公开(公告)号：DE60138161D1

公开(公告)日：2009-05-14

申请号：DE60138161

申请日：2001-02-15

Applicant: IBM

Inventor： CHAN KEVIN K ,  SHI LEATHEN ,  ZIEGLER JAMES F ,  JHANES CHRISTOPHER ,  SPEIDEL JAMES L

IPC: H03H9/05 ,  B81B3/00 ,  B81B7/00 ,  B81C1/00 ,  H03D7/00 ,  H03D9/06 ,  H03H3/007 ,  H03H9/10 ,  H03H9/24 ,  H03H9/46 ,  H04B1/26

Abstract: Communication signal mixing and filtering systems and methods utilizing an encapsulated micro electro-mechanical system (MEMS) device. Furthermore, disclosed is a method of fabricating a simple, unitarily constructed micro electro-mechanical system (MEMS) device which combines the steps of signal mixing and filtering, and which is smaller, less expensive and more reliable in construction and operation than existing devices currently employed in the technology.

公开(公告)号：HK1041678A1

公开(公告)日：2002-07-19

申请号：HK02103371

申请日：2002-05-03

Applicant: IBM

Inventor： CHAN KEVIN K ,  JHANES CHRISTOPHER ,  SHI LEATHEN ,  SPEIDELL JAMES L ,  ZIEGLER JAMES F

IPC: B81B3/00 ,  B81B7/00 ,  B81C1/00 ,  H03D7/00 ,  H03H3/007 ,  H03H9/10 ,  H03H9/24 ,  H03H9/46 ,  H04B1/26 ,  B81B ,  H01P

Abstract: Communication signal mixing and filtering systems and methods utilizing an encapsulated micro electro-mechanical system (MEMS) device. Furthermore, disclosed is a method of fabricating a simple, unitarily constructed micro electro-mechanical system (MEMS) device which combines the steps of signal mixing and filtering, and which is smaller, less expensive and more reliable in construction and operation than existing devices currently employed in the technology.

公开(公告)号：CA2344737A1

公开(公告)日：2001-12-19

申请号：CA2344737

申请日：2001-04-20

Applicant: IBM

Inventor： SPEIDELL JAMES L ,  ZIEGLER JAMES F ,  CHAN KEVIN K ,  SHI LEATHEN ,  JAHNES CHRISTOPHER

IPC: B81B3/00 ,  B81B7/00 ,  B81C1/00 ,  H03D7/00 ,  H03H3/007 ,  H03H9/10 ,  H03H9/24 ,  H03H9/46 ,  H04B1/26 ,  H03H11/34 ,  H03H9/02

Abstract: Communication signal mixing and filtering systems and methods utilizing an encapsulated micro electro- mechanical system (MEMS) device. Furthermore, disclosed is a method of fabricating a simple, unitarily constructed micro electro-mechanical system (MEMS) devic e which combines the steps of signal mixing and filtering, and which is smaller, less expensi ve and more reliable in construction and operation than existing devices currently employed in the technology.

公开(公告)号：GB2509683B

公开(公告)日：2015-07-29

申请号：GB201408711

申请日：2012-08-03

Applicant: IBM

Inventor： COONEY EDWARD C ,  DUNN JAMES S ,  MARTIN DALE W ,  MUSANTE CHARLES F ,  RAINEY BETH-ANN ,  SHI LEATHEN ,  SPROGIS EDMUND J ,  TSANG CORNELIA K

IPC: H01L23/522 ,  H01L21/768 ,  H01L23/528

公开(公告)号：DE69633998T2

公开(公告)日：2005-12-22

申请号：DE69633998

申请日：1996-09-04

Applicant: IBM

Inventor： CIPOLLA THOMAS M ,  COLGAN EVAN ,  MELCHER ROBERT L ,  MOK LAWRENCE S ,  NARAYAN CHANDRASEKHAR ,  SHI LEATHEN ,  YANG KEI-HSIUNG

IPC: G02F1/13 ,  G02F1/133 ,  G02F1/1333 ,  G02F1/136 ,  G09F9/00 ,  H04N5/74 ,  G02F1/1335 ,  H04N9/31

Abstract: A liquid crystal element, a packaging structure providing thermal and alignment control, a display device including the same, and methods of fabrication and assembly are provided. The liquid crystal element includes: a semiconductor wafer, having microcircuitry and an array of reflective pixels; a layer of electro-optical responsive liquid crystal medium, of uniform thickness, disposed on the reflective pixels; a transparent conductive layer positioned on the liquid crystal, being substantially parallel to the reflective layers, to ensure a uniform thickness of the liquid crystal; and an insulative transparent layer provided on the conductive layer. The liquid crystal element is laminated to an optically flat substrate to limit the out-of-plane distortions thereof. The structure formed by element and substrate are disposed in a substrate holder which is mounted to a wiring board, and coupled to voltage sources for actuating the liquid crystal. During mounting, an aligning fixture is used to ensure proper orientation of the element relative to the related optical elements. Once the element is positioned, a heat sink is coupled to the rear surface of the substrate holder to dissipate heat.

公开(公告)号：IE79088B1

公开(公告)日：1998-04-08

申请号：IE960846

申请日：1996-12-02

Applicant: IBM

Inventor： ANDRICACOS PANAYOTIS CONSTANTI ,  DATTA MADAV ,  DELIGIANNI HARIKLIA ,  HORKANS WILMA JEAN ,  KANG SUNG KWON ,  KWIETNIAK KEITH THOMAS ,  MATHAD GANGADHARA SWAMI ,  PURUSHOTHAMAN SAMPATH ,  SHI LEATHEN ,  TONG HO-MING

IPC: B23K35/26 ,  B23K35/00 ,  B32B15/01 ,  C22C13/00 ,  C22C13/02 ,  H01L21/60 ,  H01L23/485 ,  H01L23/488

Abstract: An interconnection structure suitable for the connection of microelectronic circuit chips to packages is provided by this invention. In particular, the invention pertains to the area-array or flip-chip technology often called C4 (controlled collapse chip connection). The structure comprises an adhesion/barrier layer deposited on a passivated substrate (e.g., a silicon wafer), optionally an additional adhesion layer, a solderable layer of a metal selected from the group consisting of Ni, Co, Fe, NiFe, NiCo, CoFe and NiCoFe on the adhesion/barrier layer, and a lead-free solder ball comprising tin as the predominate component and one or more alloying elements selected from Bi, Ag, and Sb, and further optionally including one or more elements selected from the group consisting of Zn, In, Ni, Co and Cu.

公开(公告)号：DE69105793T2

公开(公告)日：1995-06-29

申请号：DE69105793

申请日：1991-02-06

Applicant: IBM

Inventor： HUANG WU-SONG ,  KHANDROS IGOR YAN ,  SARAF RAVI ,  SHI LEATHEN

IPC: B23K35/22 ,  B23K35/26 ,  B23K35/36 ,  B23K35/363 ,  B23K101/36 ,  C08K3/08 ,  H05K3/32 ,  H05K3/34

Abstract: An improved solder/polymer fluxless composite paste interconnection material having a low reflow temperature to form electrical contacts having good bonding strength and low contact resistance. The present pastes comprise a major proportion of a meltable metal alloy powder filler, free of noble metals and preferably free of lead, a minor proportion of a solution of a temperature-stable thermoplastic polymer having a softening temperature above the melting temperature of the metal powder filler in a volatile solvent which evaporates during reflow, and a minor proportion of a fluxing agent having a boiling point lower than the reflow temperature of the composition and higher than the melting point of the eutectic alloy powder filler. An oxide-free, partially coalesced metal alloy connection is obtained, which is polymer strengthened and reworkable at a low reflow temperature, per se, or in the presence of polymer solvent.

公开(公告)号：GB2509683A

公开(公告)日：2014-07-09

申请号：GB201408711

申请日：2012-08-03

Applicant: IBM

Inventor： COONEY EDWARD C ,  DUNN JAMES S ,  MARTIN DALE W ,  MUSANTE CHARLES F ,  RAINEY BETH-ANN ,  SHI LEATHEN ,  SPROGIS EDMUND J ,  TSANG CORNELIA K

IPC: H01L23/522 ,  H01L21/768 ,  H01L23/528

Abstract: Methods for bonding substrate surfaces, bonded substrate assemblies, and design structures for a bonded substrate assembly. Device structures (18, 19, 20, 21) of a product chip (25) are formed using a first surface (15) of a device substrate (10). A wiring layer (26) of an interconnect structure for the device structures is formed on the product chip. The wiring layer is planarized. A temporary handle wafer (52) is removably bonded to the planarized wiring layer. In response to removably bonding the temporary handle wafer to the planarized first wiring layer, a second surface (54) of the device substrate, which is opposite to the first surface, is bonded to a final handle substrate (56). The temporary handle wafer is then removed from the assembly.

公开(公告)号：CA2344737C

公开(公告)日：2005-07-19

申请号：CA2344737

申请日：2001-04-20

Applicant: IBM

Inventor： SHI LEATHEN ,  JAHNES CHRISTOPHER ,  SPEIDELL JAMES L ,  ZIEGLER JAMES F ,  CHAN KEVIN K

IPC: B81B3/00 ,  B81B7/00 ,  B81C1/00 ,  H03D7/00 ,  H03H3/007 ,  H03H9/10 ,  H03H9/24 ,  H03H9/46 ,  H04B1/26 ,  H03H11/34 ,  H03H9/02

Abstract: Communication signal mixing and filtering systems and methods utilizing an encapsulated micro electro- mechanical system (MEMS) device. Furthermore, disclosed is a method of fabricating a simple, unitarily constructed micro electro-mechanical system (MEMS) devic e which combines the steps of signal mixing and filtering, and which is smaller, less expensi ve and more reliable in construction and operation than existing devices currently employed in the technology.

公开(公告)号：AU2002361847A1

公开(公告)日：2004-07-22

申请号：AU2002361847

申请日：2002-12-20

Applicant: IBM

Inventor： WANG LI-KONG ,  HSU LOUIS L ,  SHI LEATHEN

IPC: H01L21/336 ,  H01L21/86 ,  H01L27/12 ,  H01L29/786 ,  H01L23/14 ,  H01L29/12