公开(公告)号：WO1997044859A1

公开(公告)日：1997-11-27

申请号：PCT/US1997008783

申请日：1997-05-22

Applicant: TESSERA, INC.

Inventor： TESSERA, INC. ,  FJELSTAD, Joseph ,  DISTEFANO, Thomas, H. ,  KARAVAKIS, Konstantine ,  FARACI, Anthony, B. ,  NGUYEN, Tan

IPC: H01R09/09

CPC classification number: H01L23/32 ,  H01L23/49827 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/45144 ,  H01L2224/73251 ,  H01L2224/81191 ,  H01L2224/81385 ,  H01L2224/81901 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/351 ,  H01R12/52 ,  H05K3/326 ,  H05K3/3436 ,  H05K3/4092 ,  H05K7/1061 ,  H05K2201/0397 ,  H05K2201/049 ,  H05K2201/10257 ,  H05K2201/10378 ,  H05K2203/041 ,  Y02P70/613 ,  Y10T29/49149 ,  H01L2924/00 ,  H01L2224/16 ,  H01L2224/72

Abstract: A connector (10) for microelectronic elements includes a sheetlike body (24) having a plurality of active contacts (22) arranged in a regular grid pattern. The active contacts (22) may include several metallic projections (28) extending inwardly around a hole (27) in the sheetlike element (24), on a first major surface (32). A support structure such as a grid array of noncollapsing structural posts (23) is on a second major surface (33), and each of the posts (23) is electrically connected to one of the active contacts (22). The grid array of the posts (23) and the grid array of active contacts (22) are offset from one another so that an active contact (22) is surrounded by several posts (23). The posts (23) support the sheetlike element (24) spaced away from a substrate (41) to which the posts (23) are attached. A microelectronic element (45) having bump leads (46) thereon may be engaged by contacting the bump leads (46) with the active contacts (22), and deflecting the sheetlike element (24) between the bump leads (46) on one side and the posts (23) on the other side.

Abstract translation: 用于微电子元件的连接器（10）包括具有以规则网格图案布置的多个有源触点（22）的片状体（24）。 活动触头（22）可以包括在第一主表面（32）上在片状元件（24）内围绕孔（27）向内延伸的几个金属突起（28）。 诸如非隔离结构柱（23）的网格阵列之类的支撑结构位于第二主表面（33）上，并且每个柱（23）电连接到一个有源触点（22）。 柱（23）的格栅阵列和活动触点（22）的网格阵列彼此偏移，使得活动触点（22）被多个柱（23）包围。 支柱（23）支撑与柱（23）连接的基板（41）间隔开的片状元件（24）。 在其上具有凸起引线（46）的微电子元件（45）可以通过使凸块引线（46）与有源触头（22）接触而接合，并且使片状元件（24）在一侧的凸块引线（46）之间偏转 和另一侧的柱（23）。

公开(公告)号：WO1996017378A1

公开(公告)日：1996-06-06

申请号：PCT/US1995014909

申请日：1995-11-13

Applicant: FORMFACTOR, INC.

Inventor： FORMFACTOR, INC. ,  KHANDROS, Igor, Y. ,  MATHIEU, Gaetan, L. ,  ELDRIDGE, Benjamin, N. ,  GRUBE, Gary, W.

IPC: H01L21/60

CPC classification number: H05K7/1069 ,  B23K1/0016 ,  B23K20/004 ,  B23K2101/40 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/0466 ,  G01R1/0483 ,  G01R1/06711 ,  G01R1/07314 ,  G01R1/07342 ,  G01R1/07357 ,  G01R1/07371 ,  G01R1/07378 ,  G01R31/2884 ,  G01R31/2886 ,  G01R31/2889 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L21/67138 ,  H01L22/20 ,  H01L23/32 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05166 ,  H01L2224/05599 ,  H01L2224/05647 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/16145 ,  H01L2224/29111 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45111 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/456 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48463 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/48799 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01037 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/0106 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H01R13/2407 ,  H01R13/2464 ,  H05K1/141 ,  H05K3/20 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/368 ,  H05K3/4015 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2924/01013 ,  H01L2924/01026 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/48 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/00012 ,  H01L2924/20751 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/00015 ,  H01L2924/2075

Abstract: Contact structures exhibiting resilience or compliance for a variety of electronic components are formed by bonding a free end of a wire (502) to a substrate (508), configuring the wire (530) into a wire stem (530) having a springable shape, severing the wire stem (530), and overcoating the wire stem (530) with at least one layer of a material (522). In an exemplary embodiment, a free end of a wire stem (530) is bonded to a contact area on a substrate (508), the wire stem (530) is configured to have a springable shape, the wire stem (530) is severed to be free-standing by an electrical discharge, and the free-standing wire stem is overcoated by plating. A variety of materials for the wire stem (530) (which serves as a falsework) and for the overcoat (540) (which serves as a superstructure over the falsework) are disclosed. The resilient contact structures described herein are ideal for making a "temporary" (probe) connections to an electronic component such as a semiconductor die, for burn-in and functional testing.

Abstract translation: 通过将线（502）的自由端接合到基底（508）上而形成表现出针对各种电子元件的弹性或顺应性的接触结构，将线（530）配置成具有弹性形状的线杆（530） 切断线杆（530），以及用至少一层材料（522）覆盖线杆（530）。 在示例性实施例中，线杆（530）的自由端结合到基底（508）上的接触区域，线杆（530）构造成具有弹性形状，线杆（530）被切断 通过放电自由地放置，独立的线杆通过电镀覆盖。 公开了用于线杆（530）（其用作脚手架）和外罩（540）（其用作脚手架上的上部结构）的各种材料。 本文所述的弹性接触结构对于进行诸如半导体管芯的电子部件的“临时”（探针）连接是理想的，用于老化和功能测试。

公开(公告)号：WO1996015551A1

公开(公告)日：1996-05-23

申请号：PCT/US1995014842

申请日：1995-11-13

Applicant: FORMFACTOR, INC.

Inventor： FORMFACTOR, INC. ,  KHANDROS, Igor, Y. ,  MATHIEU, Gaetan, L. ,  ELDRIDGE, Benjamin, N. ,  GRUBE, Gary, W. ,  DOZIER, Thomas, H.

IPC: H01L21/60

CPC classification number: H05K7/1069 ,  B23K1/0016 ,  B23K20/004 ,  B23K2101/40 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/0466 ,  G01R1/0483 ,  G01R1/06711 ,  G01R1/07314 ,  G01R1/07342 ,  G01R1/07357 ,  G01R1/07371 ,  G01R1/07378 ,  G01R31/2884 ,  G01R31/2886 ,  G01R31/2889 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L21/67138 ,  H01L22/20 ,  H01L23/32 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05166 ,  H01L2224/05599 ,  H01L2224/05647 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/16145 ,  H01L2224/29111 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45111 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/456 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48463 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/48799 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01037 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/0106 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H01R13/2407 ,  H01R13/2464 ,  H05K1/141 ,  H05K3/20 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/368 ,  H05K3/4015 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2924/01013 ,  H01L2924/01026 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/48 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/00012 ,  H01L2924/20751 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/00015 ,  H01L2924/2075

Abstract: Resilient contact structures extend from a top surface of a support substrate and solder-ball (or other suitable) contact structures are disposed on a bottom surface of the support substrate. Interconnection elements (110) are used as the resilient contact structures and are disposed atop the support substrate. Selected ones of the resilient contact structures atop the support substrate are connected, via the support substrate, to corresponding ones of the contact structures on the bottom surface of the support substrate. In an embodiment intended to receive an LGA-type semiconductor package (304), pressure contact is made between the resilient contact structures and external connection points of the semiconductor package with a contact force which is generally normal to the top surface of the support substrate (302). In an embodiment intended to receive a BGA-type semiconductor package (404), pressure contact is made between the resilient contact structures and external connection points of the semiconductor package with a contact force which is generally parallel to the top surface of the support substrate (402).

Abstract translation: 弹性接触结构从支撑衬底的顶表面延伸，并且焊球（或其它合适的）接触结构设置在支撑衬底的底表面上。 互连元件（110）用作弹性接触结构，并设置在支撑基板的顶部。 通过支撑衬底将支撑衬底上的弹性接触结构中的选定的一个连接到支撑衬底的底表面上的对应的接触结构。 在旨在接收LGA型半导体封装（304）的实施例中，在弹性接触结构和半导体封装的外部连接点之间以与支撑衬底的顶表面大致垂直的接触力进行压力接触（ 302）。 在旨在接收BGA型半导体封装（404）的实施例中，在弹性接触结构和半导体封装的外部连接点之间形成压力接触，该接触力通常平行于支撑衬底的顶表面 402）。

公开(公告)号：WO1993026144A1

公开(公告)日：1993-12-23

申请号：PCT/CH1993000147

申请日：1993-06-10

Applicant: DYCONEX PATENTE AG ,  SCHMIDT, Walter ,  MARTINELLI, Marco

Inventor： DYCONEX PATENTE AG

IPC: H05K03/40

CPC classification number: H05K3/4084 ,  H05K1/0287 ,  H05K1/0289 ,  H05K1/0393 ,  H05K1/05 ,  H05K1/115 ,  H05K3/0041 ,  H05K3/0061 ,  H05K3/0064 ,  H05K3/0097 ,  H05K3/386 ,  H05K3/427 ,  H05K3/429 ,  H05K3/4652 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/066 ,  H05K2201/0909 ,  H05K2201/09327 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09554 ,  H05K2201/09609 ,  H05K2201/09627 ,  H05K2201/09781 ,  H05K2201/09836 ,  H05K2201/09945 ,  H05K2201/10666 ,  H05K2203/0554 ,  H05K2203/0746 ,  H05K2203/1184 ,  H05K2203/1545 ,  H05K2203/1572

Abstract: The process for producing subsequently contactable contact points between two conductive track planes on a circuit substrate separated by an electrically insulating layer makes it possible to produce, for example, a basic conductor pattern which can subsequently be easily adapted to requirements. By laying windows in the conductive track planes out in such a way that, when the electrically insulating layer is subsequently through-etched due to under-etching, rod-like parts connected to the aperture periphery are revealed between or in the apertures which can be brought into contact with electrically conductive parts of the other conductive track plane, these conductive tracks can be electrically interconnected by mechanical bending.

公开(公告)号：WO1988003356A2

公开(公告)日：1988-05-05

申请号：PCT/US1987002300

申请日：1987-09-09

Applicant: BLACK & DECKER INC.

Inventor： BLACK & DECKER INC. ,  WHEELER, Dale, K.

IPC: H05K03/04

CPC classification number: B29C65/606 ,  B29C65/56 ,  B29C65/567 ,  B29C65/60 ,  B29C66/1122 ,  B29C66/472 ,  B29C66/474 ,  B29C66/8161 ,  B29C66/8322 ,  H01R43/20 ,  H05K1/0284 ,  H05K3/041 ,  H05K3/202 ,  H05K3/306 ,  H05K3/4084 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/091 ,  H05K2201/2072 ,  H05K2203/0108 ,  H05K2203/0195 ,  H05K2203/063 ,  H05K2203/1572 ,  H05K2203/167

Abstract: Method and apparatus (10) for forming power distribution systems or parts thereof during punching operations. A planar member (16) of conductive material is located proximate to a substrate (14) upon which the power distribution system or part thereof is to be formed. A punch (18) is used to form the conductors (12) from the planar member (16) and deposit the conductors (12) on the substrate (14). The action of the punch (18) causes mechanical interference between the conductor (12) and the substrate (14) thereby securing the conductor to the substrate. The power distribution system or part thereof may comprise a terminal assembly, an electric switch, a heat sink of an electronic module, or an electrical circuit board.

Abstract translation: 用于在冲压操作期间形成配电系统或其部件的方法和装置（10）。 导电材料的平面构件（16）位于靠近配电系统或其一部分的衬底（14）附近。 使用冲头（18）从平面构件（16）形成导体（12）并将导体（12）沉积在基底（14）上。 冲头（18）的作用导致导体（12）和基板（14）之间的机械干涉，从而将导体固定到基板上。 配电系统或其一部分可以包括端子组件，电开关，电子模块的散热器或电路板。

公开(公告)号：SE7702461A

公开(公告)日：1977-09-09

申请号：SE7702461

申请日：1977-03-04

Applicant: AMP INC

Inventor： DECELETTE H

IPC: H01R13/00 ,  H02K5/14 ,  H02K5/22 ,  H05K1/00 ,  H05K1/18 ,  H05K3/20 ,  H05K3/28 ,  H05K3/30 ,  H05K3/32 ,  H05K3/38 ,  H05K3/40 ,  H05K7/08 ,  H05K7/00

CPC classification number: H02K5/148 ,  H02K5/143 ,  H02K5/225 ,  H02K2211/03 ,  H05K1/0292 ,  H05K1/0393 ,  H05K3/202 ,  H05K3/281 ,  H05K3/306 ,  H05K3/326 ,  H05K3/386 ,  H05K3/4092 ,  H05K7/08 ,  H05K2201/0397 ,  H05K2201/1059 ,  H05K2201/2072 ,  H05K2203/063 ,  H05K2203/175

公开(公告)号：SE7411734A

公开(公告)日：1975-03-20

申请号：SE7411734

申请日：1974-09-18

Applicant: SIEMENS AG

Inventor： HACKE H-J ,  GRAF R

IPC: H05K3/00 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  H05K3/42 ,  H05K1/12

CPC classification number: H05K3/4084 ,  H05K3/002 ,  H05K3/0044 ,  H05K3/328 ,  H05K3/3447 ,  H05K3/4038 ,  H05K3/427 ,  H05K2201/0305 ,  H05K2201/0397 ,  H05K2203/1184 ,  H05K2203/1572 ,  Y10T29/49167

公开(公告)号：WO2017196537A1

公开(公告)日：2017-11-16

申请号：PCT/US2017/029576

申请日：2017-04-26

Applicant: NORTHROP GRUMMAN SYSTEMS CORPORATION

Inventor： JACKSON, Charles, M. ,  KUNKEE, Elizabeth, T.

IPC: H05K1/14 ,  H05K3/40 ,  H01R12/71 ,  H01R13/24 ,  H01R12/50 ,  H05K1/02 ,  H05K3/18 ,  H05K3/32 ,  H05K3/36 ,  H05K3/46

CPC classification number: H05K1/025 ,  H01R12/523 ,  H01R12/714 ,  H01R13/2407 ,  H05K1/0222 ,  H05K1/0242 ,  H05K1/144 ,  H05K3/184 ,  H05K3/326 ,  H05K3/365 ,  H05K3/4015 ,  H05K3/4092 ,  H05K3/467 ,  H05K3/4679 ,  H05K2201/0311 ,  H05K2201/0397 ,  H05K2201/042 ,  H05K2201/09663 ,  H05K2201/09672 ,  H05K2201/0979 ,  H05K2201/09809 ,  H05K2201/10257 ,  H05K2201/10378

Abstract: A resilient electrical connector assembly (100) includes a base PCB and stacked layers of interconnected resilient conductive structures where each structure has at least two resilient conductive strips (115, 130, 145) and at least two conductive contacts (105, 110, 135, 140, 150, 155, 160, 165). One contact is integrated with a conductive path on the base PCB (105, 110) and another contact pad (160, 165) is positioned to establish a conductive path with a target PCB when the latter is mounted parallel to the base PCB. The resilient conductive strips flex due to a compressive force exerted between the base PCB and target PCB on the stacked layers. The resilient conductive structures are formed by depositing metal to sequentially form each of the stacked layers with one contact being initially formed in engagement with the conductive path on the base PCB.

Abstract translation: 弹性电连接器组件（100）包括基底PCB和堆叠的互连弹性导电结构层，其中每个结构具有至少两个弹性导电条（115,130,145）和至少两个导电 触点（105,110,135,140,​​150,155,160,165）。 一个触点与基底PCB（105,110）上的导电路径集成，并且另一个触点焊盘（160,165）被定位成当目标PCB平行于基底PCB安装时与目标PCB建立导电路径。 弹性导电条由于在基础PCB和目标PCB之间施加在叠置层上的压缩力而弯曲。 弹性导电结构通过沉积金属来顺序地形成每个堆叠层而形成，其中一个触点最初形成为与基底PCB上的导电路径接合。

公开(公告)号：WO2017055685A4

公开(公告)日：2017-06-15

申请号：PCT/FI2016050673

申请日：2016-09-28

Applicant: TACTOTEK OY

Inventor： KERÄNEN ANTTI ,  HEIKKINEN MIKKO ,  RAAPPANA PASI ,  SÄÄSKI JARMO

IPC: H05K5/00 ,  B32B27/08 ,  H01L23/538 ,  H01R12/61 ,  H01R12/77 ,  H05K1/03 ,  H05K1/14 ,  H05K3/28 ,  H05K5/06

CPC classification number: H05K1/189 ,  H05K1/0269 ,  H05K1/028 ,  H05K1/111 ,  H05K1/118 ,  H05K1/16 ,  H05K3/0044 ,  H05K3/12 ,  H05K3/28 ,  H05K3/4092 ,  H05K3/46 ,  H05K2201/0129 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2201/09754 ,  H05K2203/0228 ,  H05K2203/1316

Abstract: A multilayer structure (100) comprises a flexible substrate film (102) having a first side and opposite second side, a number of conductive traces (108), optionally defining contact pads and/or conductors, printed on the first side of the substrate film by printed electronics technology for establishing a desired predetermined circuit design, a plastic layer (104) molded onto the first side of the substrate film (102) so as to enclose the circuit between the plastic layer and the first side of the substrate film (102), and a connector (114) in a form of a flexible flap for providing external electrical connection to the embedded circuit from the second, opposite side of the substrate film (102), the connector being defined by a portion of the substrate film (102) accommodating at least part of one or more of the printed conductive traces (108) and cut partially loose from the surrounding substrate material so as to establish the flap, the loose end of which is bendable away from the molded plastic layer to facilitate the establishment of said electrical connection with external element (118), such as a wire or connector, via the associated gap. A related method of manufacture is presented.

Abstract translation: 多层结构（100）包括柔性衬底膜（102），柔性衬底膜（102）具有第一侧和相对的第二侧，多个导电迹线（108），可选地限定接触焊盘和/或导体，印刷在衬底膜 通过用于建立期望的预定电路设计的印刷电子技术，在基底膜（102）的第一侧上模制塑料层（104），以便在塑料层和基底膜（102）的第一侧之间封装电路 ）以及柔性翼片形式的连接器（114），用于从衬底薄膜（102）的相对的第二侧提供到嵌入电路的外部电连接，连接器由衬底薄膜（102）的一部分 102），其容纳印刷导电迹线（108）中的一个或多个的至少一部分并且从周围的基板材料部分地松开以便建立该翼片，该翼片的松散端可弯曲远离该mo 以便于通过相关间隙建立与外部元件（118）（例如导线或连接器）的所述电连接。 介绍了一种相关的制造方法。

公开(公告)号：WO2016059552A1

公开(公告)日：2016-04-21

申请号：PCT/IB2015/057832

申请日：2015-10-13

Applicant: SPAL AUTOMOTIVE S.R.L.

Inventor： DE FILIPPIS, Pietro

IPC: H05K3/34

CPC classification number: H05K3/3494 ,  H05K3/3405 ,  H05K3/3447 ,  H05K2201/0397 ,  H05K2201/09063 ,  H05K2203/0126 ,  H05K2203/081 ,  H05K2203/163

Abstract: Described is a process for assembling an electronic card (100) comprising at least one conductor track (102) and at least one electronic component (103, 104, 105) of the PTH type having at least one power supply pin (103a, 103b, 104a, 104b, 105a, 105b), comprising a step of soldering the power supply pin (103a, 103b, 104a, 104b, 105a, 105b) on the conductor track (102); the soldering step comprises a step of heating the conductor track (102) using a micro-flame device (6) and a step of dispensing a soldering material using a dispensing device (10); the process comprises a step of monitoring the temperature of the conductor track (102) to check the reaching of a first predetermined temperature value V1 of the conductor track (102) in the soldering zone (106, 107, 108) for dispensing the soldering material when the temperature of the conductor track (102) reaches the first predetermined temperature value V1.

Abstract translation: 描述了一种用于组装电子卡（100）的方法，该电子卡（100）包括至少一个导体轨道（102）和至少一个PTH类型的电子部件（103,104,105），其具有至少一个电源引脚（103a，103b， 104a，104b，105a，105b），包括将电源引脚（103a，103b，104a，104b，105a，105b）焊接在导体轨道（102）上的步骤; 焊接步骤包括使用微火焰装置（6）加热导体轨道（102）的步骤和使用分配装置（10）分配焊接材料的步骤; 该过程包括监测导体轨道（102）的温度以检查在焊接区（106,107,108）中达到导体轨道（102）的第一预定温度值V1以分配焊接材料的步骤 当导体轨道（102）的温度达到第一预定温度值V1时。