公开(公告)号：SG32442A1

公开(公告)日：1996-08-13

申请号：SG1995001055

申请日：1995-08-04

Applicant: IBM

Inventor： MOK LAWRENCE S ,  PURUSHOTHAMAN SAMPATH ,  WILCZYNSKI JANUSZ S ,  SAMMAKIA BAHGAT G ,  WU TIEN Y

IPC: H01L23/34

公开(公告)号：MY128103A

公开(公告)日：2007-01-31

申请号：MYPI9802016

申请日：1998-05-06

Applicant: IBM

Inventor： KAN SUNG KWON ,  PURUSHOTHAMAN SAMPATH ,  RAI RAJINDER SINGH

IPC: H01B1/22 ,  B23K1/20 ,  B23K35/24 ,  H01L21/60

Abstract: WHAT IS DESCRIBED IS NEW ELECTRODEPOSITED POWDER MATERIALS TO BE USED FOR THE ELECTRICALLY CONDUCTIVE PASTE FORMULATIONS, IN SEVERAL TYPES OF THEIR STRUCTURES AS FOLLOWS: ELECTRODEPOSITED POWDER CONSISTING OF SN(UNDERCOAT)/CU(DENDRITE)/SN(BARRIER)/IN(OVERCOAT.THE SN (BARRIER) LAYER CAN BE REPLACED BY ONE OF THE FOLLOWING METALS AND THEIR ALLOYS; Sn, Ni, Co, Cr, Fe, AND Pd.THE UNDERCOAT SN LAYER CAN BE REPLACED BY ONE OF THE FOLLOWING METALS AND THEIR ALLOYS; Sn IN, Zn, Sb, Bi AND Ag. ELECTRODEPOSITED POWDER CONSISTING OF Sn (UNDERCOAT)/CU(DENDRITE)/Bi-Sn (OVERCOAT).WHAT IS ADDITIONALLY CLAIMED IS THE USAGE OF THIS ELECTRODEPOSITED POWDER MATERIALS TO MAKE FILLED POLYMER PASTES FOR MAKING CONDUCTING LINES, GROUND PLANES, AND VIA FILLS IN THE CONVENTIONAL PRINTED CIRCUIT BOARDS BY REPLACING EITHER THE ADDITIVE OR SUBTRACTIVE CU TECHNOLOGY. THIS WILL FACILITATE THE ELIMINATION OF PROCESS STEPS AND CHEMICALS THUS REDUCING COST AND THE ENVIRONMENTAL IMPACT ASSOCIATED WITH PRINTED CIRCUIT BOARD MANUFACTURING. IT IS ALSO CLAIMED THAT THE PASTE CAN BE USED TO ATTACH ELECTRONIC COMPONENTS SUCH AS CHIPS AND CHIP CARRIER TAPES TO SUBSTRATES SUCH AS CHIP CARRIERS THAT PANEL DISPLAY GLASS AND PRINTED WIRING BOARDS.(FIG. 5)

公开(公告)号：MY118121A

公开(公告)日：2004-09-30

申请号：MYPI9502913

申请日：1995-09-29

Applicant: IBM

Inventor： KANG SUNG K ,  GRAHAM TERESITA O ,  PURUSHOTHAMAN SAMPATH ,  ROLDAN JUDITH MARIE ,  SARAF RAVI F

IPC: C08K9/02 ,  H05K3/32 ,  B22F1/00 ,  B22F1/02 ,  B22F7/08 ,  C08L101/00 ,  C09D5/24 ,  C09J9/02 ,  C09J11/00 ,  C09J11/02 ,  C09J11/04 ,  C09J101/02 ,  C09J183/08 ,  C09J191/00 ,  C09J197/00 ,  C09J201/00 ,  C23C24/08 ,  H01B1/00 ,  H01B1/22 ,  H01L21/60 ,  H01L23/498 ,  H01R4/04 ,  H05K1/18

Abstract: A STRUCTURE AND METHOD OF FABRICATION ARE DESCRIBED. THE STRUCTURE (30) IS A COMBINATION OF A POLYMERIC MATERIAL (36) AND PARTICLES (32), E.G. CU, HAYING AN ELECTRICALLY CONDUCTIYE COATING (34), E.G. SN. HEAT IS APPLIED TO FUSE THE COATING OF ADJACENT PARTICLES. THE POLYMERIC MATERIAL IS A THERMOPLASTIC. THE STRUCTURE IS DISPOSED BETWEEN TWO ELECTRICALLY CONDUCTIYE SURFACES (40, 42), E.G. CHIP AND SUBSTRATE PADS, TO PROYIDE ELECTRICAL INTERCONNECTION AND ADHESION BETWEEN THEIR PADS. (FIGURE 3)

公开(公告)号：CA2089791C

公开(公告)日：1998-11-24

申请号：CA2089791

申请日：1993-02-18

Applicant: IBM

Inventor： BRADY MICHAEL J ,  MARINO JEFFREY R ,  FARRELL CURTIS E ,  KANG SUNG K ,  PURUSHOTHAMAN SAMPATH ,  MIKALSEN DONALD J ,  MOSKOWITZ PAUL A ,  O'SULLIVAN EUGENE J ,  O'TOOLE TERRENCE R ,  RIELEY SHELDON C ,  WALKER GEORGE F

IPC: H01L21/60 ,  C23C18/50 ,  C25D3/54 ,  H01L21/288 ,  H01L21/603 ,  H01L21/768 ,  H01L23/495 ,  H01L23/498 ,  H01L23/532

Abstract: Silicon and germanium containing materials are used as a surface of conductors i n electronic devices. Solder can be fluxlessly bonded and wires can be wire bonded to these s urfaces. These materials are used as a surface coating for lead frames for packaging inte grated circuit chips. These materials can be decal transferred onto conductor surfaces or elect rolessly or electrolytically disposed thereon.

公开(公告)号：DE69304503T2

公开(公告)日：1997-03-20

申请号：DE69304503

申请日：1993-12-13

Applicant: IBM

Inventor： BAILEY FREDERIC DENIS ,  BUCHANAN DOUGLAS ANDREW ,  CALLEGARI ALESSANDRO CESARE ,  CLEARFIELD HOWARD MARC ,  DOANY FUAD ELIAS ,  FLAGELLO DONIS GEORGE ,  HOVEL HAROLD JOHN ,  LATULIPE DOUGLAS CHARLES ,  LUSTIG NAFTALI ELIAHU ,  POMERENE ANDREW THOMAS STEWART ,  PURUSHOTHAMAN SAMPATH ,  SCHERPEREEL CHRISTOPHER MICHAE ,  SEEGER DAVID EARLE ,  SHAW JANE MARGARET

IPC: G03F1/08 ,  C01B31/06 ,  C08J7/06 ,  C23C8/26 ,  C23C8/50 ,  C23C16/26 ,  C23C16/27 ,  C23C16/50 ,  C30B29/04 ,  G02B1/10 ,  G11B5/255 ,  H01L21/31 ,  H01L21/314

Abstract: The present invention relates to an improved method of depositing a diamond-like carbon film onto a substrate by low temperature plasma-enhanced chemical vapor deposition (PECVD) from a hydrocarbon/helium plasma. More specifically, the diamond-like carbon films of the present invention are deposited onto the substrate by employing acetylene which is heavily diluted with helium as the plasma gas. The films formed using the process of the present invention are characterized as being amorphous and having dielectric strengths comparable to those normally observed for diamond films. More importantly, however is that the films produced herein are thermally stable, optically transparent, absorbent in the ultraviolet range and hard thus making them extremely desirable for a wide variety of applications.

公开(公告)号：DE68925375T2

公开(公告)日：1996-07-11

申请号：DE68925375

申请日：1989-02-28

Applicant: IBM

Inventor： AGARWALA BIRENDRA NATH ,  BECKHAM KEITH FOWLER ,  COOPER-JOSELOW ALICE HAVEN ,  NARAYAN CHANDRASEKHAR ,  PURUSHOTHAMAN SAMPATH ,  RAY SUDIPTA KUMAR

IPC: H01L21/60 ,  H01L23/498 ,  H01L23/532 ,  H05K3/24 ,  H01L23/48 ,  H01L23/52

公开(公告)号：DE68925375D1

公开(公告)日：1996-02-22

申请号：DE68925375

申请日：1989-02-28

Applicant: IBM

Inventor： AGARWALA BIRENDRA NATH ,  BECKHAM KEITH FOWLER ,  COOPER-JOSELOW ALICE HAVEN ,  NARAYAN CHANDRASEKHAR ,  PURUSHOTHAMAN SAMPATH ,  RAY SUDIPTA KUMAR

IPC: H01L21/60 ,  H01L23/498 ,  H01L23/532 ,  H05K3/24 ,  H01L23/48 ,  H01L23/52

公开(公告)号：BR9301497A

公开(公告)日：1993-10-26

申请号：BR9301497

申请日：1993-04-12

Applicant: IBM

Inventor： BRADY MICHAEL J ,  FARREL CURTIS E ,  KANG SUNG K ,  MARINO JEFFREY R ,  MIKALSEN DONALD J ,  MOSKOWITZ PAUL A ,  O'SULLIVAN EUGENE J ,  TOOLE TERRENCE R O ,  PURUSHOTHAMAN SAMPATH ,  RIELEY SHELDON C ,  WALKER GEORGE F

IPC: H01L21/60 ,  C23C18/50 ,  C25D3/54 ,  H01L21/288 ,  H01L21/603 ,  H01L21/768 ,  H01L23/495 ,  H01L23/498 ,  H01L23/532 ,  H01L21/40

Abstract: Silicon and germanium containing materials are used at surface of conductors in electronic devices. Solder can be fluxlessly bonded and wires can be wire bonded to these surfaces. These material are used as a surface coating for lead frames for packaging integrated circuit chips. These materials can be decal transferred onto conductor surfaces or electrolessly or electrolytically disposed thereon.

公开(公告)号：CA2089791A1

公开(公告)日：1993-10-25

申请号：CA2089791

申请日：1993-02-18

Applicant: IBM

Inventor： BRADY MICHAEL J ,  FARRELL CURTIS E ,  KANG SUNG K ,  MARINO JEFFREY R ,  MIKALSEN DONALD J ,  MOSKOWITZ PAUL A ,  O'SULLIVAN EUGENE J ,  O'TOOLE TERRENCE R ,  PURUSHOTHAMAN SAMPATH ,  RIELEY SHELDON C ,  WALKER GEORGE F

IPC: H01L21/60 ,  C23C18/50 ,  C25D3/54 ,  H01L21/288 ,  H01L21/603 ,  H01L21/768 ,  H01L23/495 ,  H01L23/498 ,  H01L23/532

Abstract: Silicon and germanium containing materials are used at surface of conductors in electronic devices. Solder can be fluxlessly bonded and wires can be wire bonded to these surfaces. These material are used as a surface coating for lead frames for packaging integrated circuit chips. These materials can be decal transferred onto conductor surfaces or electrolessly or electrolytically disposed thereon.

公开(公告)号：DE60232871D1

公开(公告)日：2009-08-20

申请号：DE60232871

申请日：2002-04-30

Applicant: IBM

Inventor： GATES STEPHEN MCCONNELL ,  MURRAY CHRISTOPHER B ,  NITTA SATYANARAYANA V ,  PURUSHOTHAMAN SAMPATH

IPC: H01L21/316 ,  H01L21/312 ,  H01L21/768 ,  H01L23/522 ,  H01L23/532