公开(公告)号：WO2003022021A1

公开(公告)日：2003-03-13

申请号：PCT/US2002/026030

申请日：2002-08-15

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： YANG, Rui ,  MAO, Guoping

IPC: H05K3/00

CPC classification number: C09K13/02 ,  C08J7/12 ,  H05K3/002 ,  H05K3/381 ,  H05K2201/0141 ,  H05K2201/0397 ,  H05K2203/0786

Abstract: A process for providing a metal-seeded liquid crystal polymer comprises the steps of providing a liquid crystal polymer substrate, applying an aqueous solution comprising an alkali metal hydroxide and a solubilizer, to etch the liquid crystal polymer substrate, and depositing an adherent metal layer on the etched liquid crystal polymer substrate using electroless metal plating or vacuum deposition of metal. When using electroless metal plating, a tin(II) solution applied to the liquid crystal polymer substrate, followed by application of a palladium(II) solution, provides a metal-seeded liquid crystal polymer. An aqueous solution, comprising from 35wt.% to 55wt.% of an alkali metal salt, and from 10wt.% to 35wt.% of a solubilizer, provides an etchant for the liquid crystal polymer at temperatures from 50°C to 120°C. A flexible circuit comprising a liquid crystal polymer film having through-holes and related shaped voids may be formed using the etchant compositions previously described.

Abstract translation: 提供金属种子液晶聚合物的方法包括以下步骤：提供液晶聚合物基材，施加包含碱金属氢氧化物和增溶剂的水溶液以蚀刻液晶聚合物基材，并将粘附金属层沉积在 使用化学镀金属或真空沉积金属的蚀刻液晶聚合物基材。 当使用化学镀金属时，施加到液晶聚合物基底上的锡（II）溶液，然后施加钯（II）溶液，提供金属种子液晶聚合物。 包含35重量％至55重量％的碱金属盐和10重量％至35重量％的增溶剂的水溶液在50℃至120℃的温度下提供液晶聚合物的蚀刻剂 包括具有通孔的液晶聚合物膜和相关形状的空隙的柔性电路可以使用之前描述的蚀刻剂组合物形成。

公开(公告)号：WO2002089543A1

公开(公告)日：2002-11-07

申请号：PCT/US2002/013272

申请日：2002-04-26

Applicant: HEWLETT-PACKARD COMPANY

Inventor： PAN, Alfred, I-Tsung

IPC: H05K3/28

CPC classification number: B41J2/16 ,  B41J2/14072 ,  B41J2/1643 ,  H05K1/184 ,  H05K1/189 ,  H05K3/28 ,  H05K2201/0397 ,  H05K2201/10674 ,  H05K2203/135 ,  Y10T29/49083 ,  Y10T29/49146 ,  Y10T29/49171 ,  Y10T29/49401

Abstract: A method, and structure formed thereof, for processing an exposed conductive connection between an thermal inkjet print head device (12) and a flexible tape circuit (15) connectable to control signals for driving the inkjet device. According to the method of processing, the exposed conductive connection (14, 16) is electrophoretically plated with a polymer (19) to protect it against corrosive damage by coupling the exposed conductive connection (14, 16) to a first voltage potential and immersing it into an electrophoretic polymer solution in contact with an electrode at a second voltage potential thereby establishing a current between the electrode and the exposed connection (14, 16) such that the exposed connection (14, 16) is coated with a thin film of polymer (19) of uniform thickness.

Abstract translation: 一种用于处理热喷墨打印头装置（12）和柔性带电路（15）之间的暴露的导电连接的方法及其结构，可连接到用于驱动喷墨装置的控制信号。 根据处理方法，暴露的导电连接（14,16）用聚合物（19）电泳电镀，以通过将暴露的导电连接（14,16）耦合到第一电压电位并将其浸入其中来保护其免受腐蚀性损坏 成为在第二电压电位下与电极接触的电泳聚合物溶液，从而在电极和暴露的连接（14,16）之间建立电流，使得暴露的连接（14,16）涂覆有聚合物薄膜 19）均匀厚度。

公开(公告)号：WO02034022A1

公开(公告)日：2002-04-25

申请号：PCT/DE2001/003953

申请日：2001-10-16

IPC: H01L23/32 ,  H05K1/02 ,  H05K1/11 ,  H05K3/20 ,  H05K3/34 ,  H05K7/08

CPC classification number: H05K1/116 ,  H05K1/0201 ,  H05K3/202 ,  H05K3/3447 ,  H05K2201/0382 ,  H05K2201/0397 ,  H05K2201/062 ,  H05K2201/0969

Abstract: The invention relates to a module support (1), for electrical/electronic components (7), comprising a conductor arrangement with several metallic conductors (2), formed from a stamped grid and an insulating material shell (3) in which the metallic conductors (2) are at least partly embedded. At least one contact section (10) of a metallic conductor (2), for contacting a connector element (8) on an electrical/electronic component (7), is arranged in a through recess (6) in the insulating material shell (3). According to the invention, damage to the insulating material shell (3), on soldering the contact section (10), may be avoided, whereby the at least one contact section (10) of the metallic conductor (2) is completely removed from the shell of insulating material and is only electrically connected to a section (12) of the conductor (2), arranged on the inner wall of the recess (6), by means of at least one connector bridge (11), arranged in said recess (6). The heat-conducting cross-sectional area of the at least one connector bridge (11) is small, in such a way that, on a strong heating of the contact section (10), the connector bridge (11) causes a reduction in the flow of heat to the section (12) of the conductor (2) arranged on the inner wall of the recess (6), which has a larger heat-conducting cross-sectional area.

Abstract translation: 在用于（7），其包括具有多个的冲压格栅的金属导体构成的导体图案的电气/电子部件的安装架（1）（2）和绝缘外壳（3），其中，所述金属导体（2）至少部分地嵌入，其中 至少一个用于以连续凹部（6）（3）被布置在绝缘外壳的，以便防止在绝缘外壳的损坏的金属导体（2）的连接元件（8）的电气/电子部件（7）提供的接触部分（10）接触 （3）的接触部分（10），所述金属导体的所述至少一个接触部分（10）的焊接过程中提出的（2）完全从外壳中排除与在凹部由布置在至少一个绝缘材料和排他地（6）连接腹板（11） 布置有在凹部（6）部分的他内壁 导体的ITT（12）（2）传导地连接时，所述热传导的所述至少一个连接腹板的横截面（11）在形成这样的小，在接触部分（10）的一个强烈的加热的连接腹板（11）连接到散热器上的节流 布置在凹部（6）的内壁，所述导体的更大的热传导切片部分（12）（2）进行。

公开(公告)号：WO01069990A1

公开(公告)日：2001-09-20

申请号：PCT/JP2001/001994

申请日：2001-03-14

IPC: H05K1/00 ,  H05K1/11 ,  H05K3/34 ,  H05K3/40 ,  H05K1/18

CPC classification number: H05K3/3447 ,  H05K1/0293 ,  H05K1/115 ,  H05K1/116 ,  H05K3/3452 ,  H05K3/3463 ,  H05K3/4092 ,  H05K2201/0373 ,  H05K2201/0397 ,  H05K2201/09663 ,  H05K2201/0979 ,  H05K2201/099

Abstract: A bonded structure comprising a board provided with a through hole, a land disposed on the periphery of the through hole, and a lead led out from an electronic part and placed in the through hole. The land comprises an wall face land part on the wall face of the through hole, and front and rear surface land parts on the front and rear surfaces of the board. A fillet for connecting the land with the lead comprises upper and lower fillets parts touching the front and rear surface land parts, respectively, wherein the contour of the upper fillet is smaller than the contour of the lower fillet but larger than the size of the through hole. When a lead-free solder material is employed, occurrence of liftoff can be reduced effectively as compared with a conventional one.

Abstract translation: 一种粘合结构，包括设置有通孔的板，设置在通孔周边的焊盘以及从电子部件引出并放置在通孔中的引线。 该台面包括在通孔的壁面上的壁面陆部，以及板的前表面和后表面上的前表面和后表面。 用于将土地与导线连接的圆角分别包括接触前表面和后表面陆部的上下圆角部分，其中上圆角的轮廓小于下圆角的轮廓，但大于通孔的尺寸 孔。 当采用无铅焊料材料时，与常规焊料材料相比，能够有效地降低脱模的发生。

公开(公告)号：WO1995014314A1

公开(公告)日：1995-05-26

申请号：PCT/US1994013373

申请日：1994-11-16

Applicant: FORMFACTOR, INC.

Inventor： FORMFACTOR, INC. ,  KHANDROS, Igor, Y. ,  MATHIEU, Gaetan, L.

IPC: H01R09/00

CPC classification number: H05K7/1069 ,  B23K2101/40 ,  G01R1/0466 ,  G01R1/0483 ,  G01R1/06711 ,  G01R1/06716 ,  G01R1/06761 ,  G01R1/07314 ,  G01R1/07342 ,  G01R1/07357 ,  G01R3/00 ,  G01R31/2884 ,  G01R31/2886 ,  H01L21/4853 ,  H01L21/563 ,  H01L21/67138 ,  H01L21/6715 ,  H01L22/20 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/45 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/06153 ,  H01L2224/1134 ,  H01L2224/13083 ,  H01L2224/13099 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/136 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/78301 ,  H01L2224/81801 ,  H01L2224/85045 ,  H01L2224/85205 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01055 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15312 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H05K1/141 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/368 ,  H05K3/4015 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49124 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49162 ,  Y10T29/49169 ,  Y10T29/49217 ,  Y10T29/49224 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2224/81205

Abstract: An interconnection contact structure assembly including an electronic component (102) having a surface and a conductive contact terminal (103) carried by the electronic component (102) and accessible at the surface. The contact structure (101) includes an internal flexible elongate member (106) having first (107) and second ends (108) and with the first end (107) forming a first intimate bond to the surface of the conductive contact terminal (103) without the use of a separate bonding material. An electrically conductive shell (116) is provided and is formed of at least one layer of a conductive material enveloping the elongate member (106) and forming a second intimate bond with at least a portion of the conductive contact terminal immediately adjacent the first intimate bond.

Abstract translation: 一种互连接触结构组件，包括具有表面的电子部件（102）和由所述电子部件（102）承载且可在所述表面处接近的导电接触端子（103）。 接触结构（101）包括具有第一（107）和第二端（108）的内部柔性细长构件（106），并且第一端（107）形成与导电接触端子（103）的表面的第一紧密接合， 而不使用单独的粘合材料。 提供导电外壳（116）并且由至少一层导电材料形成，该导电材料包围细长构件（106），并形成与紧邻第一紧密接合点的导电接触端子的至少一部分的第二紧密接合 。

公开(公告)号：WO1993026146A1

公开(公告)日：1993-12-23

申请号：PCT/CH1993000148

申请日：1993-06-10

Applicant: DYCONEX PATENTE AG ,  SCHMIDT, Walter ,  MARTINELLI, Marco

Inventor： DYCONEX PATENTE AG

IPC: H05K07/20

CPC classification number: H05K7/205 ,  H05K1/0206 ,  H05K1/0287 ,  H05K1/0289 ,  H05K1/0393 ,  H05K1/05 ,  H05K1/115 ,  H05K3/0041 ,  H05K3/0061 ,  H05K3/0064 ,  H05K3/0097 ,  H05K3/386 ,  H05K3/427 ,  H05K3/429 ,  H05K3/4652 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/066 ,  H05K2201/0909 ,  H05K2201/09327 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09554 ,  H05K2201/09572 ,  H05K2201/09609 ,  H05K2201/09627 ,  H05K2201/09781 ,  H05K2201/09836 ,  H05K2201/09945 ,  H05K2201/10666 ,  H05K2203/0554 ,  H05K2203/0746 ,  H05K2203/1184 ,  H05K2203/1545 ,  H05K2203/1572

Abstract: According to a process for producing a thermal layout, not only massive heat sinks are provided for absorbing heat, but also an optimized number of thermoconductive strips which distribute the heat over the printed circuit board. In the collecting zones are arranged higher capacity sinks into which the heat is transmitted. The thermoconductive strips may be thermoconductors (TL) provided for that purpose and more massive than the conductive strips for the electric connections, or conductive strips for electric connections, the electroconductors (EL), may also be used for heat transfer. An optimum design interconnects the TL'S and EL's into a functional whole, a thermal management network. With a certain technique, which could be called pocket groove technique, "cooling channels" of a type may be created. Such thermoconductors may be included in the electric layout, so that a thermal layout is superimposed on the connection layout (TL/EL network). Heat distribution and transfer may thus be calculated and optimized by a computer in the same way as the electric distribution by the conductive strips, i.e. the known electric layout, which is produced by a computer-assisted process.

公开(公告)号：WO1993003593A1

公开(公告)日：1993-02-18

申请号：PCT/EP1992001522

申请日：1992-07-06

Applicant: PROKOPP, Manfred ,  POSKACHEEV, Andrew

IPC: H05K03/40

CPC classification number: H05K3/4046 ,  H01R12/523 ,  H05K3/0035 ,  H05K3/328 ,  H05K3/4015 ,  H05K3/4084 ,  H05K3/4623 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09509 ,  H05K2201/10234 ,  H05K2201/10303 ,  H05K2201/10416 ,  H05K2201/10628 ,  H05K2201/10916 ,  H05K2203/0271 ,  H05K2203/0285 ,  H05K2203/1184 ,  H05K2203/1189

Abstract: The invention relates to an electrical connection, especially a through contact, between at least two conductive layers, especially conductive tracks or the like on printed circuit boards, preferably multilayer printed circuit boards, with said connection formed by an electrically conductive track running transversely to the layers and contacting them. The connecting track is formed by a separately manufactured conductive connection section (6) subsequently applied to the printed circuit board (1) and is soldered to the layers (2).

公开(公告)号：WO2015087692A1

公开(公告)日：2015-06-18

申请号：PCT/JP2014/080987

申请日：2014-11-24

Applicant: 株式会社 豊田自動織機

Inventor： 尾崎　公教 ,  郡司　隆宏

IPC: H05K3/34

CPC classification number: H05K3/3442 ,  H05K1/0263 ,  H05K1/111 ,  H05K2201/0397 ,  H05K2201/09745 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613

Abstract: 金属板（１２）は、電子部品（１３）を実装するための実装面に形成された閉環状の溝部（２０）によって囲まれた半田塗布部（３０）を含む。半田塗布部（３０）は、電子部品（１３）の電極（１３ｂ）が搭載される搭載領域（Ｚ１）を含む平面視長方形状の第１領域（３１）と、第１領域（３１）に直交する第２領域（３２）と、第１領域（３１）と第２領域（３２）とを繋ぐ両角部に形成される一対の第３領域（３３）とを有する。

Abstract translation: 该金属基板（12）具有由安装有电子部件（13）的安装面形成的封闭环形槽（20）所包围的焊料涂布部（30）。 所述焊料涂覆部分（30）包括以下：第一区域（31），其在平面图中为矩形并且包含其中放置有电子部件（13）的电极（13b）的放置区域（Z1） 垂直于所述第一区域（31）的第二区域（32）; 以及连接第一区域（31）和第二区域（32）的角部分中的一对第三区域（33）。

公开(公告)号：WO2015012611A1

公开(公告)日：2015-01-29

申请号：PCT/KR2014/006735

申请日：2014-07-24

Applicant: 주식회사 엘지화학

Inventor： 오덕수 ,  박성수 ,  강민수

IPC: H01L51/52 ,  H05B33/06 ,  G09F9/00

CPC classification number: H05K3/363 ,  H01L51/0097 ,  H01L51/5246 ,  H05K1/115 ,  H05K1/14 ,  H05K1/147 ,  H05K1/189 ,  H05K3/323 ,  H05K3/361 ,  H05K3/4644 ,  H05K2201/0397 ,  H05K2201/058 ,  H05K2201/09563 ,  H05K2201/10128

Abstract: 본 명세서의 일 실시예는 양극， 음극 및 상기 양극과 음극 사이에 배치된 1층 이상의 유기물 층을 포함하는 발광부와 이의 외측에 위치하는 비발광부를 포함하는 기판， 상기 비발광부에 위치되는 2 이상의 연성인쇄회로기판， 및 상기 연성인쇄회로기판들 중 단부가 서로 이웃하는 것을 통전하는 납램부 및 와이어 본딩부 중 어느 하나 이상을 포함하는 유기 발광 소자를 제 공한다.

Abstract translation: 提供一种有机发光元件，根据本说明书的一个实施方案，包括：具有包括阴极，阳极和布置在其间的一个或多个有机材料层的发光部分的基板和非发光部分 在发光部的外侧; 位于非发光部分上的两个或多个柔性印刷电路板; 以及用于电连接柔性印刷电路板的相邻端的焊接部分和引线接合部分中的任何一个或多个。

公开(公告)号：WO2015012610A1

公开(公告)日：2015-01-29

申请号：PCT/KR2014/006734

申请日：2014-07-24

Applicant: 주식회사 엘지화학

Inventor： 오덕수 ,  강민수

IPC: H01L51/52 ,  H05B33/26

CPC classification number: H01L51/5246 ,  H01L27/3276 ,  H01L51/0097 ,  H01L51/5203 ,  H05K1/028 ,  H05K1/11 ,  H05K1/118 ,  H05K1/14 ,  H05K1/147 ,  H05K1/189 ,  H05K3/32 ,  H05K3/323 ,  H05K3/361 ,  H05K3/363 ,  H05K2201/0397 ,  H05K2201/058 ,  H05K2201/09418 ,  H05K2201/10106 ,  H05K2201/10128 ,  H05K2203/049

Abstract: 본 명세서는 기판 상에 설치된 연성인쇄회로기판의 구조체를 포함하는 유기 발광 소자에 관한 것이다.

Abstract translation: 本说明书涉及一种包括设置在基板上的柔性印刷电路板结构的有机发光元件。