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公开(公告)号：CN105829478B
公开(公告)日：2018-05-25
申请号：CN201580002147.7
申请日：2015-11-17
Applicant: 株式会社LG化学
IPC: C09J133/08 , C09J163/04 , C09J161/06
CPC classification number: H01L24/29 , C08L61/12 , C08L63/04 , C08L2201/08 , C08L2201/52 , C08L2203/16 , C08L2203/20 , C08L2205/03 , C09J5/00 , C09J7/21 , C09J7/22 , C09J7/35 , C09J7/38 , C09J133/068 , C09J133/14 , C09J2201/36 , C09J2203/326 , C09J2205/302 , C09J2205/31 , C09J2433/00 , C09J2463/00 , H01L2224/2919 , H01L2924/0635 , H01L2924/066 , H01L2924/0665 , H01L2924/0675
Abstract: 本发明涉及一种用于粘结半导体的粘合剂树脂组合物，其包含：(甲基)丙烯酸酯基树脂，其包含大于17重量％的(甲基)丙烯酸酯基重复单元，所述(甲基)丙烯酸酯基重复单元含有环氧基官能团；环氧树脂，其具有大于70℃的软化点；和酚醛树脂，其具有大于105℃的软化点，其中(甲基)丙烯酸酯基树脂的重量比例为0.48至0.65，相对于(甲基)丙烯酸酯基树脂、环氧树脂和酚醛树脂的总重量计；还涉及一种由树脂组合物获得的用于半导体的粘合剂膜；一种包括粘合剂层的切割模片粘结膜，所述粘合剂层包含用于半导体的粘合剂膜；一种包括切割模片粘结膜的半导体晶片；以及，一种使用切割模片粘结膜切割半导体晶片的方法。
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公开(公告)号：CN105829478A
公开(公告)日：2016-08-03
申请号：CN201580002147.7
申请日：2015-11-17
Applicant: 株式会社LG化学
IPC: C09J133/08 , C09J163/04 , C09J161/06 , C09J7/02
CPC classification number: H01L24/29 , C08L61/12 , C08L63/04 , C08L2201/08 , C08L2201/52 , C08L2203/16 , C08L2203/20 , C08L2205/03 , C09J5/00 , C09J7/21 , C09J7/22 , C09J7/35 , C09J7/38 , C09J133/068 , C09J133/14 , C09J2201/36 , C09J2203/326 , C09J2205/302 , C09J2205/31 , C09J2433/00 , C09J2463/00 , H01L2224/2919 , H01L2924/0635 , H01L2924/066 , H01L2924/0665 , H01L2924/0675 , C09J133/08 , C09J7/255 , C08L61/06
Abstract: 本发明涉及一种用于粘结半导体的粘合剂树脂组合物，其包含：(甲基)丙烯酸酯基树脂，其包含大于17重量％的(甲基)丙烯酸酯基重复单元，所述(甲基)丙烯酸酯基重复单元含有环氧基官能团；环氧树脂，其具有大于70℃的软化点；和酚醛树脂，其具有大于105℃的软化点，其中(甲基)丙烯酸酯基树脂的重量比例为0.48至0.65，相对于(甲基)丙烯酸酯基树脂、环氧树脂和酚醛树脂的总重量计；还涉及一种由树脂组合物获得的用于半导体的粘合剂膜；一种包括粘合剂层的切割模片粘结膜，所述粘合剂层包含用于半导体的粘合剂膜；一种包括切割模片粘结膜的半导体晶片；以及，一种使用切割模片粘结膜切割半导体晶片的方法。
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公开(公告)号：CN105940563A
公开(公告)日：2016-09-14
申请号：CN201580007321.7
申请日：2015-02-03
Applicant: 迪睿合株式会社
IPC: H01R11/01 , B32B27/18 , B32B27/30 , C08J7/04 , C09J4/00 , C09J4/02 , C09J7/00 , C09J9/02 , C09J11/00 , C09J163/00 , C09J201/00 , H01B5/14 , H01B13/00 , H01L21/60 , H01R43/00 , H01B1/00 , H01B1/02 , H01B5/00
CPC classification number: H01L24/29 , B32B27/08 , B32B27/14 , B32B27/18 , B32B27/20 , B32B27/38 , B32B2307/202 , B32B2457/00 , C08F220/18 , C08K2201/001 , C09J4/00 , C09J7/00 , C09J7/10 , C09J9/02 , C09J163/00 , C09J201/00 , C09J2201/36 , C09J2201/602 , C09J2203/326 , C09J2205/102 , C09J2433/00 , C09J2463/00 , H01B1/02 , H01L24/16 , H01L24/27 , H01L24/32 , H01L24/81 , H01L24/83 , H01L2224/16225 , H01L2224/27003 , H01L2224/271 , H01L2224/27848 , H01L2224/29082 , H01L2224/29083 , H01L2224/2919 , H01L2224/2929 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29357 , H01L2224/29364 , H01L2224/2939 , H01L2224/294 , H01L2224/29499 , H01L2224/32225 , H01L2224/73204 , H01L2224/81903 , H01L2224/83101 , H01L2224/83204 , H01L2224/83851 , H01L2224/83856 , H01L2224/83862 , H01L2224/83907 , H01L2924/06 , H01L2924/0635 , H01L2924/0665 , H01L2924/14 , H01L2924/2021 , H01L2924/2064 , H01L2924/3511 , H01R4/04 , H05K3/323 , H01L2924/00014 , H01L2924/07811 , H01L2924/066 , H01L2924/0675 , H01L2924/069 , H01L2924/07025 , H01L2924/061 , H01L2924/00012 , H01L2924/00
Abstract: 各向异性导电膜具有第1连接层和在其一面上形成的第2连接层。第1连接层是光聚合树脂层，第2连接层是热或光阳离子、阴离子或自由基聚合性树脂层。第1连接层的第2连接层一侧表面上，各向异性导电连接用的导电粒子以单层排列。关于第1连接层的固化率，具有比该一面的固化率低的固化率的区域相对于第1连接层的厚度方向倾斜地存在。或者，与第1连接层的该一面的固化率相比，在第1连接层的导电粒子附近区域中与第1连接层的另一面相对近的区域的固化率低。
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公开(公告)号：CN101080812A
公开(公告)日：2007-11-28
申请号：CN200580042988.7
申请日：2005-12-14
Applicant: 松下电器产业株式会社
CPC classification number: H05K3/323 , H01L21/6835 , H01L23/49838 , H01L24/06 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L2224/03612 , H01L2224/0401 , H01L2224/05554 , H01L2224/06131 , H01L2224/06135 , H01L2224/11001 , H01L2224/11003 , H01L2224/1141 , H01L2224/11502 , H01L2224/11522 , H01L2224/13099 , H01L2224/13111 , H01L2224/13113 , H01L2224/13116 , H01L2224/16058 , H01L2224/16225 , H01L2224/16227 , H01L2224/165 , H01L2224/2741 , H01L2224/27436 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/29291 , H01L2224/293 , H01L2224/29311 , H01L2224/29313 , H01L2224/29316 , H01L2224/73204 , H01L2224/8121 , H01L2224/81815 , H01L2224/83097 , H01L2224/83192 , H01L2224/832 , H01L2224/83856 , H01L2224/83862 , H01L2224/8388 , H01L2224/83886 , H01L2224/83887 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01011 , H01L2924/01013 , H01L2924/01023 , H01L2924/01027 , H01L2924/01033 , H01L2924/0105 , H01L2924/01051 , H01L2924/01056 , H01L2924/01061 , H01L2924/01065 , H01L2924/01073 , H01L2924/01078 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/0665 , H01L2924/14 , H01L2924/15311 , H01L2924/1579 , H01L2924/381 , H01L2924/3841 , H05K3/3436 , H05K2201/10674 , H05K2201/10977 , H05K2203/083 , H05K2203/087 , Y02P70/613 , H01L2924/00011 , H01L2924/066 , H01L2924/06 , H01L2924/0695 , H01L2924/062 , H01L2924/0615 , H01L2924/068 , H01L2924/0705 , H01L2924/0675 , H01L2924/07001 , H01L2924/0103 , H01L2924/01047 , H01L2924/01029 , H01L2924/01083 , H01L2924/00015 , H01L2924/00 , H01L2924/00014
Abstract: 一种倒装芯片安装用树脂组成物，可以适用于新一代LSI的倒装芯片安装，适宜进行高生产性及高可靠性的倒装芯片安装，该树脂组成物含有对流添加剂(12)，树脂(13)被加热时，该对流添加剂(12)沸腾。树脂(13)被加热时，金属微粒在树脂中熔融，并且沸腾的对流添加剂(12)在树脂中产生对流。对被供给到电路板(10)和半导体芯片(20)的树脂(13)进行加热，在树脂(13)中熔融的金属微粒，通过在电路板(10)和半导体芯片(20)的端子(11、21)之间自组装，形成对端子间进行电性连接的连接体22，之后，通过使树脂(13)固化，并使半导体芯片(20)固定在电路板(10)上，从而获得倒装芯片安装体。
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公开(公告)号：CN101506948B
公开(公告)日：2012-12-12
申请号：CN200680055616.2
申请日：2006-09-12
Applicant: 日东电工株式会社
IPC: H01L21/301 , H01L21/52
CPC classification number: H01L24/83 , C09J7/20 , C09J2201/36 , C09J2201/606 , C09J2201/61 , C09J2203/326 , C09J2205/31 , C09J2433/00 , H01L21/67132 , H01L21/6835 , H01L21/6836 , H01L21/78 , H01L23/3142 , H01L24/27 , H01L24/29 , H01L24/48 , H01L24/85 , H01L2221/68327 , H01L2221/68336 , H01L2224/274 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/29324 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29386 , H01L2224/29393 , H01L2224/48 , H01L2224/83191 , H01L2224/83855 , H01L2224/8388 , H01L2224/85 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01016 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01055 , H01L2924/01073 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , H01L2924/3025 , Y10T428/26 , H01L2924/0675 , H01L2924/0635 , H01L2924/066 , H01L2924/00 , H01L2924/3512 , H01L2924/05432 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
Abstract: 本发明的切割/芯片焊接膜是在支撑基材上依次层压有粘合剂层和芯片胶粘用胶粘剂层的切割/芯片焊接膜，其特征在于，上述粘合剂层的厚度为10～80μm，23℃下的储藏弹性率为1×104～1×1010Pa。
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Patent Agency Ranking
公开(公告)号：CN101080812B
公开(公告)日：2010-11-17
申请号：CN200580042988.7
申请日：2005-12-14
Applicant: 松下电器产业株式会社
CPC classification number: H05K3/323 , H01L21/6835 , H01L23/49838 , H01L24/06 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L2224/03612 , H01L2224/0401 , H01L2224/05554 , H01L2224/06131 , H01L2224/06135 , H01L2224/11001 , H01L2224/11003 , H01L2224/1141 , H01L2224/11502 , H01L2224/11522 , H01L2224/13099 , H01L2224/13111 , H01L2224/13113 , H01L2224/13116 , H01L2224/16058 , H01L2224/16225 , H01L2224/16227 , H01L2224/165 , H01L2224/2741 , H01L2224/27436 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/29291 , H01L2224/293 , H01L2224/29311 , H01L2224/29313 , H01L2224/29316 , H01L2224/73204 , H01L2224/8121 , H01L2224/81815 , H01L2224/83097 , H01L2224/83192 , H01L2224/832 , H01L2224/83856 , H01L2224/83862 , H01L2224/8388 , H01L2224/83886 , H01L2224/83887 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01011 , H01L2924/01013 , H01L2924/01023 , H01L2924/01027 , H01L2924/01033 , H01L2924/0105 , H01L2924/01051 , H01L2924/01056 , H01L2924/01061 , H01L2924/01065 , H01L2924/01073 , H01L2924/01078 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/0665 , H01L2924/14 , H01L2924/15311 , H01L2924/1579 , H01L2924/381 , H01L2924/3841 , H05K3/3436 , H05K2201/10674 , H05K2201/10977 , H05K2203/083 , H05K2203/087 , Y02P70/613 , H01L2924/00011 , H01L2924/066 , H01L2924/06 , H01L2924/0695 , H01L2924/062 , H01L2924/0615 , H01L2924/068 , H01L2924/0705 , H01L2924/0675 , H01L2924/07001 , H01L2924/0103 , H01L2924/01047 , H01L2924/01029 , H01L2924/01083 , H01L2924/00015 , H01L2924/00 , H01L2924/00014
Abstract: 一种倒装芯片安装用树脂组成物，可以适用于新一代LSI的倒装芯片安装，适宜进行高生产性及高可靠性的倒装芯片安装，该树脂组成物含有对流添加剂(12)，树脂(13)被加热时，该对流添加剂(12)沸腾。树脂(13)被加热时，金属微粒在树脂中熔融，并且沸腾的对流添加剂(12)在树脂中产生对流。对被供给到电路板(10)和半导体芯片(20)的树脂(13)进行加热，在树脂(13)中熔融的金属微粒，通过在电路板(10)和半导体芯片(20)的端子(11、21)之间自组装，形成对端子间进行电性连接的连接体22，之后，通过使使树脂(13)固化，并使半导体芯片(20)固定在电路板(10)上，从而获得倒装芯片安装体。
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公开(公告)号：CN1284526A
公开(公告)日：2001-02-21
申请号：CN00126285.8
申请日：2000-08-15
Applicant: 国家淀粉及化学投资控股公司
CPC classification number: H01L24/83 , C09J7/255 , C09J2463/00 , C09J2467/006 , H01L24/29 , H01L2224/29 , H01L2224/2919 , H01L2224/2929 , H01L2224/29386 , H01L2224/8319 , H01L2224/83856 , H01L2224/83885 , H01L2924/00013 , H01L2924/01004 , H01L2924/01006 , H01L2924/01023 , H01L2924/01033 , H01L2924/01045 , H01L2924/01082 , H01L2924/0665 , H01L2924/07802 , H01L2924/15787 , H01L2924/0675 , H01L2924/00 , H01L2924/05442 , H01L2924/00014 , H01L2924/05341 , H01L2924/05432 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
Abstract: 一种薄膜粘合剂使用疏水的聚合物载体来代替常规的聚酰亚胺载体,用以实现高防潮性,同时保持其它的粘着特性。用于电子封装。
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公开(公告)号：CN107771354A
公开(公告)日：2018-03-06
申请号：CN201680018886.X
申请日：2016-03-31
Applicant: 爱法组装材料公司
IPC: H01L23/488 , H01L23/29 , H01L21/60 , H01L21/48 , B23K1/00 , B23K1/20 , B23K35/02 , B23K35/36 , C08K3/00 , C08K3/04 , C08K5/00 , C08K5/092 , C08K5/18 , C08K5/49 , C08K7/02 , C08L63/00 , C08L83/04
CPC classification number: C08K3/04 , B23K1/0016 , B23K1/20 , B23K35/00 , B23K35/0244 , B23K35/025 , B23K35/3602 , B23K2101/42 , C08K3/013 , C08K3/042 , C08K5/00 , C08K7/02 , H01L23/295 , H01L23/296 , H01L24/11 , H01L24/13 , H01L24/27 , H01L24/29 , H01L24/81 , H01L24/83 , H01L2224/1131 , H01L2224/11312 , H01L2224/1132 , H01L2224/1141 , H01L2224/11418 , H01L2224/11422 , H01L2224/1301 , H01L2224/131 , H01L2224/13111 , H01L2224/13144 , H01L2224/1329 , H01L2224/133 , H01L2224/13311 , H01L2224/13339 , H01L2224/13344 , H01L2224/13347 , H01L2224/13386 , H01L2224/13387 , H01L2224/13393 , H01L2224/13439 , H01L2224/13444 , H01L2224/13447 , H01L2224/13486 , H01L2224/13487 , H01L2224/1349 , H01L2224/13499 , H01L2224/2731 , H01L2224/27312 , H01L2224/2732 , H01L2224/2741 , H01L2224/27418 , H01L2224/27422 , H01L2224/27436 , H01L2224/27602 , H01L2224/2929 , H01L2224/29294 , H01L2224/293 , H01L2224/29311 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29386 , H01L2224/29387 , H01L2224/2939 , H01L2224/29393 , H01L2224/29439 , H01L2224/29444 , H01L2224/29447 , H01L2224/29486 , H01L2224/29487 , H01L2224/2949 , H01L2224/29499 , H01L2224/73204 , H01L2224/8184 , H01L2224/81856 , H01L2224/81862 , H01L2224/81874 , H01L2224/8321 , H01L2224/83851 , H01L2224/83856 , H01L2224/83862 , H01L2224/83874 , H01L2924/12041 , H01L2924/3841 , C08L63/00 , C08L83/04 , C08K5/092 , C08K5/18 , C08K5/49 , C08L2205/025 , H01L2924/014 , H01L2924/00014 , H01L2924/0105 , H01L2924/01047 , H01L2924/01029 , H01L2924/01006 , H01L2924/00012 , H01L2924/05341 , H01L2924/07001 , H01L2924/0715 , H01L2924/0675 , H01L2924/0665 , H01L2924/06 , H01L2924/01079 , H01L2924/053 , H01L2924/01102 , H01L2924/01103 , H01L2924/01109 , H01L2924/01009 , H01L2924/0503 , H01L2924/01005 , H01L2924/066 , H01L2924/0635 , H01L2924/061 , H01L2924/05432 , H01L2924/04642 , H01L2924/05032 , H01L2924/05442 , H01L2924/0542 , H01L2924/0103 , C08K3/00
Abstract: 一种用于电子组装方法的组合物，该组合物包含分散在有机介质中的填料，其中：该有机介质包含聚合物；该填料包含石墨烯、官能化石墨烯、氧化石墨烯、多面体低聚倍半硅氧烷、石墨、二维材料、氧化铝、氧化锌、氮化铝、氮化硼、银、纳米纤维、碳纤维、金刚石、碳纳米管、二氧化硅和金属涂布的颗粒中的一种或多种，并且，基于组合物的总重量，该组合物包含0.001～40重量％的填料。
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公开(公告)号：CN104263266A
公开(公告)日：2015-01-07
申请号：CN201410415678.6
申请日：2011-10-09
Applicant: 第一毛织株式会社
IPC: C09J7/02 , C09J133/00 , C09J163/02 , C09J163/04 , C09J163/00 , H01L21/60
CPC classification number: C09J7/0217 , B32B7/06 , B32B27/08 , B32B2255/10 , B32B2255/26 , B32B2255/28 , B32B2307/30 , B32B2405/00 , C08G18/6254 , C08G59/08 , C08G2170/40 , C08L2312/08 , C09J7/22 , C09J7/385 , C09J163/00 , C09J175/04 , C09J2201/606 , C09J2203/326 , C09J2433/00 , C09J2463/00 , H01L21/6836 , H01L24/29 , H01L24/83 , H01L2221/68318 , H01L2221/68327 , H01L2221/6834 , H01L2221/68377 , H01L2224/29084 , H01L2224/2919 , H01L2224/2929 , H01L2224/29388 , H01L2224/32145 , H01L2224/83191 , H01L2224/94 , H01L2924/00013 , H01L2924/061 , H01L2924/0615 , H01L2924/0635 , H01L2924/0665 , H01L2924/0675 , H01L2924/068 , H01L2924/07025 , H01L2924/0705 , Y10T428/28 , Y10T428/31515 , H01L2224/27 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2924/3512 , H01L2924/00
Abstract: 本发明提供了一种用于半导体装置的粘合剂膜，所述粘合剂膜包括在0℃至5℃下具有50μm/m·℃至150μm/m·℃的线性膨胀系数的基膜。所述粘合剂膜在低温储存较长时间后具有优异的卷绕形状稳定性，从而在以后的半导体封装工艺中不会导致倾斜现象并降低缺陷。
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公开(公告)号：CN101156236B
公开(公告)日：2011-11-16
申请号：CN200680011434.5
申请日：2006-03-16
Applicant: 松下电器产业株式会社
CPC classification number: H01L24/16 , H01L21/4853 , H01L21/563 , H01L21/6835 , H01L24/11 , H01L24/13 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/83 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/11001 , H01L2224/11003 , H01L2224/1141 , H01L2224/11502 , H01L2224/11522 , H01L2224/13022 , H01L2224/13099 , H01L2224/13105 , H01L2224/13109 , H01L2224/13111 , H01L2224/13113 , H01L2224/13116 , H01L2224/16225 , H01L2224/16227 , H01L2224/165 , H01L2224/2741 , H01L2224/27436 , H01L2224/29101 , H01L2224/29109 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/29291 , H01L2224/29299 , H01L2224/29305 , H01L2224/29309 , H01L2224/29311 , H01L2224/29313 , H01L2224/29316 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2224/83192 , H01L2224/832 , H01L2224/83856 , H01L2224/83862 , H01L2224/83874 , H01L2224/8388 , H01L2224/83885 , H01L2224/83886 , H01L2224/83887 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/0102 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/0105 , H01L2924/01056 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/0134 , H01L2924/014 , H01L2924/0665 , H01L2924/12042 , H01L2924/14 , H01L2924/1579 , H01L2924/381 , H01L2924/3841 , H05K3/323 , H05K3/3436 , H05K3/3484 , H05K2201/10977 , H05K2203/0264 , H05K2203/087 , H05K2203/1178 , Y02P70/613 , H01L2924/01031 , H01L2924/01049 , H01L2924/01051 , H01L2924/01083 , H01L2924/00011 , H01L2924/00015 , H01L2924/066 , H01L2924/06 , H01L2924/0675 , H01L2924/0695 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
Abstract: 在第1电子元件(2)上载置含有焊料粉(5a)和树脂(4)的焊料树脂组合物(6)，第1电子元件(2)的连接端子(3)和第2电子元件(8)的电极端子(7)相对置地配置，加热第1电子元件(2)和焊料树脂组合物以使从包含在第1电子元件(2)中的气体发生源(1)喷出气体，通过使气体(9a)在焊料树脂组合物(6)中对流，从而使焊料粉(5a)在焊料树脂组合物(6)中流动，使其自己集合在连接端子(3)及电极端子(7)上，从而使连接端子(3)及电极端子(7)电连接。由此，提供一种能够将以窄节距布线的半导体芯片的电极端子和电路基板的连接端子高连接可靠性地连接的倒装片安装方法、以及用于安装在电路基板上的凸块形成方法。
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