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公开(公告)号：DE102006046038A1
公开(公告)日：2008-04-03
申请号：DE102006046038
申请日：2006-09-28
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor： BOGNER GEORG , GROETSCH STEFAN , KIRCHBERGER GUENTER , STREUBEL KLAUS , WINDISCH REINER , WIRTH RALPH
IPC: H01L33/08
Abstract: The semiconductor body has two radiation-generating active layers, where each layer has a forward voltage (Uled). The active layers are adjusted to an operating voltage (Ub) such that a voltage (Uw) dropping at a series resistor formed in series to the active layers is larger as a voltage (Uh) dropping at the semiconductor body. The voltage (Uw) is smaller than the smallest forward voltage dropping in the semiconductor body.
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公开(公告)号：CH696412A5
公开(公告)日：2007-05-31
申请号：CH882005
申请日：2003-06-10
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor： GROETSCH STEFAN
IPC: H01L23/473 , H01S5/024 , B81B1/00 , H01S5/40
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公开(公告)号：DE102005054955A1
公开(公告)日：2007-04-26
申请号：DE102005054955
申请日：2005-11-17
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor： KUDAEV SERGEY , MOFFAT BRYCE ANTON , SCHREIBER PETER , GROETSCH STEFAN
Abstract: A light-emitting module is specified, comprising at least two light sources disposed on a common carrier. At least one of said light sources includes at least two LED chips. Each light source of the module is followed downstream by an optic body of an optical element, and the optic bodies are suitable for guiding electromagnetic radiation to a light exit surface of the optical element. An optical projection apparatus comprising such a light-emitting module is also specified.
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公开(公告)号：DE102005009060A1
公开(公告)日：2006-09-07
申请号：DE102005009060
申请日：2005-02-28
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor： GROETSCH STEFAN , HAHN BERTHOLD , ILLEK STEFAN , SCHNABEL WOLFGANG
Abstract: A module comprising a regular arrangement of individual radiation-emitting semiconductor bodies (1) which are applied on a mounting area (6) of a carrier (2), wherein a wire connection is fitted between two adjacent radiation-emitting semiconductor bodies (1) on a top side, opposite to the mounting area (6), of the two radiation-emitting semiconductor bodies (1).
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公开(公告)号：DE102004056252A1
公开(公告)日：2006-05-04
申请号：DE102004056252
申请日：2004-11-22
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor： ENGL MORITZ , WANNINGER MARIO , SAILER MICHAEL , HUBER RAINER , REILL JOACHIM , LANG KURT-JUERGEN , HOFMANN MARKUS , GROETSCH STEFAN
Abstract: Disclosed is a lighting device comprising at least one LED and at least one optical element, wherein the LED and the optical element are aligned with each other by means of at least one dowel pin. A method of making such a lighting device is also specified. The described lighting device is particularly well suited for use in a vehicle headlight.
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Patent Agency Ranking
公开(公告)号：DE102004031391A1
公开(公告)日：2006-01-26
申请号：DE102004031391
申请日：2004-06-29
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor： HIEGLER MICHAEL , SCHMID JOSEF , ENGL MORITZ , GROETSCH STEFAN , ARNDT KARLHEINZ , SCHNEIDER MARKUS , BOGNER GEORG
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公开(公告)号：DE102004045947A1
公开(公告)日：2006-01-19
申请号：DE102004045947
申请日：2004-09-22
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor： WAITL GUENTER , BOGNER GEORG , GROETSCH STEFAN , WANNINGER MARIO
Abstract: The assembly has a light-emitting chip (1) with a radiation decoupling surface (2), via which the greater part of the electromagnetic radiation that is generated in the chip emerges in a primary emission direction. The chip is placed on a heat sink (4). A housing (5) laterally surrounds the chip and a reflective lens (6) is situated downstream of the surface (2) in the primary emission direction. An independent claim is also included for a utilization of the light emitting assembly in equipment such as camera mobile phone, digital camera or video camera.
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公开(公告)号：DE102004012014A1
公开(公告)日：2005-10-13
申请号：DE102004012014
申请日：2004-03-11
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor： SPAETH WERNER , GRAMANN WOLFGANG , GROETSCH STEFAN , SCHWARZ THOMAS , STEEGMUELLER ULRICH , KUEHNELT MICHAEL
IPC: H01S3/094 , H01S3/0941 , H01S3/109 , H01S5/00 , H01S5/02 , H01S5/022 , H01S5/024 , H01S5/04 , H01S5/06 , H01S5/14 , H01S5/183
Abstract: Surface emitting laser comprises semiconductor chip (1), external resonator mirror (2) and at least one optical pumping device (3) of chip. Pumping device contains pump laser (4), beam shaper (5), reverse element (8) and concave mirror (9). Pumping device includes assembly platform (6) for its elements with main surface (7) facing elements of pumping device. Preferably platform main surface is located orthogonally to main radiation direction (11) of surface emitting laser.
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公开(公告)号：DE102004015446A1
公开(公告)日：2005-08-04
申请号：DE102004015446
申请日：2004-03-30
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor： SCHWARZ THOMAS , STEEGMUELLER ULRICH , KUEHNELT MICHAEL , GROETSCH STEFAN
IPC: H01S5/024
Abstract: Laminated heat sink (1) for discrete semiconductor component (9) with first expansion coefficient has top (5) and bottom side (6), adjacent to which is metal outer layer (7,8) with second expansion coefficient.Inner layer (2) of semiconductor material has third expansion coefficient and is mechanically coupled to outer layer thus outer layer of top or bottom side has expansion coefficient approximately as first expansion coefficient of semiconductor component. Independent claims are included for electronic module with heat sink and method for forming such heat sink.
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公开(公告)号：DE10355600A1
公开(公告)日：2005-06-30
申请号：DE10355600
申请日：2003-11-28
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor： HAHN BERTHOLD , ILLEK STEFAN , GROETSCH STEFAN , PLOESL ANDREAS
IPC: H01L23/13 , H01L23/15 , H01L23/367 , H01L23/373 , H01L33/00 , H01L33/62 , H01L33/64 , H01S5/02 , H01S5/183 , H01L23/12
Abstract: A substrate layer (1) for the manufacture of a semiconductor chip incorporates a layer of electrical insulation (2) containing a ceramic- or aluminum nitride (AIN)-ceramic material.
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