公开(公告)号：US5690270A

公开(公告)日：1997-11-25

申请号：US745782

申请日：1996-11-08

Applicant: John G. Gore

Inventor： John G. Gore

IPC: H05K1/02 ,  H05K1/14 ,  H05K3/28 ,  H05K3/30 ,  H05K3/34 ,  H05K3/36 ,  H05K1/00

CPC classification number: H05K1/141 ,  H05K1/0243 ,  H05K3/303 ,  H05K3/3426 ,  H05K3/3436 ,  H05K3/3442 ,  H05K3/3447 ,  H01L2224/16 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/3025 ,  H05K1/0271 ,  H05K2201/049 ,  H05K2201/09063 ,  H05K2201/09081 ,  H05K2201/09181 ,  H05K2201/0989 ,  H05K2201/09909 ,  H05K2201/10083 ,  H05K2201/10303 ,  H05K2201/10318 ,  H05K2201/10727 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10848 ,  H05K2201/10871 ,  H05K2201/10946 ,  H05K2201/10969 ,  H05K2201/10984 ,  H05K2203/041 ,  H05K3/28 ,  H05K3/3452 ,  H05K3/368 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49144

Abstract: A device and method for mounting a surface mount package onto a printed circuit board includes inserting a pin through a printed circuit board feedthrough for providing movement of the pin within the feedthrough. One end of the pin is soldered to conductive surfaces on the bottom side of the printed circuit board while the other end of the pin id soldered to a surface mount package pad. The package is mounted in a spaced relation with a printed circuit board top surface. The pin is soldered to the board conductive surface using a high temperature solder for forming a solder joint which remains solid during subsequent soldering using a low temperature solder such as a lead tin solder type. The pin is then soldered to the pad of the surface mount package using the low temperature lead tin solder for forming a solder joint between the pad and pin. The pin is sized for loosely fitting within the feedthrough and thus movement caused by a coefficient of thermal expansion mismatch between materials of the pad, pin, and printed circuit board is absorbed by movement of the pin within the feedthrough. As a result, stress relief is provided for the solder joints.

Abstract translation: 用于将表面贴装封装安装到印刷电路板上的装置和方法包括将引脚插入穿过印刷电路板馈通以提供销在馈通内的运动。 引脚的一端焊接到印刷电路板底部的导电表面，而引脚ID的另一端焊接到表面贴装封装焊盘。 封装以与印刷电路板顶表面间隔的关系安装。 使用高温焊料将引脚焊接到板导电表面，用于形成焊接接头，在使用诸如铅锡焊料类型的低温焊料的后续焊接期间保持固体。 然后使用低温铅锡焊料将引脚焊接到表面贴装封装的焊盘，以在焊盘和引脚之间形成焊接接头。 该销的尺寸适于松动地配合在馈通内，并且因此由焊盘，销和印刷电路板的材料之间的热膨胀失配系数引起的移动被引脚内的引脚的移动所吸收。 因此，为焊点提供了应力消除。

公开(公告)号：US5476211A

公开(公告)日：1995-12-19

申请号：US152812

申请日：1993-11-16

Applicant: Igor Y. Khandros

Inventor： Igor Y. Khandros

IPC: B23K1/00 ,  C23C18/16 ,  C25D7/12 ,  G01R1/04 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  G01R31/28 ,  H01L21/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L21/66 ,  H01L23/48 ,  H01L23/485 ,  H01L23/49 ,  H01L23/498 ,  H01L25/065 ,  H01L25/16 ,  H05K1/14 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H05K7/10 ,  B23K31/02 ,  B23K101/38

CPC classification number: H05K7/1069 ,  B23K1/0016 ,  C23C18/161 ,  C25D7/12 ,  G01R1/0466 ,  G01R31/2884 ,  H01L21/4853 ,  H01L21/563 ,  H01L21/6715 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3426 ,  H05K3/4015 ,  B23K2201/40 ,  G01R1/06711 ,  G01R1/06761 ,  G01R1/07307 ,  G01R3/00 ,  G01R31/2886 ,  H01L21/76897 ,  H01L2224/10126 ,  H01L2224/10145 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45109 ,  H01L2224/45111 ,  H01L2224/45116 ,  H01L2224/45117 ,  H01L2224/4512 ,  H01L2224/45123 ,  H01L2224/45124 ,  H01L2224/45138 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/45163 ,  H01L2224/45164 ,  H01L2224/45169 ,  H01L2224/45173 ,  H01L2224/45176 ,  H01L2224/4554 ,  H01L2224/4556 ,  H01L2224/456 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2224/85043 ,  H01L2224/85045 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/0106 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19107 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H05K1/141 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  H05K3/3421 ,  H05K3/368 ,  H05K3/4092 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49151 ,  Y10T29/49155 ,  Y10T29/49174 ,  Y10T29/49179 ,  Y10T29/49204 ,  Y10T29/49222 ,  Y10T29/49224 ,  Y10T29/49609

Abstract: A method for manufacturing raised contacts on the surface of an electronic component includes bonding one end of a wire to an area, such as a terminal, of the electronic component, and shaping the wire into a wire stem configuration (including straight, bent two-dimensionally, bent three-dimensionally). A coating, having one or more layers, is deposited on the wire stem to (i) impart resilient mechanical characteristics to the shaped wire stem and (ii) more securely attach ("anchor") the wire stem to the terminal. Gold is one of several materials described that may be selected for the wire stem. A variety of materials for the coating, and their mechanical properties, are described. The wire stems may be shaped as loops, for example originating and terminating on the same terminal of the electronic component, and overcoated with solder. The use of a barrier layer to prevent unwanted reactions between the wire stem and its environment (e.g., with a solder overcoat) is described. Bonding a second end of the wire to a sacrificial member, then removing the sacrificial member, is described. A plurality of wire stems may be formed on the surface of the electronic component, from different levels thereon, and may be severed so that their tips are coplanar with one another. Many wire stems can be mounted, for example in an array pattern, to one or to both sides of electronic components including semiconductor dies and wafers, plastic and ceramic semiconductor packages, and the like.

Abstract translation: 一种用于在电子部件的表面上制造凸起接触的方法包括将电线的一端接合到电子部件的诸如端子的区域，并将线成形为线杆构造（包括直的， 尺寸，三维弯曲）。 具有一个或多个层的涂层沉积在线杆上，以（i）赋予成形线杆弹性机械特性，和（ii）将线杆更牢固地附接（“锚定”）到终端。 金是描述的几种材料之一，可以选择线棒。 描述了用于涂层的各种材料及其机械性能。 线杆可以形成为环，例如起始和终止在电子部件的相同端子上，并用焊料覆盖。 描述了使用阻挡层来防止线杆与其环境之间的不期望的反应（例如，使用焊料外涂层）。 将导线的第二端接合到牺牲部件上，然后移除牺牲部件。 多个线杆可以从电子部件的表面上形成在其上的不同层面上，并且可以被切断，使得它们的尖端彼此共面。 许多线杆可以例如以阵列图形安装到包括半导体管芯和晶片的电子部件的一侧或两侧，塑料和陶瓷半导体封装等。

公开(公告)号：US5470796A

公开(公告)日：1995-11-28

申请号：US426536

申请日：1995-04-21

Applicant: Yutaka Tsukada ,  Yasukazu Kobayakawa ,  Yoji Maeda ,  Shuhei Tsuchita

Inventor： Yutaka Tsukada ,  Yasukazu Kobayakawa ,  Yoji Maeda ,  Shuhei Tsuchita

IPC: H01L23/50 ,  H01L23/498 ,  H05K1/18 ,  H05K3/34 ,  H01L21/60

CPC classification number: H01L23/49861 ,  H01L23/49805 ,  H01L23/4985 ,  H05K3/3426 ,  H01L2924/0002 ,  H05K2201/10424 ,  H05K2201/10689 ,  H05K2201/10727 ,  H05K2201/10946 ,  Y02P70/613

Abstract: An electronic package assembly wherein lead wires serve to connect conductors on a first substrate (e.g., ceramic) having a semiconductor device (e.g., IC chip) coupled to the conductors and positioned on the substrate, to respective conductors on a second substrate (e.g., a printed circuit board). The lead wires are secured to three different surfaces (e.g., top, side and bottom) of the first substrate, and include curved projection portions for being directly connected to the second substrate conductors.

Abstract translation: 一种电子封装组件，其中引线用于将具有半导体器件（例如，IC芯片）的第一衬底（例如，陶瓷）上的导体连接到导体并位于衬底上的第二衬底上的相应导体（例如， 印刷电路板）。 引线被固定到第一基板的三个不同的表面（例如，顶部，侧面和底部），并且包括用于直接连接到第二基板导体的弯曲突出部分。

公开(公告)号：US5394300A

公开(公告)日：1995-02-28

申请号：US002807

申请日：1993-01-11

Applicant: Yoshimasa Yoshimura

Inventor： Yoshimasa Yoshimura

IPC: B42D15/10 ,  G06K19/077 ,  H01R12/71 ,  H05K1/14 ,  H05K1/18 ,  H05K3/34 ,  H05K3/36

CPC classification number: G06K19/077 ,  H05K1/141 ,  H05K1/181 ,  H05K1/182 ,  H05K2201/09072 ,  H05K2201/10159 ,  H05K2201/10689 ,  H05K2201/10757 ,  H05K2201/10946 ,  H05K2203/1572 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/368

Abstract: In an IC memory card, sub-modules, in each of which a plurality of memory ICs are mounted on each of two opposed surfaces of a sub-substrate, are mounted on each of two opposed surfaces of a single substrate. Since the number of substrates connected to a connector is one, soldering of the connector is facilitated, and the structure of the connector can be simplified. Furthermore, in an IC memory card, the sub-modules may be mounted on the substrate in such a manner that they are stacked in two stages at an opening in the substrate. In this way, the thickness of the IC memory card can be minimized. Also, the use of the die bonding process makes connection between the sub-module and the substrate easy.

Abstract translation: 在IC存储卡中，在单个基板的两个相对的表面的每一个上安装在每个辅助基板的两个相对的表面中的每一个上安装多个存储器IC的子模块。 由于连接到连接器的基板的数量为一个，所以连接器的焊接变得容易，并且可以简化连接器的结构。 此外，在IC存储卡中，子模块可以以这样的方式安装在基板上，使得它们在基板的开口处分成两层。 以这种方式，可以将IC存储卡的厚度最小化。 此外，使用芯片接合工艺使得子模块和基板之间的连接变得容易。

公开(公告)号：US5184400A

公开(公告)日：1993-02-09

申请号：US822628

申请日：1992-01-17

Applicant: Seymour R. Cray ,  Nicholas J. Krajewski

Inventor： Seymour R. Cray ,  Nicholas J. Krajewski

IPC: H01L21/48 ,  H01L21/607 ,  H01R43/02 ,  H05K3/30 ,  H05K3/32 ,  H05K3/36

CPC classification number: H01L24/11 ,  H01L21/4853 ,  H01R12/523 ,  H05K3/308 ,  H05K3/328 ,  H05K3/36 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4943 ,  H01L2225/06524 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06589 ,  H01L2225/06593 ,  H01L2225/06596 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/3011 ,  H05K2201/096 ,  H05K2201/1059 ,  H05K2201/10825 ,  H05K2201/10909 ,  H05K2201/10946 ,  H05K2203/0495 ,  H05K3/368 ,  Y10T29/4921 ,  Y10T29/49213

Abstract: A method and apparatus for interconnecting electronic circuit boards through the use of twisted wire jumpers which are formed from multifilament wire and which have enlarged bird cages formed along the pins. The pins are drawn through a stack of circuit boards to position the cages in contact with interconnection apertures located in the printed circuit boards. The frictional engagement of the cages in the apertures provides both electrical inter connection of, and mechanical coupling between the printed circuit boards.

Abstract translation: 一种用于通过使用由多丝线形成并且具有沿着销形成的扩大的鸟笼的双绞线跳线来互连电子电路板的方法和装置。 引脚穿过电路板堆叠，以将网格定位成与位于印刷电路板中的互连孔接触。 保持架在孔中的摩擦接合提供印刷电路板之间的电连接和机械耦合。

公开(公告)号：US5173574A

公开(公告)日：1992-12-22

申请号：US720912

申请日：1991-06-25

Applicant: Heinz Kraus

Inventor： Heinz Kraus

IPC: H01L21/60 ,  H01L23/52 ,  H01L31/02 ,  H05K3/34

CPC classification number: H05K3/3426 ,  H01L23/52 ,  H01L24/36 ,  H01L24/40 ,  H01L2224/37011 ,  H01L2224/40225 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H05K2201/10477 ,  H05K2201/10924 ,  H05K2201/10946 ,  H05K2201/10969 ,  Y02P70/613 ,  Y10T29/49144

Abstract: A soldering connector and a method for manufacturing an electric circuit with this soldering connector. The soldering connector serves to bridge several contact surfaces. The soldering connector includes several soldering jumpers which include a common support and are of an electrically conductive material and are formed in a single piece with the support and are constructed in a cantilevering manner. Predetermined breaking points are provided between the support and the soldering jumpers, so that the common support can be severed after the soldering procedure by simply tearing it off from the soldering jumper.

Abstract translation: 焊接连接器和使用该焊接连接器制造电路的方法。 焊接连接器用于桥接几个接触表面。 焊接连接器包括几个焊接跳线，其包括公共支撑件并且是导电材料，并且与支撑件形成为单件并且以悬臂方式构造。 在支撑和焊接跳线之间提供了预定的断点，从而通过简单地从焊接跳线上撕下来，可以在焊接过程之后切断共同的支撑。

公开(公告)号：US5105261A

公开(公告)日：1992-04-14

申请号：US758719

申请日：1991-09-09

Applicant: Tetsuya Ueda ,  Toru Tachikawa ,  Masataka Takehara

Inventor： Tetsuya Ueda ,  Toru Tachikawa ,  Masataka Takehara

IPC: H05K1/18 ,  H01L23/495 ,  H01L23/50 ,  H01L25/00 ,  H01L25/10 ,  H01L25/11 ,  H01L25/18 ,  H05K1/14 ,  H05K3/36

CPC classification number: H05K1/145 ,  H01L23/49555 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/181 ,  H05K2201/09709 ,  H05K2201/10946

Abstract: The semiconductor device has leads projecting from at least two sides of all of a package which are bent in a zigzag manner so that ends of the leads lie on at least two planes. The semiconductor device may be mounted across a plurality of printed circuit boards by fixing a part of the leads from one side to a first board and fixing a remaining part of the leads from the other side to a second board, or by fixing a part of the leads on one plane to a first board and fixing a remaining part of the leads on the other plane to a second board.

Abstract translation: 半导体器件具有从所有封装的至少两侧突出的引线，其以锯齿形的方式弯曲，使得引线的端部位于至少两个平面上。 半导体器件可以通过将一部分引线从一侧固定到第一板并将引线的剩余部分从另一侧固定到第二板，或者通过固定一部分 将一个平面上的引线连接到第一板，并将另一个平面上的引线的剩余部分固定到第二板。

公开(公告)号：US4712721A

公开(公告)日：1987-12-15

申请号：US840624

申请日：1986-03-17

Applicant: Raymond Noel ,  William M. Robinson ,  Gabe Cherian ,  Thomas H. Clifford ,  William D. Carlomagno ,  William M. Deasy ,  Willie K. Grassauer ,  David K. Haygood ,  H. Paul Sherlock ,  Harry E. White

Inventor： Raymond Noel ,  William M. Robinson ,  Gabe Cherian ,  Thomas H. Clifford ,  William D. Carlomagno ,  William M. Deasy ,  Willie K. Grassauer ,  David K. Haygood ,  H. Paul Sherlock ,  Harry E. White

IPC: B23K3/06 ,  H05K3/34 ,  H01L21/58 ,  B23K1/12

CPC classification number: H05K3/3478 ,  B23K3/06 ,  H05K2201/0125 ,  H05K2201/10424 ,  H05K2201/10727 ,  H05K2201/10946 ,  H05K2203/0113 ,  H05K2203/0235 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K2203/0415 ,  H05K2203/0726 ,  H05K3/3473 ,  H05K3/3484

Abstract: Mechanical means and methods for delivery of solder preforms arranged in generally rectilinear patterns and oriented so that the ends of the solder preforms may join two planar surfaces upon the application of heat are disclosed. Several embodiments facilitate the delivery of solder preforms in the forms of posts, clips and rings.

Abstract translation: 用于传送以大致直线图案布置的焊料预成型件的机械装置和方法，并且被定向成使得焊料预制件的端部在施加热时可以连接两个平坦表面。 几个实施例有助于以柱，夹和环的形式递送焊料预制件。

公开(公告)号：US4640499A

公开(公告)日：1987-02-03

申请号：US729389

申请日：1985-05-01

Applicant: Paul F. Hemler ,  William A. Rohr

Inventor： Paul F. Hemler ,  William A. Rohr

IPC: H05K1/02 ,  H05K3/34 ,  F16F1/00

CPC classification number: H05K3/3426 ,  H05K1/0271 ,  H05K2201/10727 ,  H05K2201/10757 ,  H05K2201/10946 ,  Y02P70/613

Abstract: Compliant soldering pads allow for expansion and contraction between an hermetic chip carriers (HCC) and printed wiring boards (PWB) due to coefficient of thermal expansion mismatch and prevent solder cracking which in turn causes electrical discontinuities. The pads allow for flexing in three axes.

Abstract translation: 符合标准的焊盘允许由于热膨胀失配系数而在密封芯片载体（HCC）和印刷电路板（PWB）之间的膨胀和收缩，并防止焊料开裂，从而导致电气不连续性。 焊盘允许在三个轴上弯曲。

公开(公告)号：US4630174A

公开(公告)日：1986-12-16

申请号：US546990

申请日：1983-10-31

Applicant: Lance R. Kaufman

Inventor： Lance R. Kaufman

IPC: H01L23/495 ,  H01L25/07 ,  H05K3/32 ,  H05K3/34 ,  H05K1/18

CPC classification number: H05K3/325 ,  H01L23/49541 ,  H01L23/49575 ,  H01L25/072 ,  H01L2924/0002 ,  H05K2201/10409 ,  H05K2201/10659 ,  H05K2201/10924 ,  H05K2201/10946 ,  H05K3/3447

Abstract: A circuit package 2 is provided for heat dissipating power semiconductors and the like. Circuit means 10, including lead frames 12 and power conditioning components 13, is mounted on an electrically insulating thermally conductive substrate 4 and covered by an electrically insulating housing 6. Power lead frames 14 extend integrally externally of the housing 6 and have external portions 22 bent laterally across the to surface of the housing 6 to cooperate with terminal connection means 28 there below in the top wall 24 of the housing 6. Internal connection means 50 is provided for selectively connecting a peripheral power lead frame portion 46 to a central portion 52 of circuit means 10 and insulatively bypassing designated portions 54 of circuit means 10 therebetween. In one embodiment, circuit package 2 is provided in combination with an external printed circuit board 40 extending across the top surface 24 of the housing and connected to control lead frames 18 and power lead frames 14.

Abstract translation: 为散热功率半导体等提供电路封装2。 包括引线框架12和功率调节部件13的电路装置10安装在电绝缘导热基板4上并被电绝缘壳体6覆盖。电源引线框架14在壳体6的外部整体延伸，并且外部部分22弯曲 横向跨过壳体6的表面，以与下面的端子连接装置28在壳体6的顶壁24中配合。内部连接装置50用于选择性地将外围电源引线框架部分46连接到壳体6的中心部分52 电路装置10并且间隔地旁路电路装置10的指定部分54。 在一个实施例中，电路封装2与外部印刷电路板40组合提供，该外部印刷电路板40延伸穿过壳体的顶表面24并连接到控制引线框架18和电源引线框架14。