Abstract:
PURPOSE: An in-chamber member temperature control method, an in-chamber member, a substrate mounting table, and a plasma processing apparatus including the same are provided to optimize the temperature of all kinds of members to be used for plasma processing. CONSTITUTION: An in-chamber member temperature control method for a plasma processing apparatus comprises the steps of: preparing power supply units a member in a chamber(1), measuring the resistance or specific resistance of the in-chamber member while supplying power and heating, and controlling the power based on the temperature of the in-chamber member predicted from the resistance or specific resistance.
Abstract:
PURPOSE: A plasma monitoring method and apparatus and a plasma processing apparatus are provided to measure precisely electron density of plasma even under a low electron density or a high pressure condition by using a network analyzer. CONSTITUTION: An antenna probe(52a) is placed at a desired monitoring position inside or near to plasma of a predetermined space. Frequency-variable electromagnetic waves are radiated from the antenna probe to the plasma. The antenna probe receives the electromagnetic waves reflected from the plasma. By measuring a complex reflection coefficient based on the incident and reflected electromagnetic waves using a network analyzer(68), an imaginary part is obtained from the complex reflection coefficient. A resonant frequency capable of nullifying the value of the imaginary part is measured by sweeping frequencies of the electromagnetic waves. The electron density of plasma is calculated based on the measured resonant frequency.
Abstract:
PURPOSE: A plasma processing apparatus is provided to improve the uniformity inside a side of a plasma process in a wide RF frequency domain or wide RF power domain. CONSTITUTION: A plasma processing apparatus includes a process container(10), a lower electrode(12), an upper electrode(38), a process gas supply unit(62), a high frequency feeder, and a conductive high frequency ground unit. A process container vacuum-exhausts. The lower electrode mounts the substrate to be processed inside the process container. The upper electrode is faced in parallel to the lower electrode inside the process container. The process gas supply unit supplies the process gas to a process space between the upper electrode and the lower electrode. The high frequency supply unit applies the high frequency for generating the plasma of the process gas to the lower electrode or the upper electrode by the high frequency discharge. The conductive high frequency ground unit receives the high frequency discharged to the outside of the radius direction in a peripheral part of the electrode to which the high frequency is applied. The conductive high frequency ground unit covers the peripheral part of the electrode to which the high frequency is applied.
Abstract:
A plasma processing apparatus, and the plasma processing method and a storage media are provided to effectively prevent generation of charging damage and to realize stability and reliability of plasma processing. An object to be processed is mounted on a first electrode in a processing chamber(10). A second electrode faces parallel to the first electrode in processing chamber. A processing gas supply unit(62) supplies a processing gas to a processing space between the first and second electrodes. A first radio frequency feeding unit applies the first radio frequency contributing to a plasma generation of the processing gas. A controller(68) controls the first radio frequency feeding unit to alternate the first and second periods. In a first period, the first radio frequency of a first amplitude creates plasma. In a second period, the first radio frequency does not create plasma substantially.