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    14.
    发明专利
    未知

    公开(公告)号：DE69324439D1

    公开(公告)日：1999-05-20

    申请号：DE69324439

    申请日：1993-10-29

    Applicant: IBM

    Inventor： BREYTA GREGORY ,  CLECAK NICHOLAS JEFFRIES ,  HINSBERG III WILLIAM DINAN ,  HOFER DONALD CLIFFORD ,  ITO HIROSHI ,  MACDONALD SCOTT ARTHUR ,  SOORIJAKUMARAN RATMAN

    IPC: G03F1/08 ,  G03F7/004 ,  G03F7/039 ,  G03F7/16 ,  G03F7/38 ,  H01L21/027 ,  H01L21/47

    Abstract: A lithographic imaging process is provided for use in the manufacture of integrated circuits. A substrate is coated with a polymeric film comprising a vinyl polymer, a photosensitive acid generator, and acid labile groups. It is then heated to typically just above the glass transition temperature of the polymer, but below the cleavage temperature of the acid labile groups. The film is then expose imagewise to radiation to generate free acid, and the film is once more heated, again to typically just above the glass transition temperature of the polymer, but below the cleavage temperature of the acid labile groups. Finally the image is developed. The process provides protection to the photoresist film from airborne chemical contaminants.

    16.
    发明专利
    未知

    公开(公告)号：DE69118442D1

    公开(公告)日：1996-05-09

    申请号：DE69118442

    申请日：1991-05-15

    Applicant: IBM

    Inventor： GOLDBERG MARTIN J ,  ITO HIROSHI ,  KOVAC CAROLINE A ,  PALMER MICHAEL J ,  POLLAK ROGER A ,  POORE PAIGE A

    IPC: B23K1/00 ,  B23K35/22 ,  B23K35/34 ,  B23K101/40 ,  H05K3/10 ,  H05K3/34

    Abstract: A chemical solder is described that includes an organometallic which thermally degrades within a predetermined temperature range to a metal and volatile compounds. The solder also includes a polymeric matrix that decomposes within the same temperature range to volatile fractions, thereby leaving only the metal. A method for bonding first and second bodies is disclosed wherein a chemical solder, as above-described, is disposed between the first and second bodies and heat is applied to elevate the solder to the predetermined temperature range to thermally degrade the organometallic compound and to decompose the polymeric matrix. The remaining metal bonds the first and second bodies.

    17.
    发明专利
    未知

    公开(公告)号：DE69010817T2

    公开(公告)日：1995-03-16

    申请号：DE69010817

    申请日：1990-08-30

    Applicant: IBM

    Inventor： ITO HIROSHI

    IPC: G03F7/029 ,  C08L61/04 ,  G03F7/004 ,  G03F7/038 ,  H01L21/027

    Abstract: An aqueous base developable negative resist composition comprising a phenolic resin, a radio-chemical acid generator and a small molecule which upon irradication and postbake reacts with the phenolic resin to decrease its rate of dissolution.

    18.
    发明专利
    未知

    公开(公告)号：DE69010817D1

    公开(公告)日：1994-08-25

    申请号：DE69010817

    申请日：1990-08-30

    Applicant: IBM

    Inventor： ITO HIROSHI

    IPC: G03F7/029 ,  C08L61/04 ,  G03F7/004 ,  G03F7/038 ,  H01L21/027

    Abstract: An aqueous base developable negative resist composition comprising a phenolic resin, a radio-chemical acid generator and a small molecule which upon irradication and postbake reacts with the phenolic resin to decrease its rate of dissolution.

    19.
    发明专利
    未知

    公开(公告)号：DE3667553D1

    公开(公告)日：1990-01-18

    申请号：DE3667553

    申请日：1986-01-24

    Applicant: IBM

    Inventor： HULT ANDERS ,  ITO HIROSHI ,  MACDONALD SCOTT ARTHUR ,  WILLSON CARLTON GRANT

    IPC: H01L21/30 ,  G03F7/20 ,  G03F7/26 ,  G03F7/38 ,  H01L21/027 ,  H01L21/302 ,  H01L21/3065 ,  G03C1/68 ,  G03F7/10

    Abstract: Negative relief images are generated by a process comprising the use of cationic polymerization and plasma etching. The process comprises a process for generating a negative tone resist image comprising the steps of:(1) coating a substrate with a film that contains a cationic photoinitiator;(2) exposing the film in an imagewise fashion to radiation and thereby generating cationic initiator in the exposed regions of the film;(3) treating the exposed film with a cationic-sensitive monomer to form a film of polymer resistant to plasma etching; and(4) developing the resist image by etching with a plasma.

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