface (2), thickening the contact by applying an electrically conducting material (3) on the contact surface, and coating the chip with a luminescent conversion material (4).

公开(公告)号：DE10131698A1

公开(公告)日：2003-01-30

申请号：DE10131698

申请日：2001-06-29

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： BRUNNER HERBERT ,  HOEHN KLAUS ,  JAEGER HARALD ,  SCHMID JOSEF

IPC: H01L33/48 ,  H01L33/54 ,  H01L33/62 ,  H05K3/34 ,  H01L33/00

Abstract: A radiation-emitting surface-mountable component has a light-emitting diode chip mounted on a leadframe. A molding material encapsulates the leadframe and the light emitting diode chip.

公开(公告)号：DE10117890A1

公开(公告)日：2002-10-24

申请号：DE10117890

申请日：2001-04-10

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： BOGNER GEORG ,  BRUNNER HERBERT ,  WAITL GUENTER

IPC: H01L31/0203 ,  H01L31/0224 ,  H01L33/48 ,  H01L33/62 ,  H01S5/022 ,  H01S5/024 ,  H01L33/00

Abstract: Production of a semiconductor component which emits and receives radiation comprises forming and preparing an electrical leadframe (2); mounting a chip (5) ; placing an injection mold on the lead frame so that the semiconductor chip lies in a chip cavity of a molding stamp of the mold for a radiation window (8); extruding the leadframe with a housing base body (1); and encapsulating the chip. Production of a semiconductor component which emits and receives radiation comprises forming and preparing an electrical leadframe (2) having a chip assembly region, a wire connecting region (10) and external electrical connecting strips (3a, 3b); mounting a chip (5) which emits and receives radiation on the chip assembly region using a thermally conducting connecting material having a melting temperature above the solder temperature of the subsequent component steps; placing an injection mold on the lead frame so that the semiconductor chip lies in a chip cavity of a molding stamp of the mold for a radiation window (8); extruding the leadframe with a housing base body (1) so that the semiconductor chip is arranged in the window; and encapsulating the chip. An Independent claim is also included for a semiconductor component produced. Preferred Features: The connecting material is a hard solder. The melting point of the connecting material is 260 deg C or more. The chip is surrounded by a plastic composition.

公开(公告)号：DE59609374D1

公开(公告)日：2002-07-25

申请号：DE59609374

申请日：1996-09-13

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： ARNDT KARLHEINZ ,  BRUNNER HERBERT ,  SCHELLHORN FRANZ ,  WAITL GUENTHER

IPC: H01L31/02 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/024 ,  H01L33/48 ,  H01L33/60 ,  H01L33/64 ,  H01L33/00

Abstract: The semiconductor element includes a light transmitting and/or receiving semiconductor chip (1), a lead frame (2), and a sheathing (3). The chip is supported by the chip carrier surface of a lead frame. The chip carrier surface is recessed (4) in the region supporting the semiconductor chip, with the inside surfaces of the recess coated so that they act as a reflector for the transmitted and/or received light. Pref. part of the chip carrier surface is enclosed by the sheathing, with the terminals (11,12) for the semiconductor component extending from the sheathing on opposite sides. A connection part (10) to the terminals is provided at a distance from the chip carrier. The sheathing may be formed entirely from a transparent material, or from an opaque material with a window of a transparent material aligned with the part of the chip carrier surface supporting the semiconductor chip.

公开(公告)号：DE112020003396A5

公开(公告)日：2022-03-24

申请号：DE112020003396

申请日：2020-06-29

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： BOSS MARKUS ,  BRUNNER HERBERT

IPC: H01S5/022 ,  H01L33/44 ,  H01L33/52 ,  H01L33/62 ,  H01S5/02253 ,  H01S5/18

公开(公告)号：DE102008045653B4

公开(公告)日：2020-03-26

申请号：DE102008045653

申请日：2008-09-03

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： GÜNTHER EWALD KARL MICHAEL DR ,  ZEHNDER ULRICH DR ,  HERRMANN SIEGFRIED ,  BRUNNER HERBERT

IPC: H01L23/38 ,  H01L31/024 ,  H01L33/00

Abstract: Optoelektronisches Bauteil (1) als Lichtquelle, das zur Emission von Licht eingerichtet ist, mit- einem Träger (2) mit einer Montageseite (20) und mit mindestens einem Funktionselement (3),- mindestens einem substratlosen, optoelektronischen Halbleiterchip (4) mit einer Oberseite (44) und einer dieser gegenüberliegenden Unterseite (45) und einer elektrischen Kontaktierung des Halbleiterchips (4) über die Oberseite (44) und die Unterseite (45), wobei die Unterseite (45) der Montageseite (20) zugewandt und der Halbleiterchip (4) an der Montageseite (20) angebracht ist, und- mindestens einem elektrischen Kontaktfilm (5) an der Oberseite (44), wobei der Kontaktfilm (5) strukturiert ist, wobei- eine elektrische Leitung (6b) von dem Kontaktfilm (5) zur Montageseite (20) des Trägers (2) geführt ist und an einem Randbereich des Trägers (2) eine elektrische Anschlussstelle (17) bildet, und zur Vermeidung elektrischer Kurzschlüsse Seitenflächen der Halbleiterchips (4) mit einem Isolator (9) versehen sind, und die elektrische Leitung (6b) über den Isolator (9) verläuft,- der Halbleiterchip (4) als Leuchtdiode gestaltet ist, das Funktionselement (3) einen Schutz vor elektrostatischer Entladung aufweist,- das Funktionselement (3) in dem Träger (2), der mit dotiertem Silizium gestalteten ist, monolithisch integriert ist und das Funktionselement (3) genau einen gegenüber dem Träger (2) entgegengesetzt dotierten Bereich aufweist, der dem Halbleiterchip (4) zugeordnet ist,- sich der entgegengesetzt dotierte Bereich (13) ganz unterhalb des zugeordneten Halbleiterchips (4) befindet, in einer Schnittdarstellung und in Draufsicht auf die Montageseite (20) gesehen, sodass sich der Isolator (9) neben dem entgegengesetzt dotierten Bereich (13) befindet, und- über den Kontaktfilm (5) eine gleichmäßige Stromeinspeisung in den Halbleiterchip (4) über dessen gesamte Oberfläche (44) gewährleistet ist.