Abstract:
A measurement method capable of easily measuring the directions of detector segments of a segmented detector relative to a scanning transmission electron microscope (STEM) image is provided. The measurement method is for use in an electron microscope equipped with the segmented detector having a detection surface divided into the detector segments. The measurement method is used to measure the directions of the detector segments relative to the STEM image. The method involves defocusing the STEM image to thereby cause a deviation of the STEM image and measuring the directions of the detector segments relative to the STEM image from the direction of the deviation of the STEM image (step S11).
Abstract:
A structure analysis method using a scanning electron microscope includes irradiating a sample with an electron beam having a first landing energy to obtain a first image at a first depth of the sample and accelerating the electron beam to have a second landing energy higher than the first landing energy to obtain a second image at a second depth of the sample.
Abstract:
There is provided a charged particle system capable of measuring deflection fields in a sample without using a segmented detector. The charged particle system (100) has: illumination optics (104) for illuminating the sample with charged particles; an imaging deflector system (112) disposed behind an objective lens (110) and operative to deflect the charged particles; a detector (116) having a detection surface (115) and operative to detect the charged particles incident thereon, imaging optics (114) disposed behind the imaging deflector system (112) and operative to focus the charged particles as diffraction discs (2) onto the detection surface (115); a storage unit (120) for storing intensity information detected by the detector (116); and a controller (130) for controlling the imaging deflector system (112). The controller (130) controls the imaging deflector system (112) to cause the charged particles passing through a given position of particle impingement on the sample to be deflected under successively different sets of deflection conditions and to bring the diffraction discs (2) into focus onto successively different regions of the detection surface (115). The storage unit (120) stores the intensity information for each set of the deflection conditions.
Abstract:
Described are various embodiments of methods and systems for tracing circuitry on integrated circuits using focused ion beam based imaging techniques. In one such embodiment, a method is provide for identifying functional componentry associated with a switchable power interface on an integrated circuit, wherein the switchable power interface comprises a source and a drain with a control switch therebetween, said control switch being controllable by a control signal during operation of the integrated circuit. The method comprises connecting, with deposited conductive material, the source and the drain; applying an external voltage bias to a power input of the switchable power interface via one of the source and the drain; exposing the integrated circuit to a focused ion beam; and gathering an image of the integrated circuit during exposure to determine areas of high contrast indicating functional componentry in operative connection with the switchable power interface.
Abstract:
An ion beam device according to the present invention includes a gas field ion source (1) including an emitter tip (21) supported by an emitter base mount (64), a ionization chamber (15) including an extraction electrode (24) and being configured to surround the emitter tip (21), and a gas supply tube (25). A center axis line of the extraction electrode (24) overlaps or is parallel to a center axis line (14A) of the ion irradiation light system, and a center axis line (66) passing the emitter tip (21) and the emitter base mount (64) is inclinable with respect to a center axis line of the ionization chamber (15). Accordingly, an ion beam device including a gas field ion source capable of adjusting the direction of the emitter tip is provided.
Abstract:
The present invention relates to a defect inspection apparatus based on the fact that contrasts of a grain and a void of a semiconductor copper interconnect in a scanning electron microscope are changed depending on electron beam irradiation accelerating voltages. A charged particle beam apparatus of the present invention irradiates the same portion of a specimen with electron beams at a plurality of accelerating voltages, and differentiates a grain (65, 66) from a void (67) on the basis of a contrast change amount of the same portion in a plurality of images (61, 62) acquired so as to respectively correspond to the plurality of accelerating voltages. Consequently, it is possible to automatically detect a grain and a void in a differentiation manner at a high speed without destructing a specimen.
Abstract:
The present invention relates to a defect inspection apparatus based on the fact that contrasts of a grain and a void of a semiconductor copper interconnect in a scanning electron microscope are changed depending on electron beam irradiation accelerating voltages. A charged particle beam apparatus of the present invention irradiates the same portion of a specimen with electron beams at a plurality of accelerating voltages, and differentiates a grain (65, 66) from a void (67) on the basis of a contrast change amount of the same portion in a plurality of images (61, 62) acquired so as to respectively correspond to the plurality of accelerating voltages. Consequently, it is possible to automatically detect a grain and a void in a differentiation manner at a high speed without destructing a specimen.
Abstract:
The present invention provides means and corresponding embodiments to control charge-up in an electron beam apparatus, which can eliminate the positive charges soon after being generated on the sample surface within a frame cycle of imaging scanning. The means are to let some or all of secondary electrons emitted from the sample surface return back to neutralize positive charges built up thereon so as to reach a charge balance within a limited time period. The embodiments use control electrodes to generate retarding fields to reflect some of secondary electrons with low kinetic energies back to the sample surface.
Abstract:
SMS probe imaging systems, methods of use thereof, and the like are disclosed. Embodiments of the present disclosure can use direct interrogation of objects (e.g., cells or tissue) within a small pool/droplet of liquid, optional thermal, mechanical, electrical, optical and chemical manipulation, followed immediately by liquid sampling, optional sample conditioning, and soft ionization of biomolecules.
Abstract:
In a method for imaging a solid state substrate, a vapor is condensed to an amorphous solid water condensate layer on a surface of a solid state substrate. Then an image of at least a portion of the substrate surface is produced by scanning an electron beam along the substrate surface through the water condensate layer. The water condensate layer integrity is maintained during electron beam scanning to prevent electron-beam contamination from reaching the substrate during electron beam scanning. Then one or more regions of the layer can be locally removed by directing an electron beam at the regions. A material layer can be deposited on top of the water condensate layer and any substrate surface exposed at the one or more regions, and the water condensate layer and regions of the material layer on top of the layer can be removed, leaving a patterned material layer on the substrate.