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公开(公告)号：CN108735698A
公开(公告)日：2018-11-02
申请号：CN201810261605.4
申请日：2018-03-27
Applicant: 株式会社村田制作所
IPC: H01L23/485 , H01L27/06 , H01L21/60
CPC classification number: H03F1/52 , H01L21/0217 , H01L21/02271 , H01L21/02546 , H01L21/0262 , H01L21/0274 , H01L21/2654 , H01L21/28575 , H01L21/30612 , H01L21/31116 , H01L21/31144 , H01L21/32134 , H01L21/76895 , H01L21/76898 , H01L23/291 , H01L23/3121 , H01L23/3171 , H01L23/481 , H01L23/5383 , H01L23/5386 , H01L24/03 , H01L24/05 , H01L24/48 , H01L24/85 , H01L25/16 , H01L27/0248 , H01L27/0605 , H01L27/0635 , H01L27/0652 , H01L29/045 , H01L29/0642 , H01L29/0657 , H01L29/0804 , H01L29/0821 , H01L29/1004 , H01L29/205 , H01L29/207 , H01L29/36 , H01L29/41708 , H01L29/42304 , H01L29/452 , H01L29/66204 , H01L29/66318 , H01L29/7371 , H01L29/861 , H01L2224/0221 , H01L2224/0345 , H01L2224/03462 , H01L2224/03464 , H01L2224/0362 , H01L2224/04042 , H01L2224/05025 , H01L2224/05084 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/0518 , H01L2224/05573 , H01L2224/05644 , H01L2224/45144 , H01L2224/48106 , H01L2224/48227 , H01L2224/48463 , H01L2224/85203 , H01L2224/85205 , H01L2924/10329 , H01L2924/10337 , H01L2924/13051 , H01L2924/13063 , H01L2924/13064 , H01L2924/19041 , H01L2924/19043 , H03F3/195 , H03F3/213 , H03F2200/222 , H03F2200/387 , H03F2200/426 , H03F2200/444
Abstract: 本发明提供一种在使用了包含化合物半导体的基板的半导体装置中，能够抑制芯片面积的增大的半导体装置。在包含化合物半导体的基板上形成电路元件。在电路元件上，接合焊盘被配置为与电路元件至少局部重叠。接合焊盘包含第1金属膜以及形成于第1金属膜上的第2金属膜。第2金属膜的金属材料比第1金属膜的金属材料硬。
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公开(公告)号：CN107768351A
公开(公告)日：2018-03-06
申请号：CN201710587367.1
申请日：2017-07-18
Applicant: 台湾积体电路制造股份有限公司
IPC: H01L25/065 , H01L23/31 , H01L23/48 , H01L21/50 , H01L21/56
CPC classification number: H01L25/0657 , H01L23/3738 , H01L23/5389 , H01L24/19 , H01L24/20 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/92 , H01L24/97 , H01L25/0652 , H01L25/105 , H01L25/50 , H01L2224/04105 , H01L2224/12105 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/73267 , H01L2224/92244 , H01L2224/97 , H01L2225/0651 , H01L2225/06548 , H01L2225/06568 , H01L2225/06589 , H01L2225/1035 , H01L2225/1041 , H01L2225/1058 , H01L2225/1094 , H01L2924/10252 , H01L2924/10253 , H01L2924/10271 , H01L2924/10329 , H01L2924/1033 , H01L2924/10337 , H01L2924/14 , H01L2924/1421 , H01L2924/1431 , H01L2924/1432 , H01L2924/14335 , H01L2924/1434 , H01L2924/1436 , H01L2924/15311 , H01L2924/181 , H01L2924/3511 , H01L2924/00012 , H01L2924/00014 , H01L2224/83 , H01L21/50 , H01L21/56 , H01L23/3157 , H01L23/481 , H01L24/02 , H01L2224/0237
Abstract: 在一些实施例中，器件包括热机电(TEM)芯片，具有功能电路；第一管芯，附接至所述TEM芯片的第一侧面；第一通孔，位于所述TEM芯片的第一侧面上并且邻近所述第一管芯，所述第一通孔电连接至所述TEM芯片。所述器件还包括第一模制层，围绕所述TEM芯片、所述第一管芯和所述第一通孔，其中，所述第一管芯的上表面和所述第一通孔的上表面与所述第一模制层的上表面平齐。所述器件还包括第一再分布层，位于所述第一模制层的上表面上方并且电连接至所述第一通孔和所述第一管芯。本发明还提供了具有热机电芯片的半导体封装件及其形成方法。
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公开(公告)号：CN102403292A
公开(公告)日：2012-04-04
申请号：CN201110275191.9
申请日：2011-09-16
Applicant: 英飞凌科技股份有限公司
IPC: H01L23/488 , B32B15/04
CPC classification number: H01L24/32 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/83 , H01L2224/0345 , H01L2224/03452 , H01L2224/05082 , H01L2224/05083 , H01L2224/05124 , H01L2224/05147 , H01L2224/05155 , H01L2224/0516 , H01L2224/05164 , H01L2224/05166 , H01L2224/0517 , H01L2224/05171 , H01L2224/05172 , H01L2224/05179 , H01L2224/0518 , H01L2224/05181 , H01L2224/05184 , H01L2224/05611 , H01L2224/05639 , H01L2224/05644 , H01L2224/06181 , H01L2224/29082 , H01L2224/32227 , H01L2224/83805 , H01L2924/01013 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/0104 , H01L2924/01041 , H01L2924/01042 , H01L2924/01047 , H01L2924/0105 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01079 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/10335 , H01L2924/10337 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/1431 , H01L2924/1434 , H01L2924/00
Abstract: 本发明涉及叠层和集成电路装置。在各个实施例中，提供了一种叠层。该叠层可以包括：载体；设置在载体上方的第一金属；设置在第一金属上方的第二金属；以及设置在第二金属之上的焊料材料，或者提供到由外部源供应的焊料的接触的材料。第二金属可以具有至少1800℃的熔化温度并且在焊接工艺期间和在焊接工艺之后中的至少一个中不溶解到或者基本上不溶解到焊料材料中。
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公开(公告)号：CN106548996A
公开(公告)日：2017-03-29
申请号：CN201610609240.0
申请日：2016-07-29
Applicant: 台湾积体电路制造股份有限公司
IPC: H01L23/485 , H01L23/48
CPC classification number: H01L23/49838 , H01L23/3171 , H01L23/3192 , H01L23/498 , H01L23/49827 , H01L23/522 , H01L23/528 , H01L23/5329 , H01L23/585 , H01L24/05 , H01L24/11 , H01L24/13 , H01L2224/0401 , H01L2224/05572 , H01L2224/05666 , H01L2224/05681 , H01L2224/11849 , H01L2224/13082 , H01L2224/131 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/94 , H01L2924/10252 , H01L2924/10253 , H01L2924/10271 , H01L2924/1032 , H01L2924/10336 , H01L2924/10337 , H01L2924/10338 , H01L2924/10339 , H01L2924/10342 , H01L2924/10351 , H01L2924/14 , H01L2924/3512 , H01L2924/014 , H01L2924/00014 , H01L2224/03 , H01L2224/11 , H01L23/485 , H01L23/48
Abstract: 本发明涉及一种结构，包括：金属焊盘、具有覆盖金属焊盘的边缘部分的部分的钝化层和在钝化层上方的伪金属板。伪金属板中具有多个贯穿开口。伪金属板具有锯齿形边缘。介电层具有在伪金属板上面的第一部分、填充多个第一贯穿开口的第二部分和接触第一锯齿形边缘的第三部分。本发明的实施例还涉及具有锯齿形边缘的伪金属。
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Patent Agency Ranking
公开(公告)号：CN104425483A
公开(公告)日：2015-03-18
申请号：CN201410425941.X
申请日：2014-08-26
Applicant: 英飞凌科技股份有限公司
CPC classification number: H01L27/0248 , H01L21/288 , H01L21/7685 , H01L21/78 , H01L21/784 , H01L23/4827 , H01L23/495 , H01L23/522 , H01L23/544 , H01L23/562 , H01L24/05 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/83 , H01L24/94 , H01L24/98 , H01L2223/5446 , H01L2224/04026 , H01L2224/05082 , H01L2224/05124 , H01L2224/05166 , H01L2224/05647 , H01L2224/0569 , H01L2224/2746 , H01L2224/2747 , H01L2224/291 , H01L2224/29111 , H01L2224/29118 , H01L2224/29139 , H01L2224/29144 , H01L2224/29147 , H01L2224/29155 , H01L2224/2916 , H01L2224/29164 , H01L2224/29166 , H01L2224/2919 , H01L2224/32245 , H01L2224/48247 , H01L2224/94 , H01L2924/00014 , H01L2924/01022 , H01L2924/01026 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01079 , H01L2924/10252 , H01L2924/10253 , H01L2924/10272 , H01L2924/1032 , H01L2924/10329 , H01L2924/10335 , H01L2924/10337 , H01L2924/1037 , H01L2924/12042 , H01L2924/1431 , H01L2224/27 , H01L2924/0781 , H01L2924/014 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
Abstract: 本发明公开了用于制造半导体器件的方法和半导体器件。根据各种实施例，一种用于制造半导体器件的方法可以包括：提供半导体工件，该半导体工件包括在半导体工件的第一侧的器件区域，其中半导体工件的机械稳定性不足以在不损坏的情况下经受至少一个后端工艺，并且在半导体工件的与半导体工件的第一侧相对的第二侧之上沉积至少一个传导层，其中至少一个传导层增加半导体工件的机械稳定性以足以在不损坏的情况下经受至少一个后端工艺。
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公开(公告)号：CN105849873A
公开(公告)日：2016-08-10
申请号：CN201480070604.1
申请日：2014-12-17
Applicant: 株式会社村田制作所
IPC: H01L21/331 , H01L21/3205 , H01L21/60 , H01L21/768 , H01L23/522 , H01L29/737
CPC classification number: H01L24/13 , H01L24/02 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/16 , H01L29/0692 , H01L29/0817 , H01L29/20 , H01L29/205 , H01L29/41708 , H01L29/66234 , H01L29/66242 , H01L29/66272 , H01L29/6631 , H01L29/66318 , H01L29/732 , H01L29/737 , H01L29/7371 , H01L29/7375 , H01L29/7378 , H01L2224/02331 , H01L2224/0235 , H01L2224/02372 , H01L2224/02373 , H01L2224/0239 , H01L2224/024 , H01L2224/03912 , H01L2224/0401 , H01L2224/05022 , H01L2224/05024 , H01L2224/05147 , H01L2224/05166 , H01L2224/05558 , H01L2224/05559 , H01L2224/05569 , H01L2224/05572 , H01L2224/05666 , H01L2224/1134 , H01L2224/13013 , H01L2224/13022 , H01L2224/13024 , H01L2224/13026 , H01L2224/13083 , H01L2224/131 , H01L2224/13111 , H01L2224/13147 , H01L2224/13155 , H01L2224/13563 , H01L2224/13611 , H01L2224/16225 , H01L2224/16227 , H01L2224/16235 , H01L2924/00012 , H01L2924/01029 , H01L2924/07025 , H01L2924/10329 , H01L2924/10337 , H01L2924/10338 , H01L2924/13051 , H01L2924/13055 , H01L2924/1423 , H01L2924/351 , H01L2924/01079 , H01L2924/00014 , H01L2924/014
Abstract: 本发明涉及半导体装置。在具备双极晶体管BT的半导体装置中，柱状凸点(20)和与发射极层(5)电连接的第二布线(14)接触的第三开口(16)从与发射极层(5)的正上对应的位置向发射极层(5)的长边方向偏移，第三开口(16)相对于发射极层(5)，被配置成发射极层(5)的长边方向的端部与第三开口(16)的开口端几乎一致。
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公开(公告)号：CN102983113B
公开(公告)日：2016-06-08
申请号：CN201210320807.4
申请日：2012-08-31
Applicant: 台湾积体电路制造股份有限公司
IPC: H01L23/488 , H05K3/34
CPC classification number: H02M3/158 , H01L23/5226 , H01L24/05 , H01L24/29 , H01L24/45 , H01L24/48 , H01L25/16 , H01L28/10 , H01L28/40 , H01L2224/05025 , H01L2224/05124 , H01L2224/05147 , H01L2224/05155 , H01L2224/05157 , H01L2224/05166 , H01L2224/05181 , H01L2224/05184 , H01L2224/29025 , H01L2224/2919 , H01L2224/32265 , H01L2224/4502 , H01L2224/45111 , H01L2224/45116 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48265 , H01L2924/00014 , H01L2924/01047 , H01L2924/0479 , H01L2924/048 , H01L2924/04941 , H01L2924/04953 , H01L2924/10252 , H01L2924/10253 , H01L2924/10271 , H01L2924/10272 , H01L2924/10329 , H01L2924/10331 , H01L2924/10332 , H01L2924/10333 , H01L2924/10335 , H01L2924/10337 , H01L2924/10339 , H01L2924/10342 , H01L2924/10351 , H01L2924/1205 , H01L2924/1206 , H01L2924/1207 , H01L2924/14252 , H01L2924/1427 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19104 , H05K1/111 , H05K1/181 , H05K1/185 , H05K2201/10015 , H05K2201/10022 , H05K2201/1003 , H05K2201/10166 , Y02P70/611 , H01L2224/45099 , H01L2924/00
Abstract: 一种封装系统包括设置在衬底上方的至少一个有源电路。钝化结构设置在所述至少一个有源电路上方。钝化结构具有至少一个开口，所述至少一个开口被配置成暴露至少一个第一电焊盘。至少一个无源电部件设置在钝化结构上方。至少一个无源电部件与至少一个第一电焊盘电耦合。本发明还提供了包括无源电部件的封装系统。
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公开(公告)号：CN102983113A
公开(公告)日：2013-03-20
申请号：CN201210320807.4
申请日：2012-08-31
Applicant: 台湾积体电路制造股份有限公司
IPC: H01L23/488 , H05K3/34
CPC classification number: H02M3/158 , H01L23/5226 , H01L24/05 , H01L24/29 , H01L24/45 , H01L24/48 , H01L25/16 , H01L28/10 , H01L28/40 , H01L2224/05025 , H01L2224/05124 , H01L2224/05147 , H01L2224/05155 , H01L2224/05157 , H01L2224/05166 , H01L2224/05181 , H01L2224/05184 , H01L2224/29025 , H01L2224/2919 , H01L2224/32265 , H01L2224/4502 , H01L2224/45111 , H01L2224/45116 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48265 , H01L2924/00014 , H01L2924/01047 , H01L2924/0479 , H01L2924/048 , H01L2924/04941 , H01L2924/04953 , H01L2924/10252 , H01L2924/10253 , H01L2924/10271 , H01L2924/10272 , H01L2924/10329 , H01L2924/10331 , H01L2924/10332 , H01L2924/10333 , H01L2924/10335 , H01L2924/10337 , H01L2924/10339 , H01L2924/10342 , H01L2924/10351 , H01L2924/1205 , H01L2924/1206 , H01L2924/1207 , H01L2924/14252 , H01L2924/1427 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19104 , H05K1/111 , H05K1/181 , H05K1/185 , H05K2201/10015 , H05K2201/10022 , H05K2201/1003 , H05K2201/10166 , Y02P70/611 , H01L2224/45099 , H01L2924/00
Abstract: 一种封装系统包括设置在衬底上方的至少一个有源电路。钝化结构设置在所述至少一个有源电路上方。钝化结构具有至少一个开口，所述至少一个开口被配置成暴露至少一个第一电焊盘。至少一个无源电部件设置在钝化结构上方。至少一个无源电部件与至少一个第一电焊盘电耦合。本发明还提供了包括无源电部件的封装系统。
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公开(公告)号：CN1771608A
公开(公告)日：2006-05-10
申请号：CN200380110283.5
申请日：2003-10-24
Applicant: 京半导体股份有限公司
Inventor： 中田仗祐
CPC classification number: H01L25/0753 , F21K9/00 , H01L24/45 , H01L24/85 , H01L31/02008 , H01L31/035281 , H01L31/0508 , H01L31/068 , H01L31/1804 , H01L33/20 , H01L33/24 , H01L33/38 , H01L33/62 , H01L2224/45015 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/4516 , H01L2224/45565 , H01L2224/45644 , H01L2924/00011 , H01L2924/00014 , H01L2924/01006 , H01L2924/01015 , H01L2924/01047 , H01L2924/01322 , H01L2924/10252 , H01L2924/10328 , H01L2924/10329 , H01L2924/10335 , H01L2924/10337 , H01L2924/10338 , H01L2924/10346 , H01L2924/12036 , H01L2924/12041 , H01L2924/12043 , Y02E10/547 , Y02P70/521 , H01L2924/00 , H01L2224/45147 , H01L2924/01014 , H01L2924/01032 , H01L2924/0105 , H01L2224/48 , H01L2924/0002 , H01L2924/2076 , H01L2924/2075 , H01L2924/00015 , H01L2924/01028 , H01L2924/013 , H01L2924/00013 , H01L2924/01004 , H01L2924/01049
Abstract: 本发明涉及具有呈矩阵状配置的多个的球状元件的受光或发光模块板。本发明的目的在于只用合格的球状元件构成受光或发光模块板，提高光电转换效率。受光模块板(1)具备呈矩阵状配置的多个的太阳能电池元件(2)、网状构件(3)、密封构件(4)。各太阳能电池元件(2)具备球面状的pn结(13)、连接pn结(13)的两极的、在隔着太阳能电池元件(2)的中心相对向的位置形成的正负电极(14、15)。网状构件(3)具有将各列的多个的太阳能电池元件(2)通电并联的平行配置的多条的导电线(20、21)和在太阳能电池元件(2)的行与行之间与导电线(20、21)垂直地配置、为了固定多条的导电线(20、21)而织成网状的绝缘性的张力线材(22)。
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